Patents by Inventor Hajime Ohke

Hajime Ohke has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package
    Patent number: D395638
    Type: Grant
    Filed: January 30, 1997
    Date of Patent: June 30, 1998
    Assignee: Sony Corporation
    Inventors: Michio Koyama, Hajime Ohke