Abstract: To provide a medical device, whereby the non-specific absorption amount is reduced, its durability is excellent and eluents from the surface layer are reduced. The medical device comprises a device substrate and a surface layer provided on at least part of the surface of the device substrate in contact with water, wherein at least part of the surface of the device substrate is made of an inorganic material, the surface layer is made of a cured product of a compound having a biocompatible group and an alkoxysilyl group, the content of the biocompatible group in the compound is from 25 to 83% by mass, and the content of the alkoxysilyl group is from 2 to 70% by mass.

Abstract: An appropriate response to an event is recommended to a monitoring person. An event detection unit (12) detects an event based on video data, and an alert unit (13) issues a first alert when a first event is detected, and issues a second alert that is distinguished from the first alert when a second event relating to the first event is further detected in addition to the first event.

Abstract: In a microporous layer of the present embodiment, a falling angle of an aqueous solution containing 25 wt % of ethanol is less than 30° and a strength determined by SAICAS evaluation is more than 0.068 N.

Abstract: An active carbon molded body that comprises a plurality of active carbon granules that are formed from aggregates of active carbon particles. The active carbon granules include a fibrous granulation binder. The active carbon molded body is formed as a result of the plurality of active carbon granules being aggregated by means of the fibrous granulation binder in the active carbon granules. The present invention is also an active carbon molded body production method in which active carbon granules that have been formed by aggregating active carbon particles by means of a fibrous binder are molded by simultaneous application of heat and pressure without separate addition of a molding binder. The present invention thereby provides: an active carbon molded body that has high purification capacity and good production efficiency; and a production method for the active carbon molded body.

Abstract: An appropriate response to an event is recommended to a monitoring person. An event detection unit (12) detects an event based on video data, and an alert unit (13) issues a first alert when a first event is detected, and issues a second alert that is distinguished from the first alert when a second event relating to the first event is further detected in addition to the first event.

Abstract: An air-permeable adhesive sheet has air permeability in a thickness direction thereof and including an adhesive agent layer having first through holes extending in the thickness direction, wherein at least one surface of the adhesive agent layer forms an adhesive surface, the through holes have an average opening diameter of 1.0 to 50 ?m and an average interval of 5 to 400 ?m, and a variation in air permeability in the thickness direction is 22% or less as represented by a coefficient of variation of an air permeability measured according to Method B for air permeability measurement (Gurley method) specified in JIS L 1096: 2010, with an effective measurement area as a predetermined value selected from 0.5 to 2.0 mm2. The air-permeable adhesive sheet is a sheet capable of obtaining good characteristics such as air permeability even when being made into a sheet having a small area.

Abstract: Phosphors include a CaAlSiN3 family crystal phase, wherein the CaAlSiN3 family crystal phase comprises at least one element selected from the group consisting of Mn, Ce, Pr, Nd, Sm, Eu, Tb, Dy, Ho, Er, Tm, and Yb.

Abstract: A method includes providing a first wafer including a respective set of first metal bonding pads and at least one first alignment diagnostic structure, providing a second wafer including a respective set of second metal bonding pads and a respective set of second alignment diagnostic structures, overlaying the first wafer and the second wafer, measuring at least one of a current, voltage or contact resistance between the first alignment diagnostic structures and the second alignment diagnostic structures to determine an overlay offset, and bonding the second wafer to the first wafer.

Abstract: A method includes providing a first wafer including a respective set of first metal bonding pads and at least one first alignment diagnostic structure, providing a second wafer including a respective set of second metal bonding pads and a respective set of second alignment diagnostic structures, overlaying the first wafer and the second wafer, measuring at least one of a current, voltage or contact resistance between the first alignment diagnostic structures and the second alignment diagnostic structures to determine an overlay offset, and bonding the second wafer to the first wafer.

Abstract: Phosphors include a CaAlSiN3 family crystal phase, wherein the CaAlSiN3 family crystal phase comprises at least one element selected from the group consisting of Mn, Ce, Pr, Nd, Sm, Eu, Tb, Dy, Ho, Er, Tm, and Yb.

Abstract: An air-permeable adhesive sheet has air permeability in a thickness direction thereof and including an adhesive agent layer having first through holes extending in the thickness direction, wherein at least one surface of the adhesive agent layer forms an adhesive surface, the through holes have an average opening diameter of 1.0 to 50 ?m and an average interval of 5 to 400 ?m, and a variation in air permeability in the thickness direction is 22% or less as represented by a coefficient of variation of an air permeability measured according to Method B for air permeability measurement (Gurley method) specified in JIS L 1096: 2010, with an effective measurement area as a predetermined value selected from 0.5 to 2.0 mm2. The air-permeable adhesive sheet is a sheet capable of obtaining good characteristics such as air permeability even when being made into a sheet having a small area.

Abstract: Phosphors include a CaAlSiN3 family crystal phase, wherein the CaAlSiN3 family crystal phase comprises at least one element selected from the group consisting of Mn, Ce, Pr, Nd, Sm, Eu, Tb, Dy, Ho, Er, Tm, and Yb.

Abstract: A bonded assembly includes a first stack containing a first semiconductor die bonded to a second semiconductor die along a stacking direction, first external bonding pads formed within the first semiconductor die, and bonding connection wires. Each of the bonding connection wires extends over a sidewall of the first semiconductor die and protrudes into the first semiconductor die through the sidewall of the first semiconductor die to contact a respective one of the first external bonding pads.

Abstract: A bonded assembly includes a first stack containing a first semiconductor die bonded to a second semiconductor die along a stacking direction, first external bonding pads formed within the first semiconductor die, and bonding connection wires. Each of the bonding connection wires extends over a sidewall of the first semiconductor die and protrudes into the first semiconductor die through the sidewall of the first semiconductor die to contact a respective one of the first external bonding pads.

Abstract: A bonded structure may be formed by measuring die areas of first semiconductor dies on a wafer at a measurement temperature, generating a two-dimensional map of local target temperatures that are estimated to thermally adjust a die area of each of the first semiconductor dies to a target die area, loading the wafer to a bonding apparatus comprising at least one temperature sensor, and iteratively bonding a plurality of second semiconductor dies to a respective one of the first semiconductor dies by sequentially adjusting a temperature of the wafer to a local target temperature of a respective first semiconductor die that is bonded to a respective one of the second semiconductor dies. An apparatus for forming such a bonded structure may include a computer, a chuck for holding the wafer, a die attachment unit, and a temperature control mechanism.

Abstract: The polymer film of the present invention has through holes extending from one principal surface of the polymer film to the other principal surface of the polymer film. The through holes are straight holes having a central axis extending straight, and have a shape in which the area of a cross-section perpendicular to the direction of the central axis increases from the one principal surface of the polymer film toward the other principal surface. This polymer film has passages in its thickness direction, has an unconventional structure, and can be used in various applications, such as in a waterproof sound-permeable membrane, in a waterproof gas-permeable membrane, and in a suction sheet. The ratio a/b of the opening diameter a of the through holes at the one principal surface to the opening diameter b of the through holes at the other principal surface is 80% or is less than 80%.

Abstract: The present invention provides an air-permeable filter capable of maintaining excellent air permeation performance without being clogged even in an environment involving exposure to an oil, oil mist, or ink. The present invention relates to an air-permeable filter including a porous membrane having a surface coated with an oil-repellent agent, the filter being characterized in that a sliding angle of 20 ?l of hexadecane or pentadecane on the surface of the filter is 60° or less.

Abstract: An acoustic resistor for use in an audio device includes a resin film having air permeability in a thickness direction of the resin film, and the resin film is a non-porous film having through holes formed to extend straight through the resin film in the thickness direction. This acoustic resistor is used in an audio device including: a transducing part that performs conversion between sound and an electrical signal and that includes an acoustic element; a housing enclosing the transducing part and having at least one opening; and a passage for gas that is present inside the housing and communicates with the opening and in which the acoustic element is placed. The acoustic resistor is placed between the opening and the acoustic element in the passage. The variation in properties of the acoustic resistor of the present disclosure can be made smaller than that of conventional acoustic resistors.