Abstract: A detector assembly positionable to receive X-rays from an X-ray source within an imaging system is provided. The detector assembly includes multiple detector elements. The detector assembly also includes a temperature regulation system including multiple temperature regulation devices, wherein each temperature regulation device of the multiple temperature regulation devices is associated with a respective detector element of the multiple detector elements, and each temperature regulation device is configured to independently maintain a consistent temperature across a portion of a respective detector element.

Abstract: A detector assembly positionable to receive X-rays from an X-ray source within an imaging system is provided. The detector assembly includes multiple detector elements. The detector assembly also includes a temperature regulation system including multiple temperature regulation devices, wherein each temperature regulation device of the multiple temperature regulation devices is associated with a respective detector element of the multiple detector elements, and each temperature regulation device is configured to independently maintain a consistent temperature across a portion of a respective detector element.

Abstract: An imager panel for an x-ray detector for obtaining x-ray images of an object is provided that includes a first portion disposed at the center of the hybrid imager panel that can produce images of a first resolution and a second portion disposed at least partially around the first portion that is capable of producing images of a second resolution. The hybrid imager panel provides a hybrid detector that can be selectively operated to obtain images of varying resolutions corresponding to the first resolution from the first portion, the second resolution from the second portion or a combination thereof.

Abstract: Various approaches are discussed for using four-side buttable CMOS tiles to fabricate detector panels, including large-area detector panels. Fabrication may utilize pads and interconnect structures formed on the top or bottom of the CMOS tiles. Electrical connection and readout may utilize readout and digitization circuitry provided on the CMOS tiles themselves such that readout of groups or sub-arrays of pixels occurs at the tile level, while tiles are then readout at the detector level such that readout operations are tiered or multi-level.

Abstract: A digital X-ray detector is provided. The digital X-ray detector includes a polymeric substrate. The digital X-ray detector also include a detector array configured to generate image data based on incident X-ray radiation disposed on the polymeric substrate, wherein the polymeric substrate extends beyond an edge of the detector array. The digital X-ray detector further includes scan electronics and readout electronics configured to acquire image data from the detector array, wherein the scan electronics, the readout electronics, or both the scan electronics and the readout electronics are directly disposed on the polymeric substrate.

Abstract: A digital X-ray detector is provided. The detector includes a detector array configured to generate image data based on incident X-ray radiation. The detector also includes a housing in which the detector array is disposed. The detector is configured to be inductively charged and the detector lacks any external electrical connector.

Abstract: An imager panel for an x-ray detector for obtaining x-ray images of an object is provided that includes a first portion disposed at the center of the hybrid imager panel that can produce images of a first resolution and a second portion disposed at least partially around the first portion that is capable of producing images of a second resolution. The hybrid imager panel provides a hybrid detector that can be selectively operated to obtain images of varying resolutions corresponding to the first resolution from the first portion, the second resolution from the second portion or a combination thereof.

Abstract: Various approaches are discussed for using four-side buttable CMOS tiles to fabricate detector panels, including large-area detector panels. Fabrication may utilize pads and interconnect structures formed on the top or bottom of the CMOS tiles. Electrical connection and readout may utilize readout and digitization circuitry provided on the CMOS tiles themselves such that readout of groups or sub-arrays of pixels occurs at the tile level, while tiles are then readout at the detector level such that readout operations are tiered or multi-level.

Abstract: An x-ray image detector includes a light image sensor having a depth, a front side comprising a sensing surface, and a back side. The x-ray image detector further includes a substrate plate on the back side and surrounding the depth of the light image sensor such that the substrate plate forms a lip around the light image sensor. The lip is level with the front side of the light image sensor. The x-ray image detector further includes a scintillator over the sensing surface of the light image sensor and at least a portion of the lip.

Abstract: Fabrication and use of an X-ray detector scan interface having separate enable and reset lines for each line (e.g., row) of pixels is described. In certain implementations, the respective enable and reset lines are connected such that activation of an enable line for a given line of pixels is concurrent with activation of a reset line for a different (e.g., preceding) row of pixels. In this manner, readout of one row of pixels is performed in conjunction with resetting the row of pixels readout in the preceding operation. In another technical implementation, a non-rectangular detector is divided into quadrants, with alternating quadrants configured for scan module or data module operations such that no quadrant has overlapping scan and data interconnections at the connection finger regions.

Abstract: Fabrication and use of an X-ray detector scan interface having separate enable and reset lines for each line (e.g., row) of pixels is described. In certain implementations, the respective enable and reset lines are connected such that activation of an enable line for a given line of pixels is concurrent with activation of a reset line for a different (e.g., preceding) row of pixels. In this manner, readout of one row of pixels is performed in conjunction with resetting the row of pixels readout in the preceding operation. In another technical implementation, a non-rectangular detector is divided into quadrants, with alternating quadrants configured for scan module or data module operations such that no quadrant has overlapping scan and data interconnections at the connection finger regions.

Abstract: Various approaches are discussed for using four-side buttable CMOS tiles to fabricate detector panels, including large-area detector panels. Fabrication may utilize pads and interconnect structures formed on the top or bottom of the CMOS tiles. Electrical connection and readout may utilize readout and digitization circuitry provided on the CMOS tiles themselves such that readout of groups or sub-arrays of pixels occurs at the tile level, while tiles are then readout at the detector level such that readout operations are tiered or multi-level.

Abstract: Various approaches are discussed for using four-side buttable CMOS tiles to fabricate detector panels, including large-area detector panels. Fabrication may utilize pads and interconnect structures formed on the top or bottom of the CMOS tiles. Electrical connection and readout may utilize readout and digitization circuitry provided on the CMOS tiles themselves such that readout of groups or sub-arrays of pixels occurs at the tile level, while tiles are then readout at the detector level such that readout operations are tiered or multi-level.

Abstract: An X-ray detector panel includes a plurality of photodetector wafers are arranged in a photodetector array. Each photodetector wafer comprises a sensing surface, a contact surface disposed opposite the sensing surface, and an electrical contact coupled to the contact surface. A substrate is coupled to the photodetector array such that the photodetector array is substantially surrounded by the substrate and a face surface of the substrate is substantially coplanar with the sensing surface. A scintillator is coupled to the face surface of the substrate and substantially covers the sensing surfaces of the photodetector array. A scintillator cover is substantially sealingly coupled to the face surface.

Abstract: An x-ray image detector includes a light image sensor having a depth, a front side comprising a sensing surface, and a back side. The x-ray image detector further includes a substrate plate on the back side and surrounding the depth of the light image sensor such that the substrate plate forms a lip around the light image sensor. The lip is level with the front side of the light image sensor. The x-ray image detector further includes a scintillator over the sensing surface of the light image sensor and at least a portion of the lip.

Abstract: An X-ray detector panel includes a plurality of photodetector wafers are arranged in a photodetector array. Each photodetector wafer comprises a sensing surface, a contact surface disposed opposite the sensing surface, and an electrical contact coupled to the contact surface. A substrate is coupled to the photodetector array such that the photodetector array is substantially surrounded by the substrate and a face surface of the substrate is substantially coplanar with the sensing surface. A scintillator is coupled to the face surface of the substrate and substantially covers the sensing surfaces of the photodetector array. A scintillator cover is substantially sealingly coupled to the face surface.

Abstract: A charging station for a portable X-ray detector is described. In one embodiment, the charging station includes one or more biasing members that act to guide and align a portable detector when inserted into the charging station. In certain embodiments, a physical, pin-type connector for connecting to an inserted portable detector is present, while in other embodiments no pin-type connector is present.

Abstract: A digital X-ray detector includes a multi-functional panel support configured to support a digital detector array on a first side of the panel support and electronics on a second side of the panel support. The panel support includes a first enclosure and a rechargeable battery disposed within the first enclosure.

Abstract: In one embodiment, a digital X-ray detector includes a plurality of pixel regions. Each pixel region includes one or more photodiodes. The plurality of pixel regions form a detector panel having at least one corner truncated with respect to a rectangle to form a rounded shape or greater than four-sided polygon.

Abstract: A portable radiation detector is described having various shock isolation features. In one embodiment, shock isolation may be provided by providing a non-rigid mounting for a support layer within the portable detector to an enclosure of the portable detector. In other embodiments, an elastomeric strip is provided about all or part of an edge of the enclosure. In other embodiments, a removable elastomeric cover is provided for the portable detector.