Abstract: Semiconductor processing apparatuses and methods are provided in which an electrostatic discharge (ESD) prevention layer is utilized to prevent or reduce ESD events from occurring between a semiconductor wafer and one or more components of the apparatuses. In some embodiments, a semiconductor processing apparatus includes a wafer handling structure that is configured to support a semiconductor wafer during processing of the semiconductor wafer. The apparatus further includes an ESD prevention layer on the wafer handling structure. The ESD prevention layer includes a first material and a second material, and the second material has an electrical conductivity that is greater than an electrical conductivity of the first material.

Abstract: A transistor includes a first semiconductor layer, a second semiconductor layer, a semiconductor nanosheet, a gate electrode and source and drain electrodes. The semiconductor nanosheet is physically connected to the first semiconductor layer and the second semiconductor layer. The gate electrode wraps around the semiconductor nanosheet. The source and drain electrodes are disposed at opposite sides of the gate electrode. The first semiconductor layer surrounds the source electrode, the second semiconductor layer surrounds the drain electrode, and the semiconductor nanosheet is disposed between the source and drain electrodes.

Abstract: The various embodiments described herein include methods and systems for encoding and decoding video. In one aspect, a method includes obtaining video data that includes a plurality of blocks, including a first block, where the video data is to be coded in a warp mode or a motion mode. The method further includes identifying two or more warp groups for the first block and determining a respective cost associated with each warp group of the two or more warp groups. The method also includes selecting a warp group from the two or more warp groups based on the respective costs, and encoding, in accordance with the selected warp group, the first block and a syntax element indicating the warp mode or the motion mode without regards to whether a valid motion vector is available.

Abstract: A foldable electronic device includes a first body having an end and a first inclined surface, a second body having a second inclined surface, and a hinge module. The end includes an accommodating area. A virtual shaft line exists between sides of the first inclined surface and the second inclined surface that are closest to each other. The second body rotates relative to the first body through the virtual shaft line. The hinge module includes a first bracket adjacent to the first inclined surface, connected to the first body, and located in the accommodating area, a second bracket adjacent to the second inclined surface and connected to the second body, and a third bracket including a first end and a second end. The first bracket is connected to the first end through a first torsion assembly. The second bracket is connected to the second end through a second torsion assembly.

Abstract: The various embodiments described herein include methods and systems for encoding and decoding video. In one aspect, a method includes receiving video data comprising a plurality of blocks, including a first block, from a video bitstream. The method also includes obtaining a first syntax element from the video bitstream, the first syntax element indicating a quantity, N, of temporal motion vector predictor (TMVP) candidates for a motion vector predictor (MVP) list. The method further includes identifying a set of TMVP candidates, the set of TMVP candidates having a size less than or equal to N, and generating the MVP list using at least the set of TMVP candidates. The method also includes reconstructing the first block using the MVP list.

Abstract: A semiconductor device includes a source/drain feature over a semiconductor substrate, channel layers over the semiconductor substrate and connected to the source/drain feature, a gate portion between vertically adjacent channel layers, and an inner spacer between the source/drain feature and the gate portion and between adjacent channel layers. The semiconductor device further includes an air gap between the inner spacer and the source/drain feature.

Abstract: A highly extensible nonwoven web is provided. The highly extensible nonwoven web may include continuous multi-component fibers. The continuous multi-component fibers may include polypropylene, wherein the polypropylene has a crystallinity of less than about 41%. The polypropylene may have a melting temperature of less than about 161° C. The highly extensible nonwoven web may define a plurality of apertures. The apertures may be patterned. The highly extensible nonwoven web may form a portion of an absorbent article.

Abstract: A method for manufacturing a semiconductor device includes: providing a wafer-bonding stack structure having a sidewall layer and an exposed first component layer; forming a photoresist layer on the first component layer; performing an edge trimming process to at least remove the sidewall layer; and removing the photoresist layer. In this way, contaminant particles generated from the blade during the edge trimming process may fall on the photoresist layer but not fall on the first component layer, so as to protect the first component layer from being contaminated.

Abstract: A chip packaging structure and a method for fabricating the same are provided. The chip package structure includes a conductive substrate, a dam and a metal shielding layer. The conductive substrate includes a substrate, vias and electrodes. The substrate has first and second board surfaces opposite to each other. The vias penetrate through the first board surface and the second board surface, and a part of the vias is disposed in a first die-bonding region on which a chip is to be arranged. The electrodes extend from the first board surface to the second board surface through the vias. The dam is formed on the first board surface to surround the first die-bonding region, and the dam has a height higher than that of the chip. The metal shielding layer covers the dam and a part of the first board surface that do not overlap with the electrodes.

Abstract: This disclosure relates generally to video coding and particularly to methods and systems for determination of temporal motion vector predictor (TMVP) candidates for inter-prediction in video coding. The disclosed methods, for example, include restricting the number of TMVP candidates in a motion vector predictor (MVP) list and provide various search mechanism in order to promote MVP candidate diversity among TMVP and other types of MVP candidates and to improve coding efficiency.

Abstract: A method and an apparatus for setting an evacuation exit under a crowd emergency evacuation scenario are provided. A simulation model is constructed based on a social force model, and a behavior parameter of an evacuating crowd under the crowd emergency evacuation scenario is obtained by a numerical approximation method with actual trajectory data of individuals in the evacuating crowd under a specific emergency evacuation scenario as a reference; an evacuation exit set is set, an integer programming solution for evacuation exit decision under the emergency evacuation scenario is constructed, and a total evacuation cost of the evacuation exit is obtained based on the simulation model; and reduction of the total evacuation cost is taken as an optimization target to construct an emergency evacuation optimization model based on constraint conditions, and the emergency evacuation optimization model is solved to obtain a recommended integer programming solution for evacuation exit decision.

Abstract: The present disclosure provides a method for removing particles. The method includes: receiving a pellicle including a pellicle membrane, wherein a particle is disposed on the pellicle membrane; passing a light beam through an object lens, wherein the light beam is focused on a focal region in front of the pellicle membrane by the object lens, and the particle is attracted to be trapped at the focal region; and removing the particle from the pellicle membrane at the focal region.

Abstract: Embodiments of the systems and methods described herein provide a terrain generation and population system that can determine terrain population rules for terrain population objects and features when placing objects and features in a three dimensional virtual space. As such, the terrain generation and population system can generate realistic terrain for use in game. The terrain generation and population system can receive an image, such as a satellite image, and utilize artificial intelligence to perform image segmentation at the pixel level to segment features and/or objects in the image. The game terrain system can automatically detect and apply feature and object masks based on the identified features and/or objects from the image segmentation. The game terrain system can place the features and/or objects in corresponding masks in the three dimensional space according to the application of terrain population rules.

Abstract: Memories having a controller configured to perform methods during programming operations including apply a first voltage level to a data line selectively connected to a selected memory cell selected, apply a lower second voltage level to a select gate connected between the data line and the memory cell, decrease the voltage level applied to the data line from the first voltage level to a third voltage level while continuing to apply the second voltage level to the select gate, increase the voltage level applied to the select gate from the second voltage level to a fourth voltage level after the voltage level of the data line settles to the third voltage level, and apply a programming voltage to the memory cell after increasing the voltage level applied to the select gate to the fourth voltage level.

Abstract: The present disclosure discloses a DC home power consumption system and a wiring method for home appliances based on the system. The system includes: a home power supply configured to supply power for the home power consumption system; a high-voltage DC bus connected to the home power supply and configured to supply power for a high-power appliance; a low-voltage DC bus connected to the home power supply or the high-voltage DC bus and configured to supply power for a low-power appliance.

Abstract: A semiconductor structures and a method for forming the same are provided. The semiconductor structure includes first silicon-containing layers, second silicon-containing layers, third silicon-containing layers, and fourth silicon-containing layers vertically suspended over a substrate and laterally spaced apart from each other. In addition, the first silicon-containing layers and the second silicon-containing layers are narrower than the third silicon-containing layers and the fourth silicon-containing layers. The semiconductor structure further includes first source/drain features, second source/drain features, third source/drain features, and fourth source/drain features attaching to opposite sides of the first silicon-containing layers, the second silicon-containing layers, the third silicon-containing layers, and the fourth silicon-containing layers, respectively.

Abstract: A method for preparing a fiber-containing molding compound includes the acts of a) providing a composite material which includes a first resin and fibers impregnated with the first resin, and b) mixing the composite material with a treatment medium which includes a diluent to form a mixture. The fiber-containing molding compound thus prepared has an adjustable fiber content.

Abstract: A broadband measurement system and a measurement method for broadband property are provided. The signal measurement apparatus is used to transmit a measuring signal belonging to a first frequency domain from its measuring port. Two ports of the signal converter are used to connect with two measuring ports of the signal measurement apparatus. The first passive mixer of the signal converter is configured as bidirectional, and the second passive mixer of the signal converter is configured as bidirectional. Two mixers are used to convert the signals from the first frequency domain into a second frequency domain, and convert the signals from the second frequency domain into the first frequency domain.

Abstract: The disclosure provides a photovoltaic electric appliance system and a voltage protection value control method and apparatus thereof, and a controller. The photovoltaic electric appliance system includes: a photovoltaic power generation module, an electric appliance, and a grid-connection module. Said control method comprises-: acquiring the working states of the photovoltaic power generation module, the electric appliance and the grid-connection module; and according to the working states of each, determining an operation mode of the photovoltaic electric appliance system, and setting a voltage protection range of the photovoltaic electric appliance system according to the operation mode.