Abstract: The present disclosure provides a field of display technologies, and in particular, to a LTPS substrate and a fabricating method thereof, a thin film transistor thereof, an array substrate thereof, and a display device thereof. The LTPS substrate, able to be used for the fabrication of a thin film transistor, includes a light shielding layer, the light shielding layer mainly composed of amorphous silicon doped with a lanthanide element. The present disclosure mainly employs an amorphous silicon film layer doped with the lanthanide element as the light shielding layer of the LTPS substrate, which not only ensures the light shielding efficiency but also reduces the production process, and further prevents the occurrence of the H explosion problem due to H exuding during the ELA process.

Abstract: The present disclosure provides a driving backplane, including: a base substrate, a driving circuit arranged on the base substrate, an insulation layer on a side of the driving circuit facing away from the base substrate, a plurality of first tip structures arranged on a side of the insulation layer facing away from the base substrate, and a plurality of contact electrodes arranged on the side of the insulation layer facing away from the base substrate. The driving circuit includes a plurality of output terminals, the insulation layer includes a plurality of openings and the output terminals and the openings are in a one-to-one correspondence. The contact electrodes are electrically connected with the output terminals through the openings. Each of the contact electrodes covers the plurality of first tip structures to constitute a plurality of second tip structures having the same appearance as the first tip structures.

Abstract: An array substrate, manufacturing method thereof, and a display device according to some arrangements of the present disclosure include: a first transistor and a second transistor; an active layer of the second transistor is disposed on a side of the interlayer dielectric layer of the first transistor away from the substrate; an insulating layer is disposed between the interlayer dielectric layer of the first transistor and the active layer of the second transistor, and the insulating layer has an ability to block hydrogen.

Abstract: The present disclosure provides a display backplane and a method for manufacturing the same, a display panel and a display device, and relates to the field of display technology. The display backplane includes a first backplane and a second backplane. The first backplane includes a first substrate, and a first thin film transistor, on the first substrate, configured to drive a light emitting unit. The second backplane, which is attached to a surface of the first substrate facing away from the first thin film transistor, includes a second substrate and at least one second thin film transistor located between the second substrate and the first substrate.

Abstract: A display panel and manufacturing method thereof, a display device. The display panel includes a base substrate, light-emitting element and a photoelectric conversion structure: the light-emitting element is disposed on the base substrate; the photoelectric conversion structure is disposed on the base substrate and configured to receive a part of light emitted by the light-emitting element, convert energy of light received by the photoelectric conversion structure into electric energy, and supply the electric energy to the light-emitting element.

Abstract: Disclosed are an array substrate, and a display device, and a method for manufacturing the same. The array substrate includes: a base substrate, and a thin film transistor, a planarization pattern, a bonding pattern, and a conductive structure that are disposed on the base substrate. The thin film transistor, the planarization pattern, and the bonding pattern are laminated in a direction going distally from the base substrate. The planarization pattern is provided with a via and a groove, the conductive structure is disposed in the via, wherein the bonding pattern is conductive and is electrically connected to the thin film transistor by the conductive structure, an orthographic projection of the bonding pattern on the base substrate falls outside an orthographic projection of the groove on the base substrate, and the groove is configured to accommodate an adhesive.

Abstract: A thin film transistor, a manufacturing method thereof, an array substrate, a display panel, and a display device are disclosed. The present disclosure is directed to the field of display technologies. The thin film transistor comprises a drain electrode and a source electrode. At least one of the drain electrode and the source electrode are an yttrium-doped first metal film, and a surface of the first metal film is yttrium-copper complex oxide formed by annealing.

Abstract: An array substrate, a method for manufacturing the same, a display panel, and a display device are provided. The array substrate comprises a substrate, a light shielding layer on the substrate, and a transistor arranged at a side of the light shielding layer away from the substrate, the transistor including an active layer.

Abstract: A drive backplane, a display panel, an electronic apparatus, and a method for preparing a drive backplane are provided in embodiments of the disclosure, all relating to the technical field of display technology, the drive backplane including: a base substrate; a driving device layer on the base substrate, comprising an electrode layer; a planarization layer, on a surface of the driving device layer facing away from the base substrate, and the planarization layer being provided with at least one projection portion and at least one base portion adjacent to the at least one projection portion both on a surface of the planarization layer facing away from the driving device layer, each projection portion having a greater thickness than that of each base portion; a conductive layer, on respective surface of each projection portion facing away from the driving device layer, the conductive layer being connected with the electrode layer of the driving device layer; a spacer layer, on a surface of the conductive layer

Abstract: The present disclosure provides a floating touch camera module, a display device and a touch method. The floating touch camera module includes: a lens with a light collection surface and a light emitting surface; an image sensor at one side of the light emitting surface of the lens, the image sensor configured to receive light rays from the lens and form sensing information; and an infrared cut filter film at one side of a light incident surface of the image sensor and configured to filter out infrared light rays. The infrared cut filter film is movable relative to the lens between a first position at which the infrared cut filter film directly faces the lens and a second position at which the infrared cut filter film is offset from the lens, thereby enabling the floating touch camera module to switch between a photographing mode and a touch mode.

Abstract: The present disclosure provides a flexible display panel, which includes: a flexible substrate; and a first pattern layer and a second pattern layer on the flexible substrate, which are spaced apart from each other in a thickness direction of the flexible display panel. The first pattern layer is a stress neutral layer of the flexible display panel. The first pattern layer includes a plurality of first touch electrode lines and a plurality of second touch electrode lines in a same layer, the first touch electrode lines are arranged to intersect with the second touch electrode lines, the second touch electrode lines are disconnected at intersections with the first touch electrode lines, the second pattern layer includes a plurality of bridging lines, and the bridging lines are arranged to electrically connect parts of the second touch electrode lines disconnected at the intersections.

Abstract: The present disclosure relates to a conductive layer, a thin film transistor and manufacturing methods therefor, an array substrate and a display device, in the field of displays. The conductive layer comprises: a metal layer and an organophosphorus-metal complex covering the metal layer. In the embodiments of the present disclosure, the organophosphorus-metal complex is manufactured on the surface of the metal layer to form the conductive layer. The conductive layer is adopted as an electrode material. In one aspect, the organophosphorus-metal complex has conductivity and can prevent the surface of metal from making contact with oxygen, thereby avoiding metal oxidation under the premise of not affecting the performances of the electrode when serving as a material of the electrode in a TFT. In the other aspect, the organophosphorus-metal complex can increase a binding force between the metal and photoresist and avoids stripping of the photoresist.

Abstract: An array substrate, a method of manufacturing the array substrate, and a display apparatus are disclosed. The array substrate includes: a base substrate; a plurality of sensing elements disposed on a first side of the base substrate and each configured to convert at least one of a light signal and an acoustic wave signal into an electrical signal; and a plurality of switching devices disposed on a second side of the base substrate opposite to the first side. The plurality of switching devices include a plurality of first switching elements, and each of the plurality of first switching elements is electrically connected to a corresponding one of the plurality of sensing elements to transmit the electrical signal.

Abstract: The present disclosure relates to a three-dimensional force recognition sensor, a driving method therefor and a display device. A first conductive layer and a second conductive layer are respectively provided on two sides of a pressure-sensitive conductive layer, wherein the first conductive layer includes multiple first electrode groups arranged side by side, and each first electrode group comprises at least two first electrodes which extend in a first direction and are arranged side by side and insulated from each other; and the second conductive layer comprises multiple second electrode groups arranged side by side, and each second electrode group comprises at least two second electrodes which extend in a second direction and are arranged side by side and insulated from each other.

Abstract: A micro LED display panel and a method for fabricating the same are disclosed, and the micro LED display panel includes a TFT back panel, and a micro LED fixed on the TFT back panel, wherein the TFT back panel includes a substrate, and a first insulation layer and a second insulation layer stacked over the substrate in that order, wherein the first insulation layer includes a groove filled with the second insulation layer, and a normal projection of the groove onto the substrate does not overlap with a normal projection of a TFT area in the TFT back panel onto the substrate, wherein the rigidity of the second insulation layer is lower than the rigidity of the first insulation layer.

Abstract: The present disclosure provides an OLED substrate and a display device. The OLED substrate includes a base substrate, and a thin-film transistor, a first electrode, and a light-emitting layer arranged in sequence on the base substrate, in which the OLED substrate further includes a light-shielding layer arranged between an active layer of the thin-film transistor and the first electrode.

Abstract: A conductive pattern and a method for manufacturing the same, a thin film transistor, a display substrate and a display device are provided. The method includes: step A, forming a metal layer on a base substrate; step B, forming a first conductive buffer layer on the metal layer; step C, patterning the metal layer and the first conductive buffer layer to form a conductive sub-pattern; and performing steps A to C repeatedly for N times to form N conductive sub-patterns that are stacked on the base substrate. The conductive pattern comprises the N conductive sub-patterns, and N is a positive integer greater than 1.

Abstract: A fabricating method of an array substrate includes: forming a first semiconductor pattern and a first insulating layer on a substrate; forming a first gate pattern and a second gate pattern isolated from each other; forming a second insulating layer; forming a second semiconductor pattern; forming a first metal pattern and a second metal pattern and a third metal pattern respectively lap-jointed with the second semiconductor pattern; forming a third insulating layer; and forming a first via hole, a second via hole, first source and drain electrodes, and second source and drain electrodes, where the first source and drain electrode are respectively connected to the first semiconductor pattern through the first via hole, and the second source and drain electrodes are respectively connected to the second semiconductor pattern through the second via hole.

Abstract: The present disclosure provides a flexible display panel, which comprises: a flexible substrate; and a first pattern layer and a second pattern layer on the flexible substrate, which are spaced apart from each other in a thickness direction of the flexible display panel. The first pattern layer is a stress neutral layer of the flexible display panel. The first pattern layer comprises a plurality of first touch electrode lines and a plurality of second touch electrode lines in a same layer, the first touch electrode lines are arranged to intersect with the second touch electrode lines, the second touch electrode lines are disconnected at intersections with the first touch electrode lines, the second pattern layer comprises a plurality of bridging lines, and the bridging lines are arranged to electrically connect parts of the second touch electrode lines disconnected at the intersections.

Abstract: Provided in an embodiment of the present invention are a manufacturing method of an electrode pattern, a thin film transistor and a manufacturing method thereof, and a display panel. The manufacturing method of an electrode pattern includes: forming a metal thin film; performing processing on the metal thin film to form a partner layer over a surface of the metal thin film, the partner layer being configured to react with a photoresist to form a hydrogen bond; and performing patterning to form an electrode.