Abstract: A medical implant has a textured tissue contact surface comprising a roughened surface that includes a plurality of macroscale and microscale projections and recesses and a plurality of nanostructures on the projections and within the recesses. The nanostructures comprise a plurality of spaced elongated waves, each wave having a crest and a trough. Each wave and recess comprise a plurality of individual polygonal structures, some of which comprise pyramidical-type shapes. The textured tissue contact surface is formed by initially laser ablating a tissue contact surface on the implant with a nanosecond pulsed laser followed by laser ablating the initially ablated surface with a femto-second pulsed laser.

Abstract: A bellows shaped spinal implant, comprising an upper plate, a lower plate and a bellows shaped shell extending between and joining the upper and lower plates. The bellows shaped shell is formed of titanium or an alloy comprising titanium and includes a wall extending therearound that defines a hollow interior. The wall has a thickness in the range of 0.5 mm to 1.0 mm to provide for radiographic imaging through the wall. The wall is angled or curved inwardly or outwardly between the upper and lower plates to provide stiffness mimicking the stiffness properties of a similarly sized polyetheretherketone (PEEK) implant. The upper and lower plates each comprise porous contact regions including a three-dimensional gyroid lattice structure defined by a plurality of struts and pores in communication with the hollow interior. The outer surfaces of at least a portion of the struts may comprise a laser ablated textured surface.

Abstract: This application provides data sending methods, radio frequency apparatuses, and control apparatuses. An example method includes obtaining a transmit power. The transmit power is determined based on first power increase information and second power increase information. The first power increase information indicates a first power increase amplitude corresponding to a first standard in a time unit. The second power increase information indicates a second power increase amplitude corresponding to a second standard in the time unit. The example method further includes sending, based on the transmit power, data corresponding to the time unit. The first standard and the second standard are different baseband working standards.

Abstract: A medical implant has a textured tissue contact surface comprising a roughened surface that includes a plurality of macroscale and microscale projections and recesses and a plurality of nanostructures on the projections and within the recesses. The nanostructures comprise a plurality of spaced elongated waves, each wave having a crest and a trough. Each wave and recess comprise a plurality of individual polygonal structures, some of which comprise pyramidical-type shapes. The textured tissue contact surface is formed by initially laser ablating a tissue contact surface on the implant with a nanosecond pulsed laser followed by laser ablating the initially ablated surface with a femto-second pulsed laser.

Abstract: The disclosure provides a method for manufacturing a semiconductor package assembly, which results in a semiconductor package assembly with a more even distributed stress concentrations, reduced solder crack occurrences and limited solder filler joint connections.

Abstract: A bellows shaped spinal implant, comprising an upper plate, a lower plate and a bellows shaped shell extending between and joining the upper and lower plates. The bellows shaped shell is formed of titanium or an alloy comprising titanium and includes a wall extending therearound that defines a hollow interior. The wall has a thickness in the range of 0.5 mm to 1.0 mm to provide for radiographic imaging through the wall. The wall is angled or curved inwardly or outwardly between the upper and lower plates to provide stiffness mimicking the stiffness properties of a similarly sized polyetheretherketone (PEEK) implant. The upper and lower plates each comprise porous contact regions including a three-dimensional gyroid lattice structure defined by a plurality of struts and pores in communication with the hollow interior. The outer surfaces of at least a portion of the struts may comprise a laser ablated textured surface.

Abstract: A bellows shaped spinal implant, comprising an upper plate, a lower plate and a bellows shaped shell extending between and joining the upper and lower plates. The bellows shaped shell is formed of titanium or an alloy comprising titanium and includes a wall extending therearound that defines a hollow interior. The wall has a thickness in the range of 0.5 mm to 1.0 mm to provide for radiographic imaging through the wall. The wall is angled or curved inwardly or outwardly between the upper and lower plates to provide stiffness mimicking the stiffness properties of a similarly sized polyetheretherketone (PEEK) implant. The upper and lower plates each comprise porous contact regions including a three-dimensional gyroid lattice structure defined by a plurality of struts and pores in communication with the hollow interior. The outer surfaces of at least a portion of the struts may comprise a laser ablated textured surface.

Abstract: An expandable spinal implant comprises a body having a hollow interior, a proximal end and a distal end, the body supporting an endplate movable relative to the body in a first direction away from said body. An actuatable expansion mechanism, supported within the hollow interior is coupled to the body and the movable endplate to move the movable endplate relative to the body. The expansion mechanism comprises a rotatable drive gear and a rotatable follower supported spaced from the drive gear, and a transmission belt rotatively coupling the drive gear and the follower to transfer rotative motion from the drive gear to the follower upon actuation of the expansion mechanism. The transmission belt is formed in a continuous loop extending in an oblong shape around the drive gear and the follower and has an inward curve on one side of the loop between said drive gear and the follower.

Abstract: A steerable expandable spinal implant comprises a body and a movable endplate. The implant including an actuatable expansion mechanism coupled to the body, the expansion mechanism comprising a rotatable drive gear and a follower spindle coupled by a transmission belt. The drive gear is rotatable in a first direction to rotate the body about an axis adjacent a body proximal end, and in a second opposite direction to actuate the expansion mechanism to move the endplate away from the body and expand the spinal implant. A brake shoe is rotatably supported by the body adjacent the proximal end, the brake shoe being operable in a first mode to allow the body to rotate about the axis, and in the second mode to constrain movement of the body relative to brake shoe thereby allowing actuation of the expansion mechanism to move the endplate away from the body and expand the implant.

Abstract: A surface mount semiconductor device and method of manufacture. A semiconductor die is mounted on a first support surface; a leadframe is attached to the semiconductor die, the leadframe comprising: an electrical lead having a first lead region connected to the semiconductor die; and a second lead region distal the first lead region, wherein the second lead region is connected to a second support surface; encapsulating the semiconductor die, first support surface and the first lead region; the second lead region is severed from the second support surface to expose a lead end; and the second lead region is electro-plated with a metallic material, such that the lead end is coated with said metallic material.

Abstract: A semiconductor package including a semiconductor die having multiple bond pads is provided. The package further includes an electrically conducting clip including, at a first side thereof, at least one pin for mounting the package to an external board and includes, at a second side opposite to the first side, a connecting portion connecting the clip to at least two bond pads of the multiple bond pads. The connection portion includes at least two elongated connecting strips spaced apart from each other at a distance in such a manner that each strip extends over at least one of the at least two bond pads and is connected thereto.

Abstract: An electronic package and method for manufacturing is provided. The package includes an electronic component having a terminal, a solidified molding compound encapsulating the electronic component, a lead including an inner and a mounting portion. The molding compound includes a first recess at or near a perimeter of a bottom surface of the mounting portion, exposing a portion of a bottom surface of the inner portion arranged near the mounting portion, and/or a second recess at the perimeter of the bottom surface of the mounting portion, the second recess exposing a portion of a side surface of the mounting portion extending between the top and the bottom surface of the mounting portion. The package provides more exposed lead space for a larger solder covering area using the first and/or second recess. Thus, solder strain accumulation is reduced or mitigated, and reliability of the electronic package can be enhanced.

Abstract: A bellows shaped spinal implant, comprising an upper plate, a lower plate and a bellows shaped shell extending between and joining the upper and lower plates. The bellows shaped shell is formed of titanium or an alloy comprising titanium and includes a wall extending therearound that defines a hollow interior. The wall has a thickness in the range of 0.5 mm to 1.0 mm to provide for radiographic imaging through the wall. The wall is angled or curved inwardly or outwardly between the upper and lower plates to provide stiffness mimicking the stiffness properties of a similarly sized polyetheretherketone (PEEK) implant. The upper and lower plates each comprise porous contact regions including a three-dimensional gyroid lattice structure defined by a plurality of struts and pores in communication with the hollow interior. The outer surfaces of at least a portion of the struts may comprise a laser ablated textured surface.

Abstract: A temporary cylinder for snap-in retention with an elongate dental implant includes an elongate body extending from a first end to a second end, the elongate body being generally cylindrical and having an upper portion and a lower engagement portion and the temporary cylinder's lower engagement portion includes a male irregular hexagonal plug, and wherein the dental implant includes a female regular hexagonal socket, and wherein the male irregular hexagonal plug and the female regular hexagonal socket are configured for inter-engagement with each other, and the fitment of the irregular hexagonal plug and regular hexagonal socket together with one another results in a frictional fit when inter-engaged.

Abstract: Various example embodiments concern an integrated circuit (IC) package having a clip with a protruding tough-shaped finger portion. The clip can be used in various IC packages including, for example, soft-soldered compact power packages such as rectifiers with specified surge current capability. Such embodiments can be implemented to allow for a visual inspection capability of the soldering area for connecting a lead frame, via the clip, to a surface of the IC package die, while still providing sufficient thermal mass to limit the temperature increase during forward surge current loads. This results in a simple to manufacture design without compromising too much on performance.

Abstract: An electronic device including a die and at least one lead. The electronic device further includes a corresponding at least one connector, each connector for connecting the die to a corresponding lead or leads, and each connector having a first end disposed in bondable proximity to a complementary surface of the corresponding lead and a second end disposed in bondable proximity to a complementary surface of the die. An end portion of at least one of the first end and second end has a formation, the formation in combination with the complementary surface of one, or both, of the respective lead or the die defining therebetween a first region and at least a second region configured to attract by capillary action an electrically conductive bonding material to consolidate therein.

Abstract: A scan body for intraoral scanning includes a snap-in retention capability for engagement with a dental implant having a first engagement section. The second engagement section is configured for a snap-in or frictional fit with the first engagement section to releasably secure the scan body to the implant.

Abstract: A scan body for intraoral scanning includes a snap-in retention capability for engagement with a dental implant having a first engagement section. The second engagement section is configured for a snap-in or frictional fit with the first engagement section to releasably secure the scan body to the implant.

Abstract: An electronic device including a die and at least one lead. The electronic device further includes a corresponding at least one connector, each connector for connecting the die to a corresponding lead or leads, and each connector having a first end disposed in bondable proximity to a complementary surface of the corresponding lead and a second end disposed in bondable proximity to a complementary surface of the die. An end portion of at least one of the first end and second end has a formation, the formation in combination with the complementary surface of one, or both, of the respective lead or the die defining therebetween a first region and at least a second region configured to attract by capillary action an electrically conductive bonding material to consolidate therein.

Abstract: A surface mount semiconductor device and method of manufacture. A semiconductor die is mounted on a first support surface; a leadframe is attached to the semiconductor die, the leadframe comprising: an electrical lead having a first lead region connected to the semiconductor die; and a second lead region distal the first lead region, wherein the second lead region is connected to a second support surface; encapsulating the semiconductor die, first support surface and the first lead region; the second lead region is severed from the second support surface to expose a lead end; and the second lead region is electro-plated with a metallic material, such that the lead end is coated with said metallic material.