Abstract: A method for aligning to a pattern on a wafer is disclosed. The method includes the steps of obtaining a first inline image from a first sample wafer, obtaining a first contour pattern of an alignment mark pattern from the first inline image, using the first contour pattern to generate a first synthetic image in black and white pixels of only two grayscale levels, using the first synthetic image as a reference to recognize the alignment mark pattern on a tested wafer, and aligning to a tested pattern on the tested wafer according to a position of the alignment mark pattern on the tested wafer and a coordinate information.

Abstract: A microcapsule type polycarboxylate superplasticizer and a preparation method thereof. The microcapsule type polycarboxylate superplasticizer is a polycarboxylic acid aqueous solution encapsulated by a closed capsule, and the closed capsule is an organic/inorganic composite shell layer of calcium ion gel of sodium alginate or gelatin, and calcium carbonate. The organic/inorganic composite shell layer is obtained through diffusion-interface reaction of sodium alginate or gelatin, calcium salt and urea under the catalysis of urease. The microcapsule type polycarboxylate superplasticizer meets requirement of long-term and stable slump retaining of concrete in some special engineering. The preparation method has simple processes, free of organic solvent, and has high encapsulating efficiency.

Abstract: An elastic electrical contact device and a contact conductor are introduced. The elastic electrical contact device includes two contact conductors. Each contact conductor includes a head and an electrical contact portion integrally connected with each other. The electrical contact portion has a cross section shaped as a curved bend and has a guide groove formed thereon. The electrical contact portion is bilaterally symmetrical along a second central axis, wherein a first central axis and the second central axis are parallel to each other and non-coaxial. The electrical contact portions of the two contact conductors are disposed to have openings thereof face each other and are mutually connected in respective guide grooves, are mutually slidable to extend and retract relative to each other, and are sleeved by an elastic reset member to enable the two contact conductors to be elastically reset when extending and retracting relative to each other.

Abstract: The invention provides a containment structure, the containment structure comprising a vessel with an upwardly facing opening defining a periphery; a lid in rotatable and slidable communication with the periphery; and a plurality of rods contained within the lid and in slidable communication with the periphery. Also provided is a method for sealing and unsealing a containment vessel defining a body with a longitudinal axis and a lid, the method comprising simultaneously moving the lid parallel to the longitudinal axis and orthogonal to the longitudinal axis.

Abstract: A method and an apparatus for vehicle control, a storage medium, an electronic device, and a computer program are provided. The method is applicable to a vehicle and includes: acquiring a target deceleration, if the vehicle is traveling on a road section; and performing the braking energy recovery according to the target deceleration, if the vehicle receives a brake instruction and triggers the braking energy recovery. For each vehicle of a plurality of vehicles, the target deceleration is determined by a plurality of history decelerations of each vehicle when traveling on the road section and triggering a braking energy recovery.

Abstract: A method for forming a semiconductor structure includes providing a semiconductor substrate, forming a sacrificial layer over the semiconductor substrate, etching the sacrificial layer to form a sacrificial pattern, etching the semiconductor substrate using the sacrificial pattern as an etching mask to form an active region of the semiconductor substrate, trimming the sacrificial pattern, and replacing the trimmed sacrificial pattern with a gate electrode.

Abstract: A thread management process where a storage area template is generated for a plurality of threads that are to be created by a process in a computing system, the storage area template comprising at least one module template for at least one library that is to be loaded by the process. In the computing system, a plurality of storage areas is allocated for the plurality of threads based on the storage area template, respectively. The plurality of threads are managed based on the plurality of storage areas, respectively. All threads and libraries may be managed in a uniform way according to the storage area template. Therefore, thread management may be simplified and then may lead to reduced costs in the storage and time resources.

Abstract: In an embodiment, a device includes: a source/drain region adjacent a channel region; an inter-layer dielectric on the source/drain region; a source/drain contact extending through the inter-layer dielectric and into the source/drain region; a metal-semiconductor alloy region between the source/drain contact and the source/drain region, the metal-semiconductor alloy region disposed beneath a top surface of the channel region, the metal-semiconductor alloy region including a first dopant; and a contact spacer around the source/drain contact, the contact spacer including the first dopant and an amorphizing impurity.

Abstract: A semiconductor structure includes a semiconductor substrate; fin active regions protruded above the semiconductor substrate; and a gate stack disposed on the fin active regions; wherein the gate stack includes a high-k dielectric material layer, and various metal layers disposed on the high-k dielectric material layer. The gate stack has an uneven profile in a sectional view with a first dimension D1 at a top surface, a second dimension D2 at a bottom surface, and a third dimension D3 at a location between the top surface and the bottom surface, and wherein each of D1 and D2 is greater than D3.

Abstract: A method includes forming a first dielectric layer over a source/drain region, and forming a source/drain contact plug over and electrically connecting to the source/drain region. A top portion of the source/drain contact plug has a first lateral dimension. An implantation process is performed to implant a dopant into the first dielectric layer. The implantation process results in the source/drain contact plug to have a second lateral dimension smaller than the first lateral dimension. The method further includes forming a second dielectric layer over the etch stop layer, and forming a gate contact plug adjacent to the source/drain contact plug.

Abstract: An electronic medical record data analysis system and an electronic medical record data analysis method are provided. The electronic medical record data analysis system includes a storage device and a processor. The storage device is configured to store an electronic medical record data analysis module and a post-processing module. The processor obtains electronic medical record data. The processor executes the electronic medical record data analysis module to analyze the electronic medical record data and generate a plurality of disease diagnosis codes and a plurality of correlation degree scores corresponding to the electronic medical record data. The processor sorts the plurality of disease diagnosis codes according to the plurality of correlation degree scores, to generate an initial list, and executes the post-processing module to post-process the initial list according to a preset coding rule. The processor generates a recommendation list according to the post-processed initial list.

Abstract: Disclosed is an object table for holding an object, comprising: an electrostatic clamp arranged to clamp the object on the object table; a neutralizer arranged to neutralize a residual charge of the electrostatic clamp; a control unit arranged to control the neutralizer, wherein the residual charge is an electrostatic charge present on the electrostatic clamp when no voltage is applied to the electrostatic clamp.

Abstract: In aspects, techniques for detecting and discriminating foreign objects near an inductive wireless power transfer system is disclosed. The method is based on hybrid inductive and capacitive sensing. The apparatus includes a sensing system, a measurement circuit, and a controller. The sensing system senses the object based on at least one of an inductive or a capacitive effect. The sensing system includes an inductive sense element, which has an electrical characteristic that changes in a presence of the object based on the inductive effect. The sensing system further includes a capacitive sense element, which has an electrical characteristic that changes in the presence of the object based on the capacitive effect. The measurement circuit measures the electrical characteristics in the inductive and capacitive sense circuits. The controller determines the presence of the object, and discriminates between metallic and non-metallic objects based on the change in the measured electrical characteristics.

Abstract: A method for detecting a foreign metal object near an inductive wireless power transfer system is based on combined inductive sensing and thermal sensing. A sensing system senses the object based on an inductive or thermal effect. The sensing system includes a sense element which has an electrical characteristic that changes in a presence of the object based on the inductive effect. A mediating heat-sensitive material has a property that varies as a function of temperature and changes the electrical characteristic of the sense element as the property changes. The mediating heat-sensitive material is heated by the foreign object when the foreign object is heated by a magnetic field generated by the wireless power transfer system. A controller measures the electrical characteristic and determines a presence of the object based on the change in the measured electrical characteristics.

Abstract: A wireless transmission method and a transceiver for wireless transmission are disclosed. According to this method, information to be transmitted and transmission control information are encoded into packet length information of wireless frames for transmission, wherein the transmission control information is filled into synchronization packets, sequence number packets and data packets, and the information to be transmitted is only filled into the data packets. Specifically, the method includes sequentially polling data for transmission in units of transmission sequences, and longitudinally encoding the information to be transmitted and data check information into the data packets. The transmission sequences are separated and sorted by the synchronization packets and the sequence number packets, and the data packets are sorted by sequence number fields in the transmission sequence.

Abstract: A semiconductor device includes a substrate, an active structure, a memory structure, and a first conductive line. The active structure is disposed on the substrate. The memory structure is disposed over the active structure, and has a lower surface and an upper surface opposite to each other. The memory structure includes a deep via disposed in the memory structure, and extends in an upward direction from the lower surface to terminate at the upper surface. The first conductive line is disposed above the upper surface of the memory structure, and extends in a first lengthwise direction transverse to the upward direction. The first conductive line is electrically connected to the active structure through the deep via. A method for manufacturing the semiconductor device is also disclosed.

Abstract: A virtual reality system with an inspecting function of assembling and disassembling and an inspection method of assembling and disassembling based on virtual reality are presented. A learning-end acquires an inspection data and a teaching assembling-disassembling record being set with a plurality of checkpoints, plays the teaching assembling-disassembling record, modifies a learning assembling-disassembling status of a plurality of virtual objects based on user's operations for assembling or disassembling. The learning-end issues an assembling-disassembling error reminder when the learning assembling-disassembling status is inconsistent with a teaching assembling-disassembling status at any of the checkpoints.

Abstract: Disclosed herein is a decontaminant aqueous solution for decontaminating diisocyanate drum, including 20-97 wt % of at least one alcohol or derivative thereof, based on the total weight of decontaminant aqueous solution, and an alkaline source in an amount effective to provide the solution a pH of at least 8. Further disclosed herein is a method for decontaminating diisocyanate residues in an emptied drum with the decontaminant aqueous solution.

Abstract: Examples of an integrated circuit with a capacitor structure and a method for forming the integrated circuit are provided herein. In some examples, an integrated circuit device includes a substrate and a trench isolation material disposed on the substrate. An isolation structure is disposed on the trench isolation material. A first electrode disposed on the isolation structure, and a second electrode disposed on the isolation structure. A capacitor dielectric is disposed on the isolation structure between the first electrode and the second electrode. In some such examples, the isolation structure includes a first hard mask disposed on the trench isolation material, a dielectric disposed on the first hard mask, and a second hard mask disposed on the dielectric.

Abstract: The present disclosure provides a semiconductor package structure. The semiconductor package structure includes a substrate, a first electronic component and a support component. The first electronic component is disposed on the substrate. The first electronic component has a backside surface facing a first surface of the substrate. The support component is disposed between the backside surface of the first electronic component and the first surface of the substrate. The backside surface of the first electronic component has a first portion connected to the support component and a second portion exposed from the support component.