VAPOR CHAMBER WITH SPOILER STRUCTURE
A vapor chamber includes an upper plate and a lower plate covering each other to form a hollow internal space, an evaporation portion and a condensation portion jointly formed by the upper plate and the lower plate, and a transmission portion communicating with the evaporation portion and the condensation portion. The transmission portion comprises multiple spoiler rods disposed therein to support between the lower plate and the upper plate. The spoiler rods at least include multiple first rods adjacent to an end of the evaporation portion and multiple second rods adjacent to an end of the condensation portion. A distance between any two of the first rods is less than a distance between any two of the second rods.
The disclosure relates to a heat conduction component, particularly to a vapor chamber with a spoiler structure.
Related ArtThe related-art vapor chamber is used to attach on a heat source by one surface, and another surface is used as a condenser to offer heat conduction and is designed with various shapes for matching different demands of heat dissipation. For example, by a design similar to a heat pipe, one part of a vapor chamber functions as a heated portion and another part of a vapor chamber functions as a condenser, and the transmission shapes in the middle are provided according to the differences of a heat source and a cooling position to constitute various types of vapor chambers to satisfy different demands of vapor chambers applied to various circumstances.
However, in practice, there may be some problems. For example, because of being subject of the variation required by the shape, the function or performance of a vapor chamber may be affected. In general, a vapor chamber utilizes the gas-liquid phase change of the working fluid stored therein to provide heat conduction. When liquid or gas working fluid is transmitting, the transmitting speed may be affected by the change of shape of a vapor chamber. For example, when a cross-sectional area of a vapor chamber is changed from large to small, the flow speed of the passing working fluid is accelerated. When the evaporated working fluid is being accelerated, the returning working fluid is also affected that may cause dry-out because of no returning of working fluid. As a result, how to avoid such a problem is an important issue in the design of a vapor chamber.
In view of this, the inventors have devoted themselves to the above-mentioned prior art, researched intensively and cooperated with the application of science to try to solve the above-mentioned problems.
SUMMARYAn object of the disclosure is to provide a vapor chamber with a spoiler structure, which utilizes the additional spoiler structure to control the flow speed of working fluid in the vapor chamber to avoid the limitations of functions or performance of heat conduction of the vapor chamber due to the demands of shape design.
To accomplish the above object, the disclosure provides a vapor chamber with a spoiler structure, which includes an upper plate and a lower plate covering each other to form a hollow internal space, an evaporation portion and a condensation portion jointly formed by the upper plate and the lower plate, and a transmission portion communicating with the evaporation portion and the condensation portion. The transmission portion includes multiple spoiler rods disposed therein to support between the lower plate and the upper plate. The spoiler rods at least include multiple first rods adjacent to an end of the evaporation portion and multiple second rods adjacent to an end of the condensation portion. A distance between any two of the first rods is less than a distance between any two of the second rods.
The technical contents of this disclosure will become apparent with the detailed description of embodiments accompanied with the illustration of related drawings as follows. It is intended that the embodiments and drawings disclosed herein are to be considered illustrative rather than restrictive.
Please refer to
The upper plate 11 and the lower plate 10 of the vapor chamber 1 jointly form an evaporation portion A and a condensation portion B. The lower plate 10 has a lower evaporation portion 100 corresponding to the evaporation portion A and a lower condensation portion 101 corresponding to the condensation portion B. The upper plate 11 has an upper evaporation portion 110 corresponding to the evaporation portion A and an upper condensation portion 111 corresponding to the condensation portion B. The evaporation portion A may be greater than the condensation portion B in area. A transmission portion C is disposed between the evaporation portion A and the condensation portion B for communicating with the evaporation portion A and the condensation portion B. The lower plate 10 has a lower transmission portion 102 corresponding to the transmission portion C. The upper plate 11 has an upper transmission portion 112 corresponding to the transmission portion C. The transmission portion C is tapered from the evaporation portion A to the condensation portion B to match the evaporation portion A with the area greater than that of the condensation portion B.
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Thus, by the above structure, the vapor chamber with the spoiler structure is obtained.
In addition, as shown in
While this disclosure has been described by means of specific embodiments, numerous modifications and variations could be made thereto by those skilled in the art without departing from the scope and spirit of this disclosure set forth in the claims.
Claims
1. A vapor chamber with a spoiler structure, the vapor chamber comprising:
- an upper plate and a lower plate, covering each other to configure a hollow internal space;
- an evaporation portion and a condensation portion, jointly configured by the upper plate and the lower plate; and
- a transmission portion, communicating with the evaporation portion and the condensation portion;
- wherein the transmission portion comprises multiple spoiler rods disposed therein to support between the lower plate and the upper plate, the spoiler rods at least comprise multiple first rods adjacent to an end of the evaporation portion and multiple second rods adjacent to an end of the condensation portion, and a distance between any two of the first rods is less than a distance between any two of the second rods.
2. The vapor chamber of claim 1, wherein a capillary layer is laid inside the lower plate.
3. The vapor chamber of claim 2, wherein the capillary layer comprises a woven mesh, a sintered metal powder or multiple grooves disposed in the lower plate.
4. The vapor chamber of claim 1, wherein the lower plate comprises a lower evaporation portion corresponding to the evaporation portion and a lower condensation portion corresponding to the condensation portion, and the upper plate comprises an upper evaporation portion corresponding to the evaporation portion and an upper condensation portion corresponding to the condensation portion.
5. The vapor chamber of claim 4, wherein an area of the evaporation portion is greater than an area of the condensation portion.
6. The vapor chamber of claim 1, wherein the lower plate comprises a lower transmission portion corresponding to the transmission portion, the upper plate comprises an upper transmission portion corresponding to the transmission portion, and the transmission portion is tapered from the evaporation portion to the condensation portion.
7. The vapor chamber of claim 1, wherein multiple third rods are disposed in the transmission portion and between the first rods and the second rods.
8. The vapor chamber of claim 7, wherein the third rods are arranged between the first rods and the second rods to be regularly distributed in the transmission portion.
9. The vapor chamber of claim 1, wherein the condensation portion is multiple in number.
10. The vapor chamber of claim 9, wherein the condensation portions jointly communicate with the evaporation portion by the transmission portion respectively.
Type: Application
Filed: Oct 15, 2021
Publication Date: Apr 20, 2023
Inventors: Chun-Hung LIN (New Taipei City), Han-Lin CHEN (New Taipei City)
Application Number: 17/503,260