Patents by Inventor Hajime Yamamoto

Hajime Yamamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11969830
    Abstract: An aluminum alloy brazing sheet including a core material, a sacrificial material provided on one surface of the core material, a brazing filler material provided on the other surface side of the core material, and an intermediate layer provided between the core material and the brazing filler material. The core material contains Si: 0.30 to 1.00 mass %, Mn: 0.50 to 2.00 mass %, Cu: 0.60 to 1.20 mass %, Mg: 0.05 to 0.80 mass %, and Al. The sacrificial material contains Si: 0.10 to 1.20 mass %, Zn: 2.00 to 7.00 mass %, Mn: 0.40 mass % or less, and Al. The intermediate layer contains Si: 0.05 to 1.20 mass %, Mn: 0.50 to 2.00 mass %, Cu: 0.10 to 1.20 mass %, and Al.
    Type: Grant
    Filed: January 29, 2021
    Date of Patent: April 30, 2024
    Assignee: Kobe Steel, Ltd.
    Inventors: Tatsuki Hashimoto, Kenichiro Yoshida, Yuji Shibuya, Akihiro Tsuruno, Yoshikazu Miyano, Hajime Sugito, Michiyasu Yamamoto, Masayuki Makita, Arisu Fujii, Shin Takewaka, Hayaki Teramoto, Koichi Yamamoto, Toshihide Ninagawa
  • Publication number: 20240123623
    Abstract: A control device controls a robot in which a sensor is disposed, the control device comprising: a sensor coordinate storage unit for storing coordinate system information of a sensor coordinate system; a sensor setting storage unit for storing setting information; a sensor data receiving unit for receiving sensor data; an axis angle detection unit for detecting an angle of each of a plurality of axes included in the robot; a sensor value estimation unit for estimating a sensor value to be detected; and an anomalous sensor value determination unit for comparing the value of the sensor data and the sensor value estimated by the sensor value estimation unit and determining that the sensor data receiving unit is receiving sensor data from a sensor of another robot if the difference between the value of the sensor data and the estimated sensor value exceeds a preset threshold value.
    Type: Application
    Filed: March 22, 2022
    Publication date: April 18, 2024
    Inventors: Kouichirou HAYASHI, Tomoyuki YAMAMOTO, Hajime SUZUKI
  • Patent number: 11951692
    Abstract: The purpose of the present invention is to provide a fiber-reinforced resin material having minimal directionality of strength as well as excellent productivity, a method and device for manufacturing a fiber-reinforced resin material whereby a molded article is obtained, and a device for inspecting a fiber bundle group. A method for manufacturing a sheet-shaped fiber-reinforced resin material in which a paste (P1) is impregnated between cut fiber bundles (CF), the method for manufacturing a fiber-reinforced resin material including a coating step applying a coating of a paste (P1) on a first sheet (S11) conveyed in a predetermined direction, a cutting step for cutting a long fiber bundle (CF) using a cutter (113A), a scattering step for dispersing the cut fiber bundles (CF) and scattering the cut fiber bundles (CF) on the paste (P1), and an impregnation step for pressing a fiber bundle group (F1) and the paste (P1) on the first sheet (S11) and impregnating the paste (P1) between the fiber bundles (CF).
    Type: Grant
    Filed: January 18, 2023
    Date of Patent: April 9, 2024
    Assignee: Mitsubishi Chemical Corporation
    Inventors: Hiroshi Iwata, Nobuyuki Yamamoto, Hajime Okutsu, Ryuichi Ishikawa, Koichi Akiyama, Takayuki Kobayashi
  • Publication number: 20240080330
    Abstract: A security monitoring apparatus (100) includes a content category deducing unit (122), a category comparing unit (123), and an information assignment unit (130). The content category deducing unit (122) deduces a first deduced category that is a result of deducing a category of content that a target device that a monitoring target system (200) includes has, using a content category deducing model that is a learning model that deduces using content data that indicates content, a category of content indicated in the content data, and data that indicates content that the target device has. The category comparing unit (123) verifies whether or not the first deduced category and a category for comparison match. The information assignment unit (130) generates assignment information that is in accordance with whether or not the first deduced category and the category for comparison match.
    Type: Application
    Filed: October 30, 2023
    Publication date: March 7, 2024
    Applicant: Mitsubishi Electric Corporation
    Inventors: Aiko IWASAKI, Takumi YAMAMOTO, Hajime KOBAYASHI, Kiyoto KAWAUCHI
  • Patent number: 11912908
    Abstract: An air-permeable adhesive sheet has air permeability in a thickness direction thereof and including an adhesive agent layer having first through holes extending in the thickness direction, wherein at least one surface of the adhesive agent layer forms an adhesive surface, the through holes have an average opening diameter of 1.0 to 50 ?m and an average interval of 5 to 400 ?m, and a variation in air permeability in the thickness direction is 22% or less as represented by a coefficient of variation of an air permeability measured according to Method B for air permeability measurement (Gurley method) specified in JIS L 1096: 2010, with an effective measurement area as a predetermined value selected from 0.5 to 2.0 mm2. The air-permeable adhesive sheet is a sheet capable of obtaining good characteristics such as air permeability even when being made into a sheet having a small area.
    Type: Grant
    Filed: December 23, 2019
    Date of Patent: February 27, 2024
    Assignee: NITTO DENKO CORPORATION
    Inventors: Hajime Yamamoto, Hiroki Kigami, Marie Aizuka
  • Patent number: 11697765
    Abstract: Phosphors include a CaAlSiN3 family crystal phase, wherein the CaAlSiN3 family crystal phase comprises at least one element selected from the group consisting of Mn, Ce, Pr, Nd, Sm, Eu, Tb, Dy, Ho, Er, Tm, and Yb.
    Type: Grant
    Filed: June 29, 2021
    Date of Patent: July 11, 2023
    Assignees: MITSUBISHI CHEMICAL CORPORATION, NATIONAL INSTITUTE FOR MATERIALS SCIENCE, NICHIA CORPORATION, CITIZEN ELECTRONICS CO., LTD.
    Inventors: Naoto Hirosaki, Kyota Ueda, Hajime Yamamoto
  • Patent number: 11569139
    Abstract: A method includes providing a first wafer including a respective set of first metal bonding pads and at least one first alignment diagnostic structure, providing a second wafer including a respective set of second metal bonding pads and a respective set of second alignment diagnostic structures, overlaying the first wafer and the second wafer, measuring at least one of a current, voltage or contact resistance between the first alignment diagnostic structures and the second alignment diagnostic structures to determine an overlay offset, and bonding the second wafer to the first wafer.
    Type: Grant
    Filed: March 8, 2021
    Date of Patent: January 31, 2023
    Assignee: WESTERN DIGITAL TECHNOLOGIES, INC.
    Inventors: Ikue Yokomizo, Michiaki Sano, Kazuto Watanabe, Hajime Yamamoto, Takashi Yamaha, Koichi Ito, Katsuya Kato, Ryo Hiramatsu, Hiroshi Sasaki, Akihiro Tobioka, Liang Li
  • Publication number: 20220285234
    Abstract: A method includes providing a first wafer including a respective set of first metal bonding pads and at least one first alignment diagnostic structure, providing a second wafer including a respective set of second metal bonding pads and a respective set of second alignment diagnostic structures, overlaying the first wafer and the second wafer, measuring at least one of a current, voltage or contact resistance between the first alignment diagnostic structures and the second alignment diagnostic structures to determine an overlay offset, and bonding the second wafer to the first wafer.
    Type: Application
    Filed: March 8, 2021
    Publication date: September 8, 2022
    Inventors: Ikue YOKOMIZO, Michiaki SANO, Kazuto WATANABE, Hajime YAMAMOTO, Takashi YAMAHA, Koichi ITO, Katsuya KATO, Ryo HIRAMATSU, Hiroshi SASAKI, Akihiro TOBIOKA, Liang LI
  • Publication number: 20220056310
    Abstract: An air-permeable adhesive sheet has air permeability in a thickness direction thereof and including an adhesive agent layer having first through holes extending in the thickness direction, wherein at least one surface of the adhesive agent layer forms an adhesive surface, the through holes have an average opening diameter of 1.0 to 50 ?m and an average interval of 5 to 400 ?m, and a variation in air permeability in the thickness direction is 22% or less as represented by a coefficient of variation of an air permeability measured according to Method B for air permeability measurement (Gurley method) specified in JIS L 1096: 2010, with an effective measurement area as a predetermined value selected from 0.5 to 2.0 mm2. The air-permeable adhesive sheet is a sheet capable of obtaining good characteristics such as air permeability even when being made into a sheet having a small area.
    Type: Application
    Filed: December 23, 2019
    Publication date: February 24, 2022
    Applicant: NITTO DENKO CORPORATION
    Inventors: Hajime YAMAMOTO, Hiroki KIGAMI, Marie AIZUKA
  • Publication number: 20220056339
    Abstract: Phosphors include a CaAlSiN3 family crystal phase, wherein the CaAlSiN3 family crystal phase comprises at least one element selected from the group consisting of Mn, Ce, Pr, Nd, Sm, Eu, Tb, Dy, Ho, Er, Tm, and Yb.
    Type: Application
    Filed: June 29, 2021
    Publication date: February 24, 2022
    Applicants: MITSUBISHI CHEMICAL CORPORATION, NATIONAL INSTITUTE FOR MATERIALS SCIENCE, NICHIA CORPORATION, CITIZEN ELECTRONICS CO., LTD.
    Inventors: Naoto HIROSAKI, Kyota UEDA, Hajime YAMAMOTO
  • Patent number: 11084980
    Abstract: Phosphors include a CaAlSiN3 family crystal phase, wherein the CaAlSiN3 family crystal phase comprises at least one element selected from the group consisting of Mn, Ce, Pr, Nd, Sm, Eu, Tb, Dy, Ho, Er, Tm, and Yb.
    Type: Grant
    Filed: August 6, 2018
    Date of Patent: August 10, 2021
    Assignees: MITSUBISHI CHEMICAL CORPORATION, NATIONAL INSTITUTE FOR MATERIALS SCIENCE, NICHIA CORPORATION, CITIZEN ELECTRONICS CO., LTD.
    Inventors: Naoto Hirosaki, Kyota Ueda, Hajime Yamamoto
  • Publication number: 20200321324
    Abstract: A bonded assembly includes a first stack containing a first semiconductor die bonded to a second semiconductor die along a stacking direction, first external bonding pads formed within the first semiconductor die, and bonding connection wires. Each of the bonding connection wires extends over a sidewall of the first semiconductor die and protrudes into the first semiconductor die through the sidewall of the first semiconductor die to contact a respective one of the first external bonding pads.
    Type: Application
    Filed: April 2, 2019
    Publication date: October 8, 2020
    Inventors: Michiaki Sano, Takashi YAMAHA, Koichi ITO, Ikue YOKOMIZO, Ryo HIRAMATSU, Kazuto WATANABE, Katsuya KATO, Hajime YAMAMOTO, Hiroshi SASAKI
  • Patent number: 10797035
    Abstract: A bonded assembly includes a first stack containing a first semiconductor die bonded to a second semiconductor die along a stacking direction, first external bonding pads formed within the first semiconductor die, and bonding connection wires. Each of the bonding connection wires extends over a sidewall of the first semiconductor die and protrudes into the first semiconductor die through the sidewall of the first semiconductor die to contact a respective one of the first external bonding pads.
    Type: Grant
    Filed: April 2, 2019
    Date of Patent: October 6, 2020
    Assignee: SANDISK TECHNOLOGIES LLC
    Inventors: Michiaki Sano, Takashi Yamaha, Koichi Ito, Ikue Yokomizo, Ryo Hiramatsu, Kazuto Watanabe, Katsuya Kato, Hajime Yamamoto, Hiroshi Sasaki
  • Patent number: 10790296
    Abstract: A bonded structure may be formed by measuring die areas of first semiconductor dies on a wafer at a measurement temperature, generating a two-dimensional map of local target temperatures that are estimated to thermally adjust a die area of each of the first semiconductor dies to a target die area, loading the wafer to a bonding apparatus comprising at least one temperature sensor, and iteratively bonding a plurality of second semiconductor dies to a respective one of the first semiconductor dies by sequentially adjusting a temperature of the wafer to a local target temperature of a respective first semiconductor die that is bonded to a respective one of the second semiconductor dies. An apparatus for forming such a bonded structure may include a computer, a chuck for holding the wafer, a die attachment unit, and a temperature control mechanism.
    Type: Grant
    Filed: May 21, 2019
    Date of Patent: September 29, 2020
    Assignee: SANDISK TECHNOLOGIES LLC
    Inventors: Takashi Yamaha, Katsuya Kato, Kazuto Watanabe, Hajime Yamamoto, Michiaki Sano, Koichi Ito, Ikue Yokomizo, Ryo Hiramatsu, Hiroshi Sasaki
  • Patent number: 10723850
    Abstract: The polymer film of the present invention has through holes extending from one principal surface of the polymer film to the other principal surface of the polymer film. The through holes are straight holes having a central axis extending straight, and have a shape in which the area of a cross-section perpendicular to the direction of the central axis increases from the one principal surface of the polymer film toward the other principal surface. This polymer film has passages in its thickness direction, has an unconventional structure, and can be used in various applications, such as in a waterproof sound-permeable membrane, in a waterproof gas-permeable membrane, and in a suction sheet. The ratio a/b of the opening diameter a of the through holes at the one principal surface to the opening diameter b of the through holes at the other principal surface is 80% or is less than 80%.
    Type: Grant
    Filed: September 24, 2015
    Date of Patent: July 28, 2020
    Assignee: NITTO DENKO CORPORATION
    Inventors: Satoru Furuyama, Masaaki Mori, Yozo Nagai, Yuuzou Muraki, Toshimitsu Tachibana, Hajime Yamamoto
  • Patent number: 10617986
    Abstract: The present invention provides an air-permeable filter capable of maintaining excellent air permeation performance without being clogged even in an environment involving exposure to an oil, oil mist, or ink. The present invention relates to an air-permeable filter including a porous membrane having a surface coated with an oil-repellent agent, the filter being characterized in that a sliding angle of 20 ?l of hexadecane or pentadecane on the surface of the filter is 60° or less.
    Type: Grant
    Filed: July 25, 2016
    Date of Patent: April 14, 2020
    Assignee: NITTO DENKO CORPORATION
    Inventors: Keiko Fujiwara, Yuta Kuroki, Hajime Yamamoto, Asuka Onohara
  • Patent number: 10362387
    Abstract: An acoustic resistor for use in an audio device includes a resin film having air permeability in a thickness direction of the resin film, and the resin film is a non-porous film having through holes formed to extend straight through the resin film in the thickness direction. This acoustic resistor is used in an audio device including: a transducing part that performs conversion between sound and an electrical signal and that includes an acoustic element; a housing enclosing the transducing part and having at least one opening; and a passage for gas that is present inside the housing and communicates with the opening and in which the acoustic element is placed. The acoustic resistor is placed between the opening and the acoustic element in the passage. The variation in properties of the acoustic resistor of the present disclosure can be made smaller than that of conventional acoustic resistors.
    Type: Grant
    Filed: February 22, 2016
    Date of Patent: July 23, 2019
    Assignee: NITTO DENKO CORPORATION
    Inventors: Bunta Hirai, Satoru Furuyama, Masaaki Mori, Hajime Yamamoto
  • Publication number: 20190127638
    Abstract: Phosphors include a CaAlSiN3 family crystal phase, wherein the CaAlSiN3 family crystal phase comprises at least one element selected from the group consisting of Mn, Ce, Pr, Nd, Sm, Eu, Tb, Dy, Ho, Er, Tm, and Yb.
    Type: Application
    Filed: August 6, 2018
    Publication date: May 2, 2019
    Applicants: MITSUBISHI CHEMICAL CORPORATION, NATIONAL INSTITUTE FOR MATERIALS SCIENCE, NICHIA CORPORATION, CITIZEN ELECTRONICS CO., LTD.
    Inventors: Naoto HIROSAKI, Kyota UEDA, Hajime YAMAMOTO
  • Patent number: D881556
    Type: Grant
    Filed: December 27, 2017
    Date of Patent: April 21, 2020
    Assignee: Benriner Co., LTD
    Inventor: Hajime Yamamoto
  • Patent number: D934038
    Type: Grant
    Filed: December 27, 2019
    Date of Patent: October 26, 2021
    Assignee: Benriner Co., LTD
    Inventor: Hajime Yamamoto