Patents by Inventor Han-Lin Chen

Han-Lin Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240268081
    Abstract: A composite heat dissipation device includes a base, a cover, a first fan, and a second fan. The cover covers the base to form a first heat dissipation area and a second heat dissipation area. The cover is provided with a first air inlet and a first air outlet communicating with the first air inlet. The cover is provided with a second air inlet, and a second air outlet and a third air outlet communicating with the second air inlet. A first fan is corresponding to the first air inlet and the first air outlet. A second fan is corresponding to the second air inlet, the second and the third air outlets. The first air outlet is opposite to the second air outlet, and the third air outlet is adjacent to the second air outlet, the air outlets do not interfere with each other, and heat dissipation performance is improved.
    Type: Application
    Filed: March 28, 2023
    Publication date: August 8, 2024
    Inventors: Chun-Hung LIN, Han-Lin CHEN
  • Publication number: 20230123190
    Abstract: A vapor chamber includes an upper plate and a lower plate covering each other to form a hollow internal space, an evaporation portion and a condensation portion jointly formed by the upper plate and the lower plate, and a transmission portion communicating with the evaporation portion and the condensation portion. The transmission portion comprises multiple spoiler rods disposed therein to support between the lower plate and the upper plate. The spoiler rods at least include multiple first rods adjacent to an end of the evaporation portion and multiple second rods adjacent to an end of the condensation portion. A distance between any two of the first rods is less than a distance between any two of the second rods.
    Type: Application
    Filed: October 15, 2021
    Publication date: April 20, 2023
    Inventors: Chun-Hung LIN, Han-Lin CHEN
  • Publication number: 20230122387
    Abstract: A vapor chamber includes a case, an evaporation portion, a condensation portion, a transmission portion, and a working fluid. The case has a chamber. The evaporation portion, the condensation portion and the transmission portion are formed in different areas of the case. The evaporation portion has a first chamber room. The condensation portion has a second chamber room. A cross-sectional width of the second chamber room is less than a cross-sectional width of the first chamber room. The transmission portion is formed between the evaporation portion and the condensation portion. The transmission portion has a passage communicating with the first and the second chamber room. The passage has a first end adjacent to the evaporation portion and a second end adjacent to the condensation portion. A width of the first end is greater than a width of the second end. The working fluid is disposed in the chamber.
    Type: Application
    Filed: October 15, 2021
    Publication date: April 20, 2023
    Inventors: Chun-Hung LIN, Han-Lin CHEN
  • Publication number: 20230012170
    Abstract: A heat conduction structure includes a shell, a wick structure, a separating sheet, and a working fluid. The shell includes a chamber. The chamber is divided into an evaporation room, a condensation room and a connection room formed between the evaporation room and the condensation room. The wick structure covers an inner bottom wall of the chamber. The separating sheet is received in the connection room and stacked on the wick structure. An airflow channel is formed between the separating sheet and the inner top wall of the connection room. The working fluid is disposed in the chamber. Therefore, the liquid working fluid and the gaseous working fluid are split by the separating sheet to increase the heat dissipating efficiency of the heat conduction structure.
    Type: Application
    Filed: October 15, 2021
    Publication date: January 12, 2023
    Inventors: Chun-Hung LIN, Han-Lin CHEN
  • Publication number: 20130186599
    Abstract: A heat dissipating device includes a base, a heat pipe and a fixing member. The base includes an accommodating recess and two restraining portions, wherein the two restraining portions are located at opposite sides of the accommodating recess and an opening is between the two restraining portions. A first end of the heat pipe is disposed in the accommodating recess such that a bottom surface of the first end is exposed out of the opening, wherein a width of the opening is smaller than a maximum width of the first end. The fixing member is disposed on the base such that the first end of the heat pipe is fixed between the fixing member and the two restraining portions.
    Type: Application
    Filed: March 8, 2012
    Publication date: July 25, 2013
    Inventors: Han-Lin Chen, Hsuan-Hao Pai, Cheng-En Tsai
  • Publication number: 20130118717
    Abstract: A heat-dissipating device includes a plurality of fin plates arranged adjacently to each other, a heat pipe and a cover board. Each fin plate has at least two fixing tabs protruded from a top edge thereof, and a supporting portion formed between the fixing tabs. An accommodating space is defined between the supporting portion and the fixing tabs. The heat pipe has a portion disposed in the accommodating space. The cover board is formed with a plurality of slits corresponding to the fixing tabs. The fixing tabs pass through the slits and fixed to the cover board.
    Type: Application
    Filed: November 16, 2011
    Publication date: May 16, 2013
    Applicant: COOLER MASTER CO., LTD.
    Inventors: CHUN-HUNG LIN, HAN LIN CHEN, HSUAN HAO PAI
  • Publication number: 20130048249
    Abstract: A heat pipe includes a step pipe and a sintered powder structure. The inner wall of the step pipe has a plurality of grooves. The step pipe has an evaporating section and two condensing sections. The condensing sections are on the two ends of the step pipe, respectively. The evaporating section lies between the two condensing sections. The inner spaces of the two condensing sections and the evaporating section are interconnected. The peripheral dimension of the evaporating section is larger than the peripheral dimension of each of the condensing sections. The sintered powder structure is bounded inside each of the condensing sections, improving the heat pipe's inner air flow rate and heat conduction efficiency.
    Type: Application
    Filed: August 26, 2011
    Publication date: February 28, 2013
    Inventors: Chun-Hung LIN, Han-Lin Chen, Chang-Yin Chen
  • Publication number: 20130048248
    Abstract: A heat pipe includes a step pipe, a mesh, and a supporting component. The step pipe has an evaporating section and two condensing sections. The condensing sections are on the two ends of the step pipe, respectively. The evaporating section lies between the two condensing sections. The inner spaces of the two condensing sections and the evaporating section are interconnected. The peripheral dimension of the evaporating section is larger than the peripheral dimension of each of the condensing sections. The mesh is contained in the step pipe and located inside the evaporating section. The supporting component is contained in the step pipe and wrapped in the mesh. The combination of these structures increases air's flow rate inside the heat pipe and improves the heat pipe's heat conduction efficiency.
    Type: Application
    Filed: August 25, 2011
    Publication date: February 28, 2013
    Inventors: Chun-Hung Lin, Han-Lin Chen, Chang-Yin Chen
  • Publication number: 20130048247
    Abstract: A heat pipe includes a step pipe, a mesh, and a supporting component. The step pipe has an evaporating section and two condensing sections. The condensing sections are on the two ends of the step pipe, respectively. The evaporating section lies between the two condensing sections. The inner spaces of the two condensing sections and the evaporating section are interconnected. The peripheral dimension of the evaporating section is larger than the peripheral dimension of each of the condensing sections. The mesh is contained in the step pipe and located inside the evaporating section and the condensing sections. The supporting component is contained in the step pipe and wrapped in the mesh. The combination of these structures increases air's flow rate inside the heat pipe and improves the heat pipe's heat conduction efficiency.
    Type: Application
    Filed: August 25, 2011
    Publication date: February 28, 2013
    Inventors: Chun-Hung LIN, Han-Lin Chen, Chang-Yin Chen
  • Publication number: 20130037241
    Abstract: The heat pipe of the invention includes an evaporation section and two condensation sections. The evaporation section is located at a part of the heat pipe. The two condensation sections are separately located at two opposite sides of the evaporation section. The evaporation section and the two condensation sections communicate with each other, and a peripheral size of the evaporation section is larger than that of each of the condensation sections.
    Type: Application
    Filed: August 9, 2011
    Publication date: February 14, 2013
    Inventors: Chun-Hung LIN, Han-Lin Chen, Chang-Yin Chen