Abstract: Provided is an electronic device including a substrate, a first metal layer, an electronic component, a cover layer, and an adhesive layer. The first metal layer is formed on the substrate. The electronic component is disposed on the substrate and electrically connected to the first metal layer. The adhesive layer is adhered to the substrate and the cover layer.

Abstract: An electronic apparatus including a substrate, a plurality of first bonding pads, an electronic device, and a first spacer is provided. The first bonding pads are disposed on the substrate. The electronic device is disposed on the substrate and electrically connected to the first bonding pads. The first spacer is disposed between the electronic device and the substrate. The electronic device is capable of effectively controlling a height and uniformity of a gap between the electronic device and the substrate, so as to prevent the electronic device from being tilted and ensure the electronic device to have a favorable structural reliability.

Abstract: The disclosure provides an electronic device and a manufacturing method thereof. The electronic device includes a substrate, an electronic element, an underfill layer, and a protective structure. The electronic element is disposed on the substrate. At least a portion of the underfill layer is disposed between the substrate and the electronic element. A thickness of the underfill layer is not greater than a height from a surface of the substrate to an upper surface of the electronic element. The protective structure is disposed on the substrate and adjacent to the underfill layer. The electronic device and the manufacturing method thereof of the disclosure may effectively control an area of the underfill layer.

Abstract: A method for forming an electronic device including two stacked liquid crystal cells is disclosed. A first liquid crystal cell including two substrates is provided. A second liquid crystal cell is formed by disposing another substrate to one of the substrates of the first liquid crystal cell. Subsequently, a cutting step is performed to cut off unnecessary portions of the substrates of the first liquid crystal cell and the second liquid crystal cell. Before bonding the another substrate, a pre-cutting step is performed to form at least a pre-cutting mark on the substrate on which the another substrate is bonded in order to facilitate removal of unnecessary portions of the substrates.

Abstract: The disclosure provides an electronic device which includes a substrate structure, a driving component, and a conductive pattern. The driving component and the conductive pattern are formed on the substrate structure, and the thickness of the conductive pattern is greater than or equal to 0.5 ?m and less than or equal to 15 ?m.

Abstract: An electronic device includes a first substrate, a second substrate disposed opposite to the first substrate, and a third substrate disposed between the first substrate and the second substrate, wherein the third substrate has a first surface closer to the first substrate and a second surface closer to the second substrate. A first alignment layer having a first alignment direction is disposed on a surface of the first substrate. A second alignment layer is disposed on a surface of the second substrate. A third alignment layer having a third alignment direction is disposed on a first surface of the third substrate, and a fourth alignment layer is disposed on the second surface of the third substrate. The third alignment direction is perpendicular to the first alignment direction.

Abstract: The disclosure provides an electronic device, including a substrate, a first conductor layer, a first insulating layer, an electronic component, and a driving structure. The first conductor layer is arranged on the substrate. The first insulating layer is disposed on the first conductor layer. The electronic component is arranged on the first insulating layer and coupled to the first conductor layer. The driving structure is coupled to the electronic component. The electronic device in the disclosure can have improved structural reliability.

Abstract: Disclosed is an electronic device, including a substrate, a first electrode, a second electrode, a modulation element, a first solder, and a switch element. The first electrode is disposed on the substrate. The second electrode is disposed on the substrate. The modulation element is disposed on the substrate and includes at least two connecting pads. The first solder is disposed between the first electrode and one connecting pad of the modulation element. The switch element is disposed on the substrate. The one connecting pad of the modulation element is electrically connected to the switch element sequentially through the first solder, the first electrode, and the second electrode.

Abstract: The disclosure provides a manufacturing method of an electronic device. The manufacturing method of the electronic device includes steps as follows. A substrate is provided. A first opening is formed and penetrates the substrate. A polymer layer is formed in the first opening. The polymer layer is in contact with a sidewall of the substrate at the first opening.

Abstract: An electronic device and a manufacturing method thereof are provided. The manufacturing method of the electronic device includes: providing a substrate; providing an adjustable element, including a liquid crystal layer; and bonding the adjustable element onto the substrate.

Abstract: An electronic device and a manufacturing method thereof are provided. The manufacturing method of the electronic device includes the following steps. A first carrier is provided. A first substrate is disposed on the first carrier. A first conductive structure is disposed on the first substrate, and the first carrier is removed. A second carrier is provided. A second substrate is disposed on the second carrier. A second conductive structure is disposed on the second substrate, and the second carrier is removed. The first substrate and the second substrate are combined.

Abstract: The disclosure provides an electronic device. The electronic device includes a substrate, a transistor, and a variable capacitor. The transistor is disposed on the substrate. The variable capacitor is disposed on the substrate and adjacent to the transistor. A material of the transistor and a material of the variable capacitor both a include a III-V semiconductor material. The electronic device of an embodiment of the disclosure may simplify manufacturing process, reduce costs, or reduce dimensions.

Abstract: A high-frequency device includes a second substrate disposed opposite to a first substrate, a first electrode disposed on a side surface of the first substrate adjacent to the second substrate, a second electrode disposed on a side surface of the second substrate adjacent to the first substrate, a sealant disposed between the first substrate and the second substrate, and a dielectric layer sandwiched between the first substrate and the second substrate by the sealant. The dielectric layer includes a gas or vacuum.

Abstract: An electronic device includes a carrier having at least one bonding pad, a plurality of electronic elements disposed on the carrier and one of the electronic elements including a substrate and at least one connecting terminal disposed between the substrate and the carrier. The electronic elements are electrically connected to the at least one bonding pad via the at least one connecting terminal.

Abstract: An electronic device includes a carrier having at least one bonding pad, a plurality of electronic elements disposed on the carrier and one of the electronic elements including a substrate and at least one connecting terminal disposed between the substrate and the carrier. The electronic elements are electrically connected to the at least one bonding pad via the at least one connecting terminal.

Abstract: At least one embodiment of the present disclosure relates to a substrate, a display panel and a fabrication method thereof, and a spliced screen. The substrate includes a base having a display region and a non-display region, and the non-display region includes a bonding region arranged at an end-side of the base.

Abstract: An electronic device includes a first substrate, a second substrate disposed opposite to the first substrate, and a third substrate disposed between the first substrate and the second substrate, wherein the third substrate has a first surface closer to the first substrate and a second surface closer to the second substrate. A first alignment layer having a first alignment direction is disposed on a surface of the first substrate. A second alignment layer is disposed on a surface of the second substrate. A third alignment layer having a third alignment direction is disposed on a first surface of the third substrate, and a fourth alignment layer is disposed on the second surface of the third substrate. The third alignment direction is perpendicular to the first alignment direction.

Abstract: There is disclosed a transparent display device including: a transparent display panel, a first optical structure fixed on a light incidence side of the transparent display panel, and a plurality of light sources arranged on a side of the first optical structure, wherein there is a scattering lens structure arranged on a side of the first optical structure facing away from the transparent display panel and a refractive index of a medium between the first optical structure and the transparent display panel is less than a refractive index of the first optical structure.

Abstract: At least one embodiment of the present disclosure relates to a substrate, a display panel and a fabrication method thereof, and a spliced screen. The substrate includes a base having a display region and a non-display region, and the non-display region includes a bonding region arranged at an end-side of the base.

Abstract: There is disclosed a transparent display device including: a transparent display panel, a first optical structure fixed on a light incidence side of the transparent display panel, and a plurality of light sources arranged on a side of the first optical structure, wherein there is a scattering lens structure arranged on a side of the first optical structure facing away from the transparent display panel and a refractive index of a medium between the first optical structure and the transparent display panel is less than a refractive index of the first optical structure.