Semiconductor package

- Sony Corporation
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Description

FIG. 1 is a perspective view of a semiconductor package showing our new design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a left side elevational view thereof;

FIG. 4 is a front elevational view thereof;

FIG. 5 is a bottom plan view thereof;

FIG. 6 is a right side elevational view thereof;

FIG. 7 is a rear elevational view thereof;

FIG. 8 is a perspective view of another embodiment of a semiconductor package showing our new design; and,

FIG. 9 is a front elevational view of the embodiment of FIG. 8.

The rest of veiws of the embodiment of FIG. 8 are the same as those of the embodiment of FIG. 1.

Referenced Cited
U.S. Patent Documents
4681221 July 21, 1987 Chickanosky
5394009 February 28, 1995 Loo
5403776 April 4, 1995 Tsuji et al.
5557142 September 17, 1996 Gilmore et al.
5614742 March 25, 1997 Gessner et al.
Patent History
Patent number: D395638
Type: Grant
Filed: Jan 30, 1997
Date of Patent: Jun 30, 1998
Assignee: Sony Corporation (Tokyo)
Inventors: Michio Koyama (Tokyo), Hajime Ohke (Tokyo)
Primary Examiner: James Gandy
Assistant Examiner: Cathron B. Matta
Law Firm: Foley & Lardner
Application Number: 0/65,265
Classifications
Current U.S. Class: Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)
International Classification: 1303;