Patents by Inventor Hamid Eslampour

Hamid Eslampour has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20050265665
    Abstract: Optical components may be precisely positioned in three dimensions with respect to one another. A bonder which has the ability to precisely position the components in two dimensions can be utilized. The components may be equipped with contacts at different heights so that as the components come together in a third dimension, their relative positions can be sensed. This information may be fed back to the bonder to control the precise alignment in the third dimension.
    Type: Application
    Filed: July 5, 2005
    Publication date: December 1, 2005
    Inventors: Ut Tran, Hamid Eslampour
  • Patent number: 6959134
    Abstract: Optical components may be precisely positioned in three dimensions with respect to one another. A bonder which has the ability to precisely position the components in two dimensions can be utilized. The components may be equipped with contacts at different heights so that as the components come together in a third dimension, their relative positions can be sensed. This information may be fed back to the bonder to control the precise alignment in the third dimension.
    Type: Grant
    Filed: June 30, 2003
    Date of Patent: October 25, 2005
    Assignee: Intel Corporation
    Inventors: Ut Tran, Hamid Eslampour
  • Publication number: 20040264869
    Abstract: Optical components may be precisely positioned in three dimensions with respect to one another. A bonder which has the ability to precisely position the components in two dimensions can be utilized. The components may be equipped with contacts at different heights so that as the components come together in a third dimension, their relative positions can be sensed. This information may be fed back to the bonder to control the precise alignment in the third dimension.
    Type: Application
    Filed: June 30, 2003
    Publication date: December 30, 2004
    Inventors: Ut Tran, Hamid Eslampour
  • Publication number: 20040151227
    Abstract: An optical transmitter includes an external cavity laser array formed in a PLC, a trench-based detector array and an AWG. The external cavity laser is formed using an array of substantially similar laser gain blocks and an array of gratings formed in waveguides connected to the gain blocks. Each grating defines the output wavelength for its corresponding external cavity laser. Each detector of the detector array includes a coupler to cause a portion of a corresponding laser output signal of the laser array to propagate through a first sidewall of a trench and reflect off a second sidewall of the trench to a photodetector. In one embodiment, the photodetector outputs a signal indicative of the power level of the reflected signal, which a controller uses to control the laser array to equalize the power of the laser output signals.
    Type: Application
    Filed: February 3, 2003
    Publication date: August 5, 2004
    Inventors: Achintya K. Bhowmik, Nagesh K. Vodrahalli, Gennady Farber, Hai-Feng Liu, Hamid Eslampour, Ut Tran, William B. Wong, Ruolin Li, Jesper Arentoff Jayaswal
  • Patent number: 6527163
    Abstract: A method of making bondable contacts on a microelectronic element includes providing a microelectronic element having one or more die pads on a first face thereof and depositing conductive bonding material, such as gold, atop each die pad. The conductive bonding material is then shaped using a contact forming tool to form bondable contacts. The bondable contact has a substantially flat region and a second region projecting above the substantially flat region. The second region includes an apex adapted to abut against an opposing electrically conductive element. The bondable contacts may be formed one at a time or a plurality of the bondable contacts may be formed simultaneously. In one preferred embodiment, the projecting region of the contact defines a wedge-shaped projection that is bounded by the substantially flat region thereof. Each wedge-shaped projection may include an apex and side-walls extending between the apex and the substantially flat region of the contact.
    Type: Grant
    Filed: November 21, 2000
    Date of Patent: March 4, 2003
    Assignee: Tessera, Inc.
    Inventor: Hamid Eslampour
  • Patent number: 6495462
    Abstract: A microelectronic component is made by providing a starting structure having a dielectric layer and leads on a surface of the dielectric layer. Ends of the leads are connected to contacts on a microelectronic element, such as the contacts on a semiconductor chip or wafer. The dielectric layer is then etched to partially detach the leads from the dielectric layer, leaving at least one end of each lead permanently connected to the dielectric layer. The remainder of the lead may be fully or partially detached from the dielectric layer. If the remainder of the lead is only partially detached, the connecting elements that connects the leads to the polymeric layer can be broken or peeled away from the leads during the step of moving the microelectronic element and dielectric layer away from one another.
    Type: Grant
    Filed: May 5, 2000
    Date of Patent: December 17, 2002
    Assignee: Tessera, Inc.
    Inventors: Belgacem Haba, Hamid Eslampour, Konstantine Karavakis