Patents by Inventor Hajime Yamamoto

Hajime Yamamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210318417
    Abstract: A light detection device includes a first photodiode, a second photodiode connected in series to the first photodiode, a first light source configured to output first pulsed light to which the first photodiode is sensitive, and a signal output unit configured to output a current as a detection signal, the current that flow through the second photodiode.
    Type: Application
    Filed: April 13, 2020
    Publication date: October 14, 2021
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Mitsuhito MASE, Keiki TAGUCHI, Hajime ISHIHARA, Hiroo YAMAMOTO, Akihiro SHIMADA
  • Patent number: 11084980
    Abstract: Phosphors include a CaAlSiN3 family crystal phase, wherein the CaAlSiN3 family crystal phase comprises at least one element selected from the group consisting of Mn, Ce, Pr, Nd, Sm, Eu, Tb, Dy, Ho, Er, Tm, and Yb.
    Type: Grant
    Filed: August 6, 2018
    Date of Patent: August 10, 2021
    Assignees: MITSUBISHI CHEMICAL CORPORATION, NATIONAL INSTITUTE FOR MATERIALS SCIENCE, NICHIA CORPORATION, CITIZEN ELECTRONICS CO., LTD.
    Inventors: Naoto Hirosaki, Kyota Ueda, Hajime Yamamoto
  • Publication number: 20200321324
    Abstract: A bonded assembly includes a first stack containing a first semiconductor die bonded to a second semiconductor die along a stacking direction, first external bonding pads formed within the first semiconductor die, and bonding connection wires. Each of the bonding connection wires extends over a sidewall of the first semiconductor die and protrudes into the first semiconductor die through the sidewall of the first semiconductor die to contact a respective one of the first external bonding pads.
    Type: Application
    Filed: April 2, 2019
    Publication date: October 8, 2020
    Inventors: Michiaki Sano, Takashi YAMAHA, Koichi ITO, Ikue YOKOMIZO, Ryo HIRAMATSU, Kazuto WATANABE, Katsuya KATO, Hajime YAMAMOTO, Hiroshi SASAKI
  • Patent number: 10797035
    Abstract: A bonded assembly includes a first stack containing a first semiconductor die bonded to a second semiconductor die along a stacking direction, first external bonding pads formed within the first semiconductor die, and bonding connection wires. Each of the bonding connection wires extends over a sidewall of the first semiconductor die and protrudes into the first semiconductor die through the sidewall of the first semiconductor die to contact a respective one of the first external bonding pads.
    Type: Grant
    Filed: April 2, 2019
    Date of Patent: October 6, 2020
    Assignee: SANDISK TECHNOLOGIES LLC
    Inventors: Michiaki Sano, Takashi Yamaha, Koichi Ito, Ikue Yokomizo, Ryo Hiramatsu, Kazuto Watanabe, Katsuya Kato, Hajime Yamamoto, Hiroshi Sasaki
  • Patent number: 10790296
    Abstract: A bonded structure may be formed by measuring die areas of first semiconductor dies on a wafer at a measurement temperature, generating a two-dimensional map of local target temperatures that are estimated to thermally adjust a die area of each of the first semiconductor dies to a target die area, loading the wafer to a bonding apparatus comprising at least one temperature sensor, and iteratively bonding a plurality of second semiconductor dies to a respective one of the first semiconductor dies by sequentially adjusting a temperature of the wafer to a local target temperature of a respective first semiconductor die that is bonded to a respective one of the second semiconductor dies. An apparatus for forming such a bonded structure may include a computer, a chuck for holding the wafer, a die attachment unit, and a temperature control mechanism.
    Type: Grant
    Filed: May 21, 2019
    Date of Patent: September 29, 2020
    Assignee: SANDISK TECHNOLOGIES LLC
    Inventors: Takashi Yamaha, Katsuya Kato, Kazuto Watanabe, Hajime Yamamoto, Michiaki Sano, Koichi Ito, Ikue Yokomizo, Ryo Hiramatsu, Hiroshi Sasaki
  • Patent number: 10723850
    Abstract: The polymer film of the present invention has through holes extending from one principal surface of the polymer film to the other principal surface of the polymer film. The through holes are straight holes having a central axis extending straight, and have a shape in which the area of a cross-section perpendicular to the direction of the central axis increases from the one principal surface of the polymer film toward the other principal surface. This polymer film has passages in its thickness direction, has an unconventional structure, and can be used in various applications, such as in a waterproof sound-permeable membrane, in a waterproof gas-permeable membrane, and in a suction sheet. The ratio a/b of the opening diameter a of the through holes at the one principal surface to the opening diameter b of the through holes at the other principal surface is 80% or is less than 80%.
    Type: Grant
    Filed: September 24, 2015
    Date of Patent: July 28, 2020
    Assignee: NITTO DENKO CORPORATION
    Inventors: Satoru Furuyama, Masaaki Mori, Yozo Nagai, Yuuzou Muraki, Toshimitsu Tachibana, Hajime Yamamoto
  • Patent number: 10617986
    Abstract: The present invention provides an air-permeable filter capable of maintaining excellent air permeation performance without being clogged even in an environment involving exposure to an oil, oil mist, or ink. The present invention relates to an air-permeable filter including a porous membrane having a surface coated with an oil-repellent agent, the filter being characterized in that a sliding angle of 20 ?l of hexadecane or pentadecane on the surface of the filter is 60° or less.
    Type: Grant
    Filed: July 25, 2016
    Date of Patent: April 14, 2020
    Assignee: NITTO DENKO CORPORATION
    Inventors: Keiko Fujiwara, Yuta Kuroki, Hajime Yamamoto, Asuka Onohara
  • Patent number: 10362387
    Abstract: An acoustic resistor for use in an audio device includes a resin film having air permeability in a thickness direction of the resin film, and the resin film is a non-porous film having through holes formed to extend straight through the resin film in the thickness direction. This acoustic resistor is used in an audio device including: a transducing part that performs conversion between sound and an electrical signal and that includes an acoustic element; a housing enclosing the transducing part and having at least one opening; and a passage for gas that is present inside the housing and communicates with the opening and in which the acoustic element is placed. The acoustic resistor is placed between the opening and the acoustic element in the passage. The variation in properties of the acoustic resistor of the present disclosure can be made smaller than that of conventional acoustic resistors.
    Type: Grant
    Filed: February 22, 2016
    Date of Patent: July 23, 2019
    Assignee: NITTO DENKO CORPORATION
    Inventors: Bunta Hirai, Satoru Furuyama, Masaaki Mori, Hajime Yamamoto
  • Publication number: 20190127638
    Abstract: Phosphors include a CaAlSiN3 family crystal phase, wherein the CaAlSiN3 family crystal phase comprises at least one element selected from the group consisting of Mn, Ce, Pr, Nd, Sm, Eu, Tb, Dy, Ho, Er, Tm, and Yb.
    Type: Application
    Filed: August 6, 2018
    Publication date: May 2, 2019
    Applicants: MITSUBISHI CHEMICAL CORPORATION, NATIONAL INSTITUTE FOR MATERIALS SCIENCE, NICHIA CORPORATION, CITIZEN ELECTRONICS CO., LTD.
    Inventors: Naoto HIROSAKI, Kyota UEDA, Hajime YAMAMOTO
  • Patent number: 10072207
    Abstract: Phosphors include a CaAlSiN3 family crystal phase, wherein the CaAlSiN3 family crystal phase comprises at least one element selected from the group consisting of Mn, Ce, Pr, Nd, Sm, Eu, Tb, Dy, Ho, Er, Tm, and Yb.
    Type: Grant
    Filed: June 19, 2017
    Date of Patent: September 11, 2018
    Assignees: MITSUBISHI CHEMICAL CORPORATION, NATIONAL INSTITUTE FOR MATERIALS SCIENCE, NICHIA CORPORATION, CITIZEN ELECTRONICS CO. LTD.
    Inventors: Naoto Hirosaki, Kyota Ueda, Hajime Yamamoto
  • Publication number: 20180193804
    Abstract: A resin film has through holes formed to extend through the thickness of the resin film. The through holes are pillar-shaped. An average density of the through holes is 1×106 to 1×1012 holes/cm2. An average diameter of the through holes is 1 to 310 nm. A degree of variability of the diameter of the through holes is 30% or less, the degree of variability of the diameter of the through holes obtained by dividing a standard deviation of the diameter of the through holes by the average diameter of the through holes and multiplying the resulting value by 100.
    Type: Application
    Filed: June 1, 2016
    Publication date: July 12, 2018
    Applicant: NITTO DENKO CORPORATION
    Inventors: Hajime YAMAMOTO, Tsukasa MIYAZAKI, Yuuki TAKEDA, Satoru FURUYAMA
  • Publication number: 20180193787
    Abstract: The present invention provides an air-permeable filter capable of maintaining excellent air permeation performance without being clogged even in an environment involving exposure to an oil, oil mist, or ink. The present invention relates to an air-permeable filter including a porous membrane having a surface coated with an oil-repellent agent, the filter being characterized in that a sliding angle of 20 ?l of hexadecane or pentadecane on the surface of the filter is 60° or less.
    Type: Application
    Filed: July 25, 2016
    Publication date: July 12, 2018
    Applicant: NITTO DENKO CORPORATION
    Inventors: Keiko FUJIWARA, Yuta KUROKI, Hajime YAMAMOTO, Asuka ONOHARA
  • Patent number: 9975263
    Abstract: A slicer is provided which slices a slicing subject with a uniform thickness and can be used in a sanitized manner. The slicer includes a resin-made frame which supports both ends of a slicing blade, a resin-made movable support plate attached to the frame so as to be able to ascend and descend, first reinforcing members buried in the frame, a second reinforcing member buried at one end of the movable support member in a width direction, and a third reinforcing member buried at the other end. The first reinforcing members, the second reinforcing member, and the third reinforcing member absorb bending stress acting on the slicer.
    Type: Grant
    Filed: October 17, 2015
    Date of Patent: May 22, 2018
    Assignee: Benriner Co., LTD
    Inventor: Hajime Yamamoto
  • Publication number: 20180035203
    Abstract: A waterproof sound transmission structure of the present disclosure includes: a wall separating a first space from a second space where water can be present, the wall being provided with a sound transmission port for transmission of sound between the first and second spaces; and a waterproof sound-permeable membrane placed to cover the sound transmission port, the waterproof sound-permeable membrane being adapted to permit transmission of sound between the first and second spaces and being further adapted to prevent ingress of water from the second space into the first space through the sound transmission port. The first space is sealed when the second space is filled with water, the sealed first space having a volume of 300 mm3 or less. The waterproof sound transmission structure of the present disclosure has higher levels of both waterproofness and sound permeability than conventional waterproof sound transmission structures.
    Type: Application
    Filed: February 22, 2016
    Publication date: February 1, 2018
    Applicant: NITTO DENKO CORPORATION
    Inventors: Bunta HIRAI, Satoru FURUYAMA, Masaaki MORI, Hajime YAMAMOTO
  • Publication number: 20180020284
    Abstract: An acoustic resistor for use in an audio device includes a resin film having air permeability in a thickness direction of the resin film, and the resin film is a non-porous film having through holes formed to extend straight through the resin film in the thickness direction. This acoustic resistor is used in an audio device including: a transducing part that performs conversion between sound and an electrical signal and that includes an acoustic element; a housing enclosing the transducing part and having at least one opening; and a passage for gas that is present inside the housing and communicates with the opening and in which the acoustic element is placed. The acoustic resistor is placed between the opening and the acoustic element in the passage. The variation in properties of the acoustic resistor of the present disclosure can be made smaller than that of conventional acoustic resistors.
    Type: Application
    Filed: February 22, 2016
    Publication date: January 18, 2018
    Applicant: NITTO DENKO CORPORATION
    Inventors: Bunta HIRAI, Satoru FURUYAMA, Masaaki MORI, Hajime YAMAMOTO
  • Publication number: 20170292000
    Abstract: The polymer film of the present invention has through holes extending from one principal surface of the polymer film to the other principal surface of the polymer film. The through holes are straight holes having a central axis extending straight, and have a shape in which the area of a cross-section perpendicular to the direction of the central axis increases from the one principal surface of the polymer film toward the other principal surface. This polymer film has passages in its thickness direction, has an unconventional structure, and can be used in various applications, such as in a waterproof sound-permeable membrane, in a waterproof gas-permeable membrane, and in a suction sheet. The ratio a/b of the opening diameter a of the through holes at the one principal surface to the opening diameter b of the through holes at the other principal surface is 80% or is less than 80%.
    Type: Application
    Filed: September 24, 2015
    Publication date: October 12, 2017
    Applicant: NITTO DENKO CORPORATION
    Inventors: Satoru FURUYAMA, Masaaki MORI, Yozo NAGAI, Yuuzou MURAKI, Toshimitsu TACHIBANA, Hajime YAMAMOTO
  • Publication number: 20170283261
    Abstract: Phosphors include a CaAlSiN3 family crystal phase, wherein the CaAlSiN3 family crystal phase comprises at least one element selected from the group consisting of Mn, Ce, Pr, Nd, Sm, Eu, Tb, Dy, Ho, Er, Tm, and Yb.
    Type: Application
    Filed: June 19, 2017
    Publication date: October 5, 2017
    Applicants: MITSUBISHI CHEMICAL CORPORATION, NATIONAL INSTITUTE FOR MATERIALS SCIENCE, NICHIA CORPORATION, CITIZEN ELECTRONICS CO., LTD.
    Inventors: Naoto HIROSAKI, Kyota UEDA, Hajime YAMAMOTO
  • Patent number: 9738829
    Abstract: Phosphors include a CaAlSiN3 family crystal phase, wherein the CaAlSiN3 family crystal phase comprises at least one element selected from the group consisting of Mn, Ce, Pr, Nd, Sm, Eu, Tb, Dy, Ho, Er, Tm, and Yb.
    Type: Grant
    Filed: June 11, 2015
    Date of Patent: August 22, 2017
    Assignees: MITSUBISHI CHEMICAL CORPORATION, National Institute for Materials Science, Nichia Corporation, Citizen Electronics CO., Ltd.
    Inventors: Naoto Hirosaki, Kyota Ueda, Hajime Yamamoto
  • Patent number: 9687992
    Abstract: A slicer that can slice a material to be sliced with a uniform thickness and can also be used sanitarily. A slicer 1 which includes a slice width adjusting mechanism 100 that is provided with a slice width adjusting dial 60 having a cylindrical shape that has a screw portion 62 formed on an outer peripheral surface and is capable of supporting the rear surface 40c of a movable supporting plate 40, a screw receiving hole 13 that is integrally formed with a frame 10 and capable of being engaged with the screw portion 62, and a first rib 45 that is formed on the rear surface 40c of the movable supporting plate 40 so as to stand thereon and capable of being fitted into the slice width adjusting dial 60.
    Type: Grant
    Filed: November 12, 2014
    Date of Patent: June 27, 2017
    Assignee: Benriner Co., LTD
    Inventor: Hajime Yamamoto
  • Patent number: D881556
    Type: Grant
    Filed: December 27, 2017
    Date of Patent: April 21, 2020
    Assignee: Benriner Co., LTD
    Inventor: Hajime Yamamoto