Abstract: A memory device includes a plurality of memory cells, a weak address storage block suitable for storing a weak address of a weak cell of which data retention time is shorter than a reference time, among the plurality of memory cells, a refresh counter suitable for generating a counting address, and an address selection block suitable for outputting a refresh address by selecting one of the counting address and the weak address, wherein, in selecting the counting address, the address selection block selects the weak address for a predetermined period, when a value of at least one preset bit of the counting address is changed.

Abstract: A memory device includes a plurality of word lines; a plurality of bit lines; a plurality of memory cells, each memory cell coupled to a corresponding word line among the plurality of word lines and a corresponding bit line among the plurality of bit lines; and a control block suitable for controlling at least two word lines among the plurality of word lines to be activated together, and determining whether or not a weak cell exists, based on a voltage of a bit line corresponding to the activated word lines.

Abstract: A semiconductor memory device includes: a first memory cell coupled to a first bit line; a second memory cell coupled to a second bit line; and a sense amplification circuit for sensing and amplifying a voltage difference between the first and second bit lines, wherein the sense amplification circuit includes: a first sense amplifier including a cross-coupled pair of first and second transistors coupled to the first bit line and the second bit line, respectively; a second sense amplifier including a cross-coupled pair of third and fourth transistors coupled to the first and second bit lines, respectively; and an offset supplier for controlling a timing for supplying a voltage of the first bit line to the first transistor and a timing for supplying a voltage of the second bit line to the second transistor according to a selected memory from the first and second memory cells.

Abstract: A semiconductor memory device includes: a first memory cell coupled to a first bit line; a second memory cell coupled to a second bit line; and a sense amplification circuit for sensing and amplifying a voltage difference between the first and second bit lines, wherein the sense amplification circuit includes: a first sense amplifier including a cross-coupled pair of first and second transistors coupled to the first bit line and the second bit line, respectively; a second sense amplifier including a cross-coupled pair of third and fourth transistors coupled to the first and second bit lines, respectively; and an offset supplier for controlling a timing for supplying a voltage of the first bit line to the first transistor and a timing for supplying a voltage of the second bit line to the second transistor according to a selected memory from the first and second memory cells.

Abstract: A semiconductor device may be provided. The semiconductor device may include a memory area. The memory area may be configured to compare an address with a first failure address and a second failure address to store an input datum into a redundancy area and to output the stored input datum as an output datum or configured to compare the address with the first and failure addresses to correct an error of an input datum stored in a normal area to output the corrected input datum as the output datum. The semiconductor device may include a failure address storage circuit. The failure address storage circuit may be configured to store the address as a first failure address based on a first retention information signal and configured to store the address as a second failure address based on a second retention information signal.

Abstract: An integrated circuit may be provided. The integrated circuit may include a transmitter and a receiver. The transmitter outputs first transmission data to a first channel and outputs second transmission data to a second channel. The phase of the first transmission data transmitted through the first channel is different from a phase of the second transmission data transmitted through the second channel.

Abstract: Semiconductor devices are provided. The semiconductor device may include a current generation circuit and an internal circuit. The current generation circuit may include a first drive element and a second drive element which are connected in series. The current generation circuit may generate a reference voltage signal whose voltage level is set by a reference current which is identical or substantially identical to a current flowing through the first and second drive elements. The internal circuit may utilize an output current controlled according to the reference current as an operation current thereof.

Abstract: An integrated circuit may be provided. The integrated circuit may include a transmitter and a receiver. The transmitter outputs first transmission data to a first channel and outputs second transmission data to a second channel. The phase of the first transmission data transmitted through the first channel is different from a phase of the second transmission data transmitted through the second channel.

Abstract: A semiconductor memory device includes a semiconductor circuit substrate having a chip pad forming region. A pair of data lines are formed on the semiconductor circuit substrate at one side of the chip pad region. The pair of data lines extend along a direction that the chip pad region of the semiconductor circuit substrate extends. The pair of data lines are arranged to be adjacent to each other and receive a pair of differential data signals. A power supply line is formed on the semiconductor circuit substrate at the other side of the chip pad region. The power supply line extends along the direction that the chip pad region of the semiconductor circuit substrate extends, and the power supply line receives power.

Abstract: A phase-locked loop includes a phase detection unit configured to compare the phase of a feedback clock with the phase of an input clock, a clock generation unit configured to adjust the frequency of a first clock based on a result of the comparison of the phase detection unit, a first division unit configured to generate an output clock by dividing the first clock at a first division ratio in test mode and generate the output clock by dividing the first clock at a second division ratio that is lower than the first division ratio in normal mode, and a second division unit configured to generate the feedback clock by dividing the output clock.

Abstract: A data transmitter may include a transmitter circuit and a calibration controller. The transmitter circuit is configured to be coupled to a receiver through a channel, and configured to provide an output signal to the channel based on an input signal and adjust an output impedance value according to a bias signal. The calibration controller is configured to adjust the bias signal by comparing the output signal of the transmitter circuit to a reference signal during a calibration operation.

Abstract: A clock generation circuit includes a clock generation unit suitable for generating a first clock, a first inversion clock having an opposite phase to the first clock, a second clock having a different phase from the first clock, and a second inversion clock having an opposite phase to the second clock; and a reset control unit suitable for comparing the phases of the first and second clocks, and controlling the clock generation unit to disable for a time and then enable the second clock and the second inversion clock when the second clock leads the first clock.

Abstract: A duty cycle detection circuit includes a reset unit suitable for resetting a first capacitor and a second capacitor based on a reset signal, a first charging/discharging unit suitable for charging the first capacitor while a clock is in a first level and discharging the first capacitor while the clock is in a second level, a second charging/discharging unit suitable for charging the second capacitor while the clock is in the second level and discharging the second capacitor while the clock is in the first level, and a differential amplifier suitable for amplifying a voltage difference between the first capacitor and the second capacitor based on an amplification enable signal and generating a detection signal as a result of the amplification.

Abstract: A latch circuit includes a first PMOS transistor suitable for pull-up driving a second node based on a voltage of a first node, a first NMOS transistor suitable for pull-down driving the second node based on a voltage of the first node, a second PMOS transistor suitable for pull-up driving the first node based on a voltage of the second node, a second NMOS transistor suitable for pull-down driving the first node based on a voltage of the second node, a first separation element suitable for electrically separating the first NMOS transistor from the second node when the first PMOS transistor is turned on, and a second separation element suitable for electrically separating the second NMOS transistor from the first node when the second PMOS transistor is turned on.

Abstract: A latch circuit includes a first PMOS transistor suitable for pull-up driving a second node based on a voltage of a first node, a first NMOS transistor suitable for pull-down driving the second node based on a voltage of the first node, a second PMOS transistor suitable for pull-up driving the first node based on a voltage of the second node, a second NMOS transistor suitable for pull-down driving the first node based on a voltage of the second node, a first separation element suitable for electrically separating the first NMOS transistor from the second node when the first PMOS transistor is turned on, and a second separation element suitable for electrically separating the second NMOS transistor from the first node when the second PMOS transistor is turned on.

Abstract: A semiconductor device includes a periodic signal generating circuit for generating a periodic signal having a set period regardless of changes in temperature in response to a first trimming signal as a default value and controlling the set period of the periodic signal based on the temperature in response to a second trimming signal, and an internal circuit to perform a set operation in response to the periodic signal.

Abstract: A data transmitter may include a transmitter circuit and a calibration controller. The transmitter circuit is configured to be coupled to a receiver through a channel, and configured to provide an output signal to the channel based on an input signal and adjust an output impedance value according to a bias signal. The calibration controller is configured to adjust the bias signal by comparing the output signal of the transmitter circuit to a reference signal during a calibration operation.

Abstract: A semiconductor memory device includes a semiconductor circuit substrate having a chip pad forming region. A pair of data lines are formed on the semiconductor circuit substrate at one side of the chip pad region. The pair of data lines extend along a direction that the chip pad region of the semiconductor circuit substrate extends. The pair of data lines are arranged to be adjacent to each other and receive a pair of differential data signals. A power supply line is formed on the semiconductor circuit substrate at the other side of the chip pad region. The power supply line extends along the direction that the chip pad region of the semiconductor circuit substrate extends, and the power supply line receives power.

Abstract: A duty cycle correction circuit includes a clock adjustment unit configured to adjust a duty ratio of an input clock signal in response to a duty control signal and generate an output clock signal, a tracking type setting unit configured to generate an tracking type selection signal for setting a first or second tracking type based on a duty locking state of the output clock signal, and a control signal generation unit configured to generate the duty control signal, into which the first or second tracking type is incorporated, in response to the tracking type selection signal and the output clock signal.

Abstract: A duty cycle correction circuit includes a clock adjustment unit configured to adjust a duty ratio of an input clock signal in response to a duty control signal and generate an output clock signal, a tracking type setting unit configured to generate an tracking type selection signal for setting a first or second tracking type based on a duty locking state of the output clock signal, and a control signal generation unit configured to generate the duty control signal, into which the first or second tracking type is incorporated, in response to the tracking type selection signal and the output clock signal.