Abstract: A display panel and a manufacture method thereof, and a display apparatus are provided. The display liquid crystal panel includes a first substrate and a second substrate opposite to each other; the light control panel includes a third substrate and a fourth substrate opposite to each other. The second substrate and the third substrate are between the first substrate and the fourth substrate. The light control liquid crystal layer is between the first polarizer and the second polarizer; the first polarizer is between the second polarizer and the third polarizer, and the display liquid crystal layer is between the first polarizer and the third polarizer. The first polarizer, the second polarizer, and the third polarizer are configured to allow backlight to emit out of the fourth substrate after passing through the second polarizer, the first polarizer, and the third polarizer in sequence.

Abstract: Provided is a display backplate including an array substrate and a plurality of pairs of connection structures on the array substrate, wherein the array substrate includes a plurality of thin-film transistors and a common electrode signal line, wherein at least one of the plurality of thin-film transistors is connected to one of a pair of connection structures and the common electrode signal line is connected to the other of the pair of connection structures; and an area of a first section of the connection structure is negatively correlated with a distance between the first section and a surface of the array substrate, and the first section is parallel to the surface of the array substrate.

Abstract: The embodiments of the present application provide a carrier plate and a transferring device. The carrier plate particularly includes a transporting base plate, a dissociation regulating feature and a dissociable-adhesive layer that are sequentially arranged, the dissociation regulating feature is configured to regulate a dissociation accuracy of the dissociable-adhesive layer, and the dissociable-adhesive layer is configured to be connected to a plurality of light-emitting-diode chips. The carrier plate can increase the yield and the dissociation accuracy of the light-emitting-diode chips, which can increase the yield in the process of the mass transfer and the efficiency of the mass transfer of the light-emitting-diode chips.

Abstract: An array substrate, a method for preparing the array substrate, and a backlight module are disclosed. Before electroplating a first metal layer on a pattern of a seed layer, the method further includes: forming a pattern of a compensation electrode wire electrically connected with a lead electrode on a side, where the lead electrode is formed, of a base substrate. The compensation electrode wire is at least on a second side of a wiring region, the pattern of the lead electrode is formed at a first side of the wiring region, and the first side and the second side are different sides. In the electroplating process, the lead electrode is connected with a negative pole of a power supply, the compensation electrode wire is electrically connected with the lead electrode, thus an area of an electroplating negative pole generating electric field lines is increased by utilizing the compensation electrode wire.

Abstract: The present disclosure relates to a display substrate and a method for manufacturing the same. The display substrate includes: a substrate; a first electrode located on the substrate; and a conductive convex located on the first electrode. A dimension of a cross section of the conductive convex along a plane parallel to the substrate is negatively correlated to a distance from the cross section to a surface of the first electrode.

Abstract: A mass transfer method for micro light-emitting diodes (W) includes: picking up micro light-emitting diodes (W) on an element substrate (200) by using a transfer substrate (300), and transferring the micro light-emitting diodes (W) after pickup to an intermediate carrying substrate (400); and transferring micro light-emitting diodes (W), which are on the intermediate carrying substrate (400) and correspond to all sub-pixels (SPX) on a target substrate (100), into the sub-pixels (SPX) of the target substrate (100) at one time, such that all the sub-pixels (SPX) on the target substrate (100) receives the micro light-emitting diodes (W) at one time.

Abstract: A display panel and a manufacture method thereof, and a display apparatus are provided. A display liquid crystal panel and a light control panel that are stacked. The display liquid crystal panel includes a first substrate and a second substrate that are opposite to each other; the light control panel includes a third substrate and a fourth substrate that are opposite to each other. The second substrate and the third substrate are between the first substrate and the fourth substrate. The first polarizer is between the second polarizer and the third polarizer. The first polarizer, the second polarizer, and the third polarizer are configured to allow backlight to emit out of the fourth substrate after passing through the second polarizer, the first polarizer, and the third polarizer in sequence.

Abstract: The present disclosure relates to a display substrate and a method for manufacturing the same. The display substrate includes: a substrate; a first electrode located on the substrate; and a conductive convex located on the first electrode. A dimension of a cross section of the conductive convex along a plane parallel to the substrate is negatively correlated to a distance from the cross section to a surface of the first electrode.

Abstract: Disclosed are a transfer carrier and a manufacturing method thereof, and a method for transferring a light-emitting diode chip. The transfer carrier includes: a substrate having a plurality of via holes penetrating a thickness of the substrate, the substrate having a first surface and second surface which are opposite to each other; and thermoplastic structures filling corresponding ones of the via holes, one end of the thermoplastic structures protruding from the second surface of the substrate, and the other end covering a surrounding area on the first surface, of the corresponding via holes.

Abstract: A microfluidic substrate and a manufacture method thereof, and a microfluidic panel are provided. The microfluidic substrate includes a base substrate, an acoustic wave generation device, and a first switching circuit. The acoustic wave generation device is on the base substrate and configured to emit an acoustic wave to drive a liquid droplet to move over the microfluidic substrates, the acoustic wave generation devices includes an acoustic wave driving electrode and an acoustic wave generation layer, the first switching circuit is on the base substrate, and the first switching circuit is electrically connected to the acoustic wave driving electrode and is configured to transmit an acoustic wave driving signal to the acoustic wave driving electrode, and the acoustic wave driving electrode is configured to drive the acoustic wave generation layer to generate the acoustic wave under control of the acoustic wave driving signal.

Abstract: Provided is a display backplate including an array substrate and a plurality of pairs of connection structures on the array substrate, wherein the array substrate includes a plurality of thin-film transistors and a common electrode signal line, wherein at least one of the plurality of thin-film transistors is connected to one of a pair of connection structures and the common electrode signal line is connected to the other of the pair of connection structures; and an area of a first section of the connection structure is negatively correlated with a distance between the first section and a surface of the array substrate, and the first section is parallel to the surface of the array substrate.

Abstract: Provided is a display backplate including an array substrate and a plurality of pairs of connection structures on the array substrate, wherein the array substrate includes a plurality of thin-film transistors and a common electrode signal line, wherein at least one of the plurality of thin-film transistors is connected to one of a pair of connection structures and the common electrode signal line is connected to the other of the pair of connection structures; and an area of a first section of the connection structure is negatively correlated with a distance between the first section and a surface of the array substrate, and the first section is parallel to the surface of the array substrate.

Abstract: The embodiments of the present disclosure relate to the field of display technologies, in particular to a metal wire grid polarizer and a manufacturing method thereof, and a display device. The metal wire grid polarizer includes a base substrate and a plurality of metal wire grids. The base substrate has a plurality of binding areas and a plurality of binding contraposition areas. The metal wire grids are disposed on the base substrate and arranged parallel to each other, and orthographic projections of the metal wire grids on the base substrate do not overlap with the binding areas or the binding contraposition areas, to avoid the metal wire grids from shielding light in the binding process, ensure the alignment process to proceed smoothly, and realize the binding accuracy.

Abstract: An array substrate and a manufacturing method thereof and a display device are provided. The array substrate includes a base substrate, a polarizer, a plurality of active elements, a first organic protective layer and a first inorganic protective layer. The polarizer is located on a first side of the base substrate; the plurality of active elements are arranged in an array form and provided on a second side of the base substrate opposite to the first side; the first organic protective layer is located on a side of the polarizer facing away from the base substrate and covers the polarizer; and the first inorganic protective layer is located on a side of the first organic protective layer facing away from the polarizer and covers the first organic protective layer.

Abstract: The present disclosure provides a wiring structure, a preparation method thereof, and a display device. The wiring structure includes a substrate; a pre-arranged layer located on the substrate; and an electrode wiring covering the pre-arranged layer; wherein in the direction perpendicular to an extending direction of the electrode wiring and parallel to a plane on which the substrate is located, an orthographic projection of the pre-arranged layer on the substrate is located within an orthographic projection of the electrode wiring on the substrate, and a side surface of the pre-arranged layer is inclined relative to the plane on which the substrate is located.

Abstract: The present disclosure provides a floating touch camera module, a display device and a touch method. The floating touch camera module includes: a lens with a light collection surface and a light emitting surface; an image sensor at one side of the light emitting surface of the lens, the image sensor configured to receive light rays from the lens and form sensing information; and an infrared cut filter film at one side of a light incident surface of the image sensor and configured to filter out infrared light rays. The infrared cut filter film is movable relative to the lens between a first position at which the infrared cut filter film directly faces the lens and a second position at which the infrared cut filter film is offset from the lens, thereby enabling the floating touch camera module to switch between a photographing mode and a touch mode.

Abstract: The present disclosure provides a thin film transistor (TFT) substrate and a display device, the TFT substrate includes an base substrate and a plurality of pixel units, wherein each of the pixel units includes a TFT on the base substrate, the TFT includes a source drain layer, an active layer, and a gate layer; the TFT substrate further includes a light shielding layer on a side of the source drain layer of the TFT distal to the base substrate, and an orthographic projection of the light shielding layer on the base substrate completely covers an orthographic projection of the active layer of the TFT on the base substrate, and partially covers an orthographic projection of the gate layer of the TFT on the base substrate.

Abstract: Provided is a display panel, including a drive backplate, light emitting elements and a light reflecting layer located on the drive backplate, where the light reflecting layer includes a first light reflecting layer made of a metal and wrapping sidewalls of the light emitting elements, and the first light reflecting layer is configured to enable light emitted by each of the light emitting elements to be guided out from a top portion of the light emitting element. Further provided are a display apparatus and a method of manufacturing a display panel.

Abstract: A light-emitting diode substrate, a manufacturing method thereof, and a display device are disclosed. The manufacturing method of the light-emitting diode substrate includes: forming an epitaxial layer group of M light-emitting diode chips on a substrate; transferring N epitaxial layer groups on N substrates onto a transition carrier substrate, the N epitaxial layer groups on the N substrates being densely arranged on the transition carrier substrate; and transferring at least part of N*M light-emitting diode chips corresponding to the N epitaxial layer groups on the transition carrier substrate onto a driving substrate, an area of the transition carrier substrate is greater than or equal to a sum of areas of the N substrates, M is a positive integer greater than or equal to 2, and N is a positive integer greater than or equal to 2.

Abstract: The present disclosure provides a display backplane including an array substrate including at least one pixel unit each including at least one TFT; a planarization layer covering the array substrate; a pad layer including pads on the planarization layer, surface of the pad away from the planarization layer being first surface, each pixel unit being provided with one pad electrically coupled to a driving thin film transistor in a corresponding pixel unit through via hole penetrating through the planarization layer; a passivation layer covering the pad layer and including through holes, each pad corresponding to one through hole, such that the first surface of each pad is exposed through corresponding through hole, and area of top opening of through hole is smaller than area of bottom opening thereof. The present disclosure further provides a fabrication method of the display backplane, a display panel and a fabrication method thereof.