Abstract: A bionic robot is provided, which includes a body; a plurality of sets of wheeled leg devices arranged at intervals in a front-rear direction, each comprising two wheeled leg devices arranged symmetrically in a left-right direction, each comprising a leg assembly and a travel wheel, and a power output shaft connected to the travel wheel; and a suspension device disposed in the body and connected to at least two sets from the plurality of sets of wheeled leg devices. The at least two sets of wheeled leg devices are located at the foremost end and the backmost end respectively. The suspension device comprises a plurality of drive assemblies, each connected to a corresponding leg assembly, which each comprise: an electric cylinder being configured to drive a telescopic rod to extend or retract; a damper connected between the body and the leg assembly; and an elastic member fitted over the damper.

Abstract: An electronic device includes a first substrate, a second substrate on the first substrate, a third substrate between the first substrate and the second substrate, a first optical media layer between the first substrate and the third substrate, and a second optical media layer between the second substrate and the third substrate. A sidewall of the third substrate is recessed from a sidewall of the first substrate and a sidewall of the second substrate to form a recessed portion. Another sidewall of the third substrate protrudes from another sidewall of the first substrate and another sidewall of the second substrate to form a protruding portion.

Abstract: A transfer device, including a substrate and multiple pick-and-place modules, is provided. The pick-and-place modules are disposed on the substrate to transfer multiple electronic components onto the substrate. At least one pick-and-place module includes a rotating arm that rotates vertically relative to the substrate.

Abstract: A manufacturing method of an electronic device is provided. The manufacturing method of the electronic device includes: providing a substrate; providing an adjustable element, including a liquid crystal layer; and bonding the adjustable element onto the substrate.

Abstract: A method for forming an electronic device including two stacked liquid crystal cells is disclosed. A first liquid crystal cell including two substrates is provided. A second liquid crystal cell is formed by disposing another substrate to one of the substrates of the first liquid crystal cell. Subsequently, a cutting step is performed to cut off unnecessary portions of the substrates of the first liquid crystal cell and the second liquid crystal cell. Before bonding the another substrate, a pre-cutting step is performed to form at least a pre-cutting mark on the substrate on which the another substrate is bonded in order to facilitate removal of unnecessary portions of the substrates.

Abstract: The disclosure provides an electronic device and a manufacturing method thereof. The electronic device includes a flexible substrate, an adhesive layer, a metal layer, a driving unit, and a modulating unit. The adhesive layer is disposed on the flexible substrate. The metal layer is disposed on the adhesive layer. The driving unit is disposed on the adhesive layer. The modulating unit is disposed on the adhesive layer. The manufacturing method of the electronic device includes the following steps: providing a carrier substrate; forming a first metal layer on the carrier substrate; providing a flexible substrate, and combining the flexible substrate and the carrier substrate; removing the carrier substrate; and providing a modulating unit, and disposing the modulating unit on the flexible substrate. The electronic device and the manufacturing method thereof of the embodiments of the disclosure may make the electronic device having the modulating unit applicable to a non-planar structure.

Abstract: An electronic device and a diode are provided. The electronic device includes a switch circuit and a diode. The switch circuit includes a transistor. The diode has a first pin and a second pin. The first pin is electrically coupled to the transistor. The second pin is an idle contact.

Abstract: An electronic device and a manufacturing method thereof are provided. The manufacturing method of the electronic device includes: providing a substrate; providing an adjustable element, including a liquid crystal layer; and bonding the adjustable element onto the substrate.

Abstract: An electronic device including a tuning element is provided. The tuning element includes a first capacitor element including a first switch and a first capacitor electrically coupled to the first switch and a second capacitor element including a second capacitor. The first capacitor element is electrically connected in parallel with the second capacitor element.

Abstract: An electronic device includes a substrate, a redistribution layer disposed on the substrate, and an electronic component disposed on the redistribution layer and electrically connected to the redistribution layer.

Abstract: A communication device including a substrate, a gate drive circuit, and a first tunable unit is provided. The gate drive circuit is disposed on the substrate. The gate drive circuit includes a first thin-film transistor and is configured to output a gate drive signal. The first tunable unit is disposed on the substrate and is electrically connected to the gate drive circuit. The first tunable unit includes a first drive circuit and a first tunable component. The first drive circuit includes a first terminal and a second terminal, and the first terminal of the first drive circuit is configured to receive the gate drive signal. The first tunable component is electrically connected to the second terminal of the first drive circuit.

Abstract: This disclosure provides a communication device and a manufacturing method thereof. The manufacturing method of the communication device includes the following steps: providing a first dielectric layer, wherein the first dielectric layer includes a first region and a second region, and the first dielectric layer has a first surface and a second surface opposite to the first surface; providing a second dielectric layer; combining the first dielectric layer and the second dielectric layer with a sealing element, so that the sealing element is disposed between the first surface of the first dielectric layer and a third surface of the second dielectric layer; after combining the first dielectric layer and the second dielectric layer, thinning the second surface of the first dielectric layer; and disposing a first communication element on the first surface of the first dielectric layer in the first region.

Abstract: A high-frequency device includes a second substrate disposed opposite to a first substrate, a first electrode disposed on a side surface of the first substrate adjacent to the second substrate, a second electrode disposed on a side surface of the second substrate adjacent to the first substrate, a sealant disposed between the first substrate and the second substrate, and a dielectric layer sandwiched between the first substrate and the second substrate by the sealant. The dielectric layer includes a gas or vacuum.

Abstract: A manufacturing method of an electronic device including following steps is provided. A tuning element substrate having a circuit layer disposed on a substrate and a plurality of tuning elements disposed on the circuit layer is provided. A reverse bias voltage or a forward bias voltage is applied to the tuning elements, so as to test a variation of an electrical property or a variation of an optical property of each of the tuning elements. The variation of the electrical property or the variation of the optical property of each of the tuning elements is analyzed. According to the manufacturing method, a reliable testing method of an electronic device may be provided.

Abstract: A manufacturing method of an electronic device including following steps is provided. A first substrate is provided. A thermal release adhesive layer is provided on the first substrate. A thinning process is performed on the first substrate to form a first thinned substrate. A cutting process is performed on the first thinned substrate to form a first sub-substrate. The thermal release adhesive layer is separated from the first thinned substrate or the first sub-substrate. In the manufacturing method of the electronic device provided in one or more embodiments of the disclosure, the manufacturing process of the electronic device may be simplified, and/or defects of the resultant electronic device may be reduced.

Abstract: An electronic device includes a carrier, a plurality of electronic elements and a connecting terminal. The carrier has at least one bonding pad. The electronic elements are disposed on the carrier, and each of the electronic elements includes a substrate. A distance between two adjacent substrates of the electronic elements is not less than 300 ?m. The connecting terminal is disposed between one of the substrate and the carrier. One of the electronic elements are electrically connected to the at least one bonding pad via the connecting terminal.

Abstract: An electronic device includes a substrate, a bump, a chip, and an adhesive layer. The substrate includes a first connection pad. The bump is disposed on the first connection pad. The chip includes a second connection pad. The bump is disposed between the first connection pad and the second connection pad. The adhesive layer is disposed between the substrate and the chip. A dissipation factor of the adhesive layer is less than or equal to 0.01 at a frequency of 10 GHz. A manufacturing method of an electronic device includes the following: providing a substrate, where the substrate includes a first connection pad; applying an adhesive layer on the substrate; patterning the adhesive layer, such that the adhesive layer produces an opening exposing the first connection pad; forming a bump on the first connection pad; and bonding the chip onto the bump through the second connection pad.

Abstract: An electronic device includes a carrier having at least one bonding pad, a plurality of electronic elements disposed on the carrier and one of the electronic elements including a substrate and at least one connecting terminal disposed between the substrate and the carrier. The electronic elements are electrically connected to the at least one bonding pad via the at least one connecting terminal.

Abstract: Provided is an electronic device including a substrate, a first metal layer, an electronic component, a cover layer, and an adhesive layer. The first metal layer is formed on the substrate. The electronic component is disposed on the substrate and electrically connected to the first metal layer. The adhesive layer is adhered to the substrate and the cover layer.

Abstract: An electronic apparatus including a substrate, a plurality of first bonding pads, an electronic device, and a first spacer is provided. The first bonding pads are disposed on the substrate. The electronic device is disposed on the substrate and electrically connected to the first bonding pads. The first spacer is disposed between the electronic device and the substrate. The electronic device is capable of effectively controlling a height and uniformity of a gap between the electronic device and the substrate, so as to prevent the electronic device from being tilted and ensure the electronic device to have a favorable structural reliability.