Patents by Inventor Haizheng Zhong

Haizheng Zhong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170233645
    Abstract: Provided is a hybridized perovskite quantum dot material. The quantum dot material comprises a kernel and surface ligands. The kernel is formed by R1NH3AB3 or (R2NH3)2AB4, where R1 is methyl group, R2 is an organic molecular group, A is at least one selected from Ge, Sn, Pb, Sb, Bi, Cu and Mn, B is at least one selected from Cl, Br and I, A and B form a coordination octahedral structure, and R1NH3 or R2NH3 is filled in gaps of the coordination octahedral structure. The surface ligand is an organic acid or organic amine. The quantum dot material has a high fluorescence quantum yield.
    Type: Application
    Filed: May 2, 2017
    Publication date: August 17, 2017
    Inventors: Haizheng Zhong, Feng Zhang, Xiangang Wu, Hailong Huang, Yuwei Niu
  • Publication number: 20110039104
    Abstract: Related are a copper indium sulfide nanoparticle and a preparation method thereof. Copper salts, indium salts and alkane thiol are added to a non-polar organic solvent, and then are heated with stirring under inert gas atmosphere to dissolve until a dark red colloidal solution is obtained. The obtained colloidal solution is cooled to room temperature, and then a polar solvent is added. The copper indium sulfide semiconductor nanoparticles are obtained through centrifugal settling. The obtained copper indium sulfide semiconductor nanoparticles could be further washed and vacuum dried to give copper indium sulfide semiconductor nanoparticle powders. The obtained copper indium sulfide semiconductor nanoparticles have an average particle size of 2 to 10 nm and an emission spectrum of 600 to 800 nm in the near infrared region, quantum efficiency being close to 10%. The yield of the present method is up to 90%.
    Type: Application
    Filed: March 6, 2009
    Publication date: February 17, 2011
    Applicant: BAYER TECHNOLOGY SERVICES GMBH
    Inventors: Haizheng Zhong, Yongfang Li