Abstract: A temporary cylinder for snap-in retention with an elongate dental implant includes an elongate body extending from a first end to a second end, the elongate body being generally cylindrical and having an upper portion and a lower engagement portion and the temporary cylinder's lower engagement portion includes a male irregular hexagonal plug, and wherein the dental implant includes a female regular hexagonal socket, and wherein the male irregular hexagonal plug and the female regular hexagonal socket are configured for inter-engagement with each other, and the fitment of the irregular hexagonal plug and regular hexagonal socket together with one another results in a frictional fit when inter-engaged.

Abstract: Various example embodiments concern an integrated circuit (IC) package having a clip with a protruding tough-shaped finger portion. The clip can be used in various IC packages including, for example, soft-soldered compact power packages such as rectifiers with specified surge current capability. Such embodiments can be implemented to allow for a visual inspection capability of the soldering area for connecting a lead frame, via the clip, to a surface of the IC package die, while still providing sufficient thermal mass to limit the temperature increase during forward surge current loads. This results in a simple to manufacture design without compromising too much on performance.

Abstract: A scan body for intraoral scanning includes a snap-in retention capability for engagement with a dental implant having a first engagement section. The second engagement section is configured for a snap-in or frictional fit with the first engagement section to releasably secure the scan body to the implant.

Abstract: An optoelectronic apparatus is described herein, including a transmitter, a receiver, and an optical waveguide, all of which are embedded in a PCB. The transmitter includes a laser generator and other circuits for generating electrical and optical signals, which are transmitted through the waveguide to the receiver. The receiver includes circuits and detectors for detecting and converting the optical signals to electrical signals. The circuit and optical components of the transmitter and receiver are integrated in 3D hybrid chip sets where the chip components are stacked in a 3D structure. Because all of the circuit and optical components are embedded in the PCB, the apparatus is made very compact and suitable for implementation in portable products.

Abstract: An apparatus having a three-dimensional integrated circuit structure is described herein. The apparatus include an interposer for carrying a plurality of high and low-power chips. The high-power chips are attached and connected to one side of the interposer, while the low-power chips are attached and connected to the other side of the interposer. In generally, the high-power chips produce more heat than does the low-power chip during their operations. The interposer further include through silicon vias and redistribution layers for connecting the chips on both surfaces. In addition, the interposer assembly is attached and connected to a substrate layer, which is in turn attached and connected to a printed circuit board. In order to provide improve thermal management, the interposer surface carrying the high-power chips are oriented away from the circuit board. A heat spreader is attached to the back sides of the high-power chips for dissipating the heat.

Abstract: An article of clothing having an electrical assembly formed of conductive thread. The article includes a clothing article and an electrical assembly formed using conductive thread wherein the electrical assembly is adapted to form a part of the clothing article. A pliable connector may connect the electrical assembly to a power cord. The inventions may further include a power supply connected to the power cord.

Abstract: An optoelectronic apparatus is described herein, including a transmitter, a receiver, and an optical waveguide, all of which are embedded in a PCB. The transmitter includes a laser generator and other circuits for generating electrical and optical signals, which are transmitted through the waveguide to the receiver. The receiver includes circuits and detectors for detecting and converting the optical signals to electrical signals. The circuit and optical components of the transmitter and receiver are integrated in 3D hybrid chip sets where the chip components are stacked in a 3D structure. Because all of the circuit and optical components are embedded in the PCB, the apparatus is made very compact and suitable for implementation in portable products.

Abstract: An apparatus having a three-dimensional integrated circuit structure is described herein. The apparatus include an interposer for carrying a plurality of high and low-power chips. The high-power chips are attached and connected to one side of the interposer, while the low-power chips are attached and connected to the other side of the interposer. In generally, the high-power chips produce more heat than does the low-power chip during their operations. The interposer further include through silicon vias and redistribution layers for connecting the chips on both surfaces. In addition, the interposer assembly is attached and connected to a substrate layer, which is in turn attached and connected to a printed circuit board. In order to provide improve thermal management, the interposer surface carrying the high-power chips are oriented away from the circuit board. A heat spreader is attached to the back sides of the high-power chips for dissipating the heat.

Abstract: A radiant gas burner within the combustion chamber of a water heater has a pilot flame created using a cross-sectionally elongated raw fuel jet that impinges on an interior surface portion of a flame holding outer burner wall portion, representatively of a metal wire mesh material, and is mixed within the burner with combustion air delivered thereto from outside the combustion chamber. The resulting fuel/air mixture passes outwardly through the impinged upon mesh wall portion, which functions as a pilot flame stabilizing structure, and is ignited to form a pilot flame on the exterior of the burner body. A thermocouple portion of a clogging detection system senses a change in the pilot flame shape caused by particulate clogging of the metal mesh material and responsively terminates further gas supply to the water heater.

Abstract: A radiant gas burner within the combustion chamber of a water heater has a pilot flame created using a cross-sectionally elongated raw fuel jet that impinges on an interior surface portion of a flame holding outer burner wall portion, representatively of a metal wire mesh material, and is mixed within the burner with combustion air delivered thereto from outside the combustion chamber. The resulting fuel/air mixture passes outwardly through the impinged upon mesh wall portion, which functions as a pilot flame stabilizing structure, and is ignited to form a pilot flame on the exterior of the burner body. A thermocouple portion of a clogging detection system senses a change in the pilot flame shape caused by particulate clogging of the metal mesh material and responsively terminates further gas supply to the water heater.