Abstract: In an ultrasonic imaging system and an ultrasonic imaging method using the ultrasonic imaging system, the system includes a channel part, a correction part, an imaging part and a reference information providing part. The channel part has a plurality of channels configured to send and receive an ultrasonic signal. The correction part is configured to correct distortion caused by an ultrasonic barrier in the ultrasonic signal received by the channel part. The imaging part is configured to image the ultrasonic signal to an ultrasonic image. The reference information providing part is configured to provide reference information required for the correction to the correction part. The correction part is configured to determine a sample section using the reference information, and to correct attenuation distortion and aberration distortion caused by the ultrasonic barrier based on a signal of the sample section.

Abstract: In a volumetric display and a head-mounted display having the volumetric display, the volumetric display includes a plurality of self-luminous display panels and a plurality of shutter panels. The display panels are configured to display an image forwardly, and are spaced apart from each other along a forward and backward direction. Each of the shutter panels is disposed between the self-luminous display panels adjacent to each other. A pixel of the self-luminous display panel corresponds to a pixel of the shutter panel. The shutter panel adjusts transmittance of a light emitted at a plurality of the pixels of the self-luminous display panel which is disposed at a rear side of the shutter panel, for each pixel.

Abstract: The provided is an ultra-wideband electromagnetic wave absorber having a hexagonal double layer structure, and in the ultra-wideband electromagnetic wave absorber, the first conductive pattern disposed on the top of the first dielectric layer and the second conductive pattern disposed on the top of the second dielectric layer are arranged in an up-down double layer structure, thereby expanding the electromagnetic wave absorption bandwidth, and even when applied to a corner or a curved structure forming 60° or 120° by hexagonal unit cells, the unit cells can be periodically arranged at the same interval. In addition, since dielectrics with a difference of less than 10% in dielectric constant in a vacuum state have a relatively low specific gravity, the overall weight can be made very light by using such dielectrics in the first dielectric layer and the second dielectric layer.

Abstract: A selective continuous transferring apparatus includes a roll and a sticking layer. The roll has an elastic surface, and contacts a source substrate with a receiving substrate to transfer elements on the source substrate to a lower surface of the receiving substrate 520. A plurality of the elements is arranged on an upper surface of the source substrate. The sticking layer has a predetermined pattern in a partial area of the lower surface of the receiving substrate. The elements are attached to the sticking layer. The roll pressurizes a series of stacked layer of the source substrate, the elements and the receiving substrate, so that the elements disposed corresponding to the sticking layer of the receiving substrate are partially and selectively transferred on the receiving substrate.

Abstract: A selective continuous transferring apparatus includes a roll and a sticking layer. The roll has an elastic surface, and contacts a source substrate with a receiving substrate to transfer elements on the source substrate to a lower surface of the receiving substrate 520. A plurality of the elements is arranged on an upper surface of the source substrate. The sticking layer has a predetermined pattern in a partial area of the lower surface of the receiving substrate. The elements are attached to the sticking layer. The roll pressurizes a series of stacked layer of the source substrate, the elements and the receiving substrate, so that the elements disposed corresponding to the sticking layer of the receiving substrate are partially and selectively transferred on the receiving substrate.

Abstract: In an apparatus and a method for synchronizing a roll-to-roll transfer device, the apparatus includes a thin-film, a first roller, a second roller, a first load sensing element and a control part. The thin-film is transferred by the roll-to-roll transfer device. The first roller makes contact with a lower surface of the thin-film, and rotates with a rotational axis via a first rotational element. The second roller is disposed over the first roller, makes contact with an upper surface of the thin-film, and rotates with the rotational axis via a second rotational element. The first load sensing element senses a load of the first roller or a load of the second roller. The control part synchronizes a translational velocity of the first rotational element or the second rotational element based on the load sensed by the first load sensing element.

Abstract: In an apparatus and a method for synchronizing a roll-to-roll transfer device, the apparatus includes a thin-film, a first roller, a second roller, a first load sensing element and a control part. The thin-film is transferred by the roll-to-roll transfer device. The first roller makes contact with a lower surface of the thin-film, and rotates with a rotational axis via a first rotational element. The second roller is disposed over the first roller, makes contact with an upper surface of the thin-film, and rotates with the rotational axis via a second rotational element. The first load sensing element senses a load of the first roller or a load of the second roller. The control part synchronizes a translational velocity of the first rotational element or the second rotational element based on the load sensed by the first load sensing element.

Abstract: The present invention relates to an apparatus for massive manufacturing a hierarchical structure that can hierarchically form high performance micro units one a flexible substrate. For this purpose, an apparatus for manufacturing a hierarchical structure according to the present invention is provided to layer micro units provided on a dummy substrate that is made of a hard material on a target substrate that is made of a flexible material by releasing the micro units from the dummy substrate. The apparatus includes: a transfer stage flat-transferring the dummy substrate by supporting the same and a main roller rolling the target substrate by winding the same as the transfer stage proceeds and layering the micro unit of the dummy substrate on the target substrate.

Abstract: The present invention relates to a micro contact probe used for a probe card. An exemplary embodiment of the present invention provides a micro contact probe including a coating layer of a nanostructure such as carbon nanotubes formed on a surface thereof to reduce contact resistance when contacting a semiconductor chip. According to the micro contact probe of which the surface is coated with the nanostructure, contact resistance between the probe and the semiconductor chip is lowered and the high frequency characteristics are improved, such that a more accurate measurement can be obtained.

Abstract: An exemplary embodiment of the present invention provides a vertical micro contact probe that includes a column formed by longitudinally continuously stacking a plurality of basic units and a front end formed at the front end of the column and contacting an electrode pad of a semiconductor chip. The basic unit includes a probe body alternately bending to the left and right and protrusions protruding from the probe body at the left and right sides from the center of the width direction, and contacting the adjacent probe body to support the probe body under compression.

Abstract: Provided are a shape of a hierarchical structure, an engineering effect of the hierarchical structure according to the shape, an increasing method of the engineering effect, an application method of the hierarchical structure for novel material or parts, and a mass-manufacturing method of the hierarchical structure. The present invention relates to a hierarchical structure and a manufacturing method thereof, and includes a hierarchical structure in which at least one nano-object that has a characteristic length of a nanoscale region in an internal matrix is arranged in a predetermined pattern. According to the exemplary embodiments of the present invention, an excellent characteristic that is generated in a nanoscale region may be used in a structure of a macroscopic scale region, and structures that have different scales may be simply interconnected or interfaced regardless of the different scales.

Abstract: According to the present invention, allowable displacement can be increased from an excellent stress relaxation effect achieved by applying a hinge structure while adopting advantages of a dual beam cantilever-type probe that can reduce scrub. Since the hinge structure is a structure that does not receive a moment, an effect that is the same as eliminating a moment in a conventional prove can be achieved so that stress can be evenly applied and the allowable displacement of the probe can be increased.

Abstract: The present invention relates to an apparatus for massive manufacturing a hierarchical structure that can hierarchically form high performance micro units one a flexible substrate. For this purpose, an apparatus for manufacturing a hierarchical structure according to the present invention is provided to layer micro units provided on a dummy substrate that is made of a hard material on a target substrate that is made of a flexible material by releasing the micro units from the dummy substrate. The apparatus includes: a transfer stage flat-transferring the dummy substrate by supporting the same and a main roller rolling the target substrate by winding the same as the transfer stage proceeds and layering the micro unit of the dummy substrate on the target substrate.

Abstract: The present invention relates to a micro contact probe used for a probe card. An exemplary embodiment of the present invention provides a micro contact probe including a coating layer of a nanostructure such as carbon nanotubes formed on a surface thereof to reduce contact resistance when contacting a semiconductor chip. According to the micro contact probe of which the surface is coated with the nanostructure, contact resistance between the probe and the semiconductor chip is lowered and the high frequency characteristics are improved, such that a more accurate measurement can be obtained.

Abstract: Disclosed is an atomic force microscope (AFM) probe for use in an AFM, and more particularly, an AFM probe suitable for testing the topography and mechanical properties of a microstructure having a size on the order of micrometers or nanometers. To this end, an AFM probe according to the present invention comprises an elastically deformable frame having a fixed end and a movable end on one axis; an AFM tip supported by the movable end to be movable against a test sample in a direction of the axis; and a stopper provided on an inner surface of the frame to control a movement of the AFM tip within a predetermined range.

Abstract: Provided are a shape of a hierarchical structure, an engineering effect of the hierarchical structure according to the shape, an increasing method of the engineering effect, an application method of the hierarchical structure for novel material or parts, and a mass-manufacturing method of the hierarchical structure. The present invention relates to a hierarchical structure and a manufacturing method thereof, and includes a hierarchical structure in which at least one nano-object that has a characteristic length of a nanoscale region in an internal matrix is arranged in a predetermined pattern. According to the exemplary embodiments of the present invention, an excellent characteristic that is generated in a nanoscale region may be used in a structure of a macroscopic scale region, and structures that have different scales may be simply interconnected or interfaced regardless of the different scales.

Abstract: An exemplary embodiment of the present invention provides a vertical micro contact probe that includes a column formed by longitudinally continuously stacking a plurality of basic units and a front end formed at the front end of the column and contacting an electrode pad of a semiconductor chip. The basic unit includes a probe body alternately bending to the left and right and protrusions protruding from the probe body at the left and right sides from the center of the width direction, and contacting the adjacent probe body to support the probe body under compression.

Abstract: Disclosed herein is an apparatus for measuring adhesive and frictional properties of a polymer hemisphere relative to a contact plate provided in the apparatus. The apparatus comprise a body having a movable table installed to move along an X-axis and Y-axis and a vertical column positioned at a rear side of the movable table, a sample mount provided on the movable table and having a mirror to reflect surface images of a horizontal contact plate, a head assembly located at a front side of the column and having a polymer hemisphere used to press a surface of the contact plate to implement an adhesive force test, a camera device located at a front side of the mirror to capture the surface images of the contact plate during the adhesive force test, and a control device for analyzing various data inputted thereto during the adhesive force test.

Abstract: According to the present invention, allowable displacement can be increased from an excellent stress relaxation effect achieved by applying a hinge structure while adopting advantages of a dual beam cantilever-type probe that can reduce scrub. Since the hinge structure is a structure that does not receive a moment, an effect that is the same as eliminating a moment in a conventional prove can be achieved so that stress can be evenly applied and the allowable displacement of the probe can be increased.

Abstract: Disclosed herein is a scheduling method and apparatus based on eigen values robust against spatial correlation in a mobile communication system supporting multiple users by use of multiple transmit/receive antennas. A user terminal estimates channel characteristics from the transmit antennas to the user terminal, decomposes the estimated channel characteristics into receive channel characteristics and transmit channel characteristics, and feeds back a transmit principal eigen vector to the base station (BS). The BS selects a predetermined number of user terminals having the least correlation using the feedback principal eigen vectors from a plurality of user terminals, constructs a user precoding matrix by combining the principal eigen vectors of the selected user terminals, multiplies data streams for the selected user terminals by the user precoding matrix and transmits the multiplied data to the selected user terminals.