Abstract: A semiconductor apparatus includes a plurality of semiconductor devices. The semiconductor devices each include a ferroelectric layer, a conductive metal oxide layer, and a semiconductor layer, between two electrodes. The conductive metal oxide layer may be between the ferroelectric layer and the semiconductor layer. The ferroelectric layer, the conductive metal oxide layer, and the semiconductor layer may all include a metal oxide. The conductive metal oxide layer may include one or more materials selected from the group consisting of an indium oxide, a zinc oxide, a tin oxide, and any combination thereof.

Abstract: A semiconductor device may include a semiconductor substrate including a dopant having a polarity; a channel layer on the semiconductor substrate and including majority carriers having a polarity opposite to a polarity of the semiconductor substrate; a ferroelectric layer on the channel layer; and a gate on the ferroelectric layer. A doping concentration of the semiconductor substrate may be less than a concentration of the majority carrier of the channel layer.

Abstract: A ferroelectric field effect transistor includes: a source; a drain; a first channel connected to and between the source and the drain; a second channel connected to and between the source and the drain and spaced apart from the first channel; a ferroelectric layer covering the first channel and the second channel; a first gate layer disposed on the ferroelectric layer in correspondence with the first channel; a second gate layer disposed on the ferroelectric layer in correspondence with the second channel; and a gate wiring electrically connecting the first gate layer to the second gate layer, wherein the first gate layer includes a first metallic material having a first work function, and the second gate layer includes a second metallic material having a second work function, wherein the second work function is different from the first work function.

Abstract: A semiconductor apparatus includes a plurality of semiconductor devices. The semiconductor devices each include a ferroelectric layer, a conductive metal oxide layer, and a semiconductor layer, between two electrodes. The conductive metal oxide layer may be between the ferroelectric layer and the semiconductor layer. The ferroelectric layer, the conductive metal oxide layer, and the semiconductor layer may all include a metal oxide. The conductive metal oxide layer may include one or more materials selected from the group consisting of an indium oxide, a zinc oxide, a tin oxide, and any combination thereof.

Abstract: Provided is a neural network device including a plurality of word lines extending in a first direction, a plurality of bit lines extending in a second direction intersecting the first direction, and a plurality of memory cells arranged at points where the plurality of word lines and the plurality of bit lines intersect one another. Each of the plurality of memory cells includes at least two ferroelectric memories connected in parallel along a word line corresponding to each of the plurality of memory cells.

Abstract: A vertical non-volatile memory device may include a plurality of insulating layers and a plurality of conductive layers alternately stacked on a surface of a substrate in a direction perpendicular to the surface of the substrate; a channel layer on the substrate, where the channel layer extends in the direction perpendicular to the surface of the substrate and the channel layer may be on lateral surfaces of the plurality of insulating layers and lateral surfaces of the plurality of conductive layers; and a ferroelectric layer between the channel layer and the lateral surfaces of the plurality of conductive layers.

Abstract: A ferroelectric memory device may include a source, a drain, a channel layer between the source and the drain and connected to the source and the drain, a first gate electrode and a second gate electrode located on the channel layer to be spaced apart from each other, and a ferroelectric layer between the channel layer and the first gate electrode and between the channel layer and the second gate electrode. Different voltages may be applied to the first gate electrode and the second gate electrode.

Abstract: A hybrid memory device includes a first transistor including a first channel region, a first gate electrode facing and spaced apart from the first channel region, and a first memory layer arranged between the first channel region and the first gate electrode, and a second transistor including a second channel region including a same material as the first channel region, a second gate electrode facing and spaced apart from the second channel region, and a second memory layer arranged between the second channel region and the second gate electrode, wherein the hybrid memory device is used as a highly integrated memory system by two transistors that are formed on a same substrate and operate as different types of memories.

Abstract: Provided are a semiconductor device and a semiconductor apparatus including the semiconductor device. The semiconductor device includes a substrate having a channel layer comprising a dopant, a ferroelectric layer on the channel layer; and a gate on the ferroelectric layer. The channel layer has a doping concentration of 1×1015 cm?3 to 1×1021 cm?3.

Abstract: According to various example embodiments, a semiconductor element includes: a channel layer including a semiconductor material; a p-type semiconductor layer and an n-type semiconductor layer apart from each other with the channel layer therebetween, a paraelectric layer on a first area of the channel layer, a ferroelectric layer on a second area different from the first area of the channel area, and having a polarization state due to a voltage applied from an external source, a first gate electrode on the paraelectric layer, a second gate electrode on the ferroelectric layer, and an insulating layer between the first gate electrode and the second gate electrode, and electrically separating the first gate electrode and the second gate electrode from each other.

Abstract: Provided is a content-addressable memory. The content-addressable memory may include a memory cell connected to a match line, a word line, and a search line, and the memory cell includes a first channel layer and a second channel layer doped with different dopants.

Abstract: Provided are a ferroelectric semiconductor device and a method of extracting a defect density of the same. A ferroelectric electronic device includes a first layer, an insulating layer including a ferroelectric layer and a first interface that is adjacent to the first layer, and an upper electrode over the insulating layer, wherein the insulating layer has a bulk defect density of 1016 cm?3eV?1 or more and an interface defect density of 1010 cm?2eV?1 or more.

Abstract: An electronic device includes: a substrate including a source, a drain, and a channel between the source and the drain; a gate electrode arranged above the substrate and facing the channel, the gate electrode being apart from the channel in a first direction; and a ferroelectric thin film structure between the channel and the gate electrode, the ferroelectric thin film structure including a first ferroelectric layer, a crystallization barrier layer including a dielectric material, and a second ferroelectric layer, which are sequentially arranged from the channel in the first direction. The average of sizes of crystal grains of the first ferroelectric layer may be less than or equal to the average of sizes of crystal grains of the second ferroelectric layer, and owing to small crystal grains, dispersion of performance may be improved.

Abstract: An electronic device includes: a substrate including a source, a drain, and a channel between the source and the drain; a gate electrode arranged above the substrate and facing the channel, the gate electrode being apart from the channel in a first direction; and a ferroelectric thin film structure between the channel and the gate electrode, the ferroelectric thin film structure including a first ferroelectric layer, a crystallization barrier layer including a dielectric material, and a second ferroelectric layer, which are sequentially arranged from the channel in the first direction. The average of sizes of crystal grains of the first ferroelectric layer may be less than or equal to the average of sizes of crystal grains of the second ferroelectric layer, and owing to small crystal grains, dispersion of performance may be improved.

Abstract: A non-volatile memory device is provided. The nonvolatile memory device includes a metal pillar, a channel layer separated from the metal pillar and surrounding a side surface of the metal pillar, a source arranged on one end of the channel layer, a drain arranged on the other end of the channel layer, a gate insulating layer surrounding a side surface of the channel layer, and a plurality of insulating elements and a plurality of gate electrodes alternately arranged along a surface of the gate insulating layer and surrounding a side surface of the gate insulating layer.

Abstract: Disclosed are a non-volatile content addressable memory device having a simple cell configuration and/or an operating method thereof. The non-volatile content addressable memory device includes a plurality of unit cells, wherein each of the plurality of unit cells consists of or includes a first ferroelectric transistor and a second ferroelectric transistor The first and second ferroelectric transistors are of different types such as different electrical types from each other. The first and second ferroelectric transistors may be connected in series or in parallel to each other. The first and second ferroelectric transistors may share one word line and one match line. The first and second ferroelectric transistors may share one search line. One of the first and second ferroelectric transistors may be connected to a search line and the other one may be connected to a bar search line. The first and second ferroelectric transistors may share one match line.

Abstract: Provided is a semiconductor device including a first semiconductor transistor including a semiconductor channel layer, and a metal-oxide semiconductor channel layer, and having a structure in which a second semiconductor transistor is stacked on the top of the first semiconductor transistor. A gate stack of the second semiconductor transistor and the top of a gate stack of the first semiconductor transistor may overlap by greater than or equal to 90%. The first semiconductor transistor and the second semiconductor transistor may have a similar level of operation characteristics.

Abstract: A semiconductor apparatus includes a plurality of semiconductor devices. The semiconductor devices each include a ferroelectric layer, a conductive metal oxide layer, and a semiconductor layer, between two electrodes. The conductive metal oxide layer may be between the ferroelectric layer and the semiconductor layer. The ferroelectric layer, the conductive metal oxide layer, and the semiconductor layer may all include a metal oxide. The conductive metal oxide layer may include one or more materials selected from the group consisting of an indium oxide, a zinc oxide, a tin oxide, and any combination thereof.

Abstract: Provided is a ferroelectric semiconductor device including a source and a drain having different polarities. The ferroelectric semiconductor may include a ferroelectric including zirconium oxide (ZrO2), hafnium oxide (HfO2), and/or hafnium-zirconium oxide (HfxZr1?xO, 0<x<1). The semiconductor device may have memory-like characteristics.

Abstract: Provided is a ferroelectric semiconductor device including a ferroelectric layer and two or more electrode layers. The semiconductor device may include a first electrode layer and a second electrode layer which have thermal expansion coefficients less than the thermal expansion coefficient of the ferroelectric layer. The difference between the thermal expansion coefficients of the second electrode layer and the ferroelectric layer may be greater than the difference between the thermal expansion coefficients of the first electrode layer and the ferroelectric. The second electrode layer may have a thickness greater than the thickness of the first electrode layer.