Patents by Inventor Han-Song LEE

Han-Song LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10427944
    Abstract: A composition for forming a silica based layer, the composition including a silicon-containing polymer having polydispersity ranging from about 3.0 to about 30 and a solvent, and having viscosity ranging from about 1.30 centipoise (cps) to about 1.80 cps at 25° C. Also, a silica based layer is formed of the composition, and an electronic device includes the silica based layer.
    Type: Grant
    Filed: August 28, 2015
    Date of Patent: October 1, 2019
    Assignee: Samsung SDI Co., Ltd.
    Inventors: Jun-Young Jang, Taek-Soo Kwak, Woo-Han Kim, Hui-Chan Yun, Jin-Hee Bae, Bo-Sun Kim, Yoong-Hee Na, Sae-Mi Park, Han-Song Lee, Wan-Hee Lim
  • Patent number: 10093830
    Abstract: A composition for forming a silica based layer includes a silicon-containing compound including polysilazane, polysiloxazane, or a combination thereof and one or more kinds of solvent, and having a turbidity increasing rate of less than or equal to about 0.13.
    Type: Grant
    Filed: September 1, 2015
    Date of Patent: October 9, 2018
    Assignee: Samsung SDI Co., Ltd.
    Inventors: Wan-Hee Lim, Taek-Soo Kwak, Han-Song Lee, Eun-Su Park, Sun-Hae Kang, Bo-Sun Kim, Sang-Kyun Kim, Sae-Mi Park, Jin-Hee Bae, Jin-Woo Seo, Jun-Young Jang, Youn-Jin Cho, Kwen-Woo Han, Byeong-Gyu Hwang
  • Patent number: 9902873
    Abstract: A composition for forming a silica based layer and a method for manufacturing a silica based layer, the composition including a silicon-containing compound, the silicon-containing compound including a hydrogenated polysilazane moiety, a hydrogenated polysiloxazane moiety, or a combination thereof, and a solvent, wherein a number of particles of the silicon-containing compound in the composition and having a particle diameter of about 0.2 ?m to about 1 ?m is less than or equal to about 10/ml.
    Type: Grant
    Filed: December 5, 2014
    Date of Patent: February 27, 2018
    Assignee: SAMSUNG SDI CO., LTD.
    Inventors: Jin-Hee Bae, Taek-Soo Kwak, Han-Song Lee, Youn-Jin Cho, Byeong-Gyu Hwang, Bo-Sun Kim, Sae-Mi Park, Eun-Su Park, Jin-Woo Seo, Wan-Hee Lim, Jun-Young Jang, Kwen-Woo Han
  • Patent number: 9890255
    Abstract: Disclosed is modified hydrogenated polysiloxazane prepared by reacting hydrogenated polysiloxazane with a silane compound selected from polysilane, polycyclosilane, and a silane oligomer. The modified hydrogenated polysiloxazane has a small mole ratio of nitrogen atoms relative to silicon atoms and may remarkably deteriorate a film shrinkage ratio when included in a composition for forming a silica-based insulation layer to form a silica-based insulation layer.
    Type: Grant
    Filed: July 15, 2013
    Date of Patent: February 13, 2018
    Assignee: CHEIL INDUSTRIES, INC.
    Inventors: Hyun-Ji Song, Eun-Su Park, Sang-Hak Lim, Taek-Soo Kwak, Go-Un Kim, Mi-Young Kim, Bo-Sun Kim, Bong-Hwan Kim, Yoong-Hee Na, Jin-Hee Bae, Jin-Woo Seo, Hui-Chan Yun, Han-Song Lee, Jong-Dae Jeon, Kwen-Woo Han, Seung-Hee Hong, Byeong-Gyu Hwang
  • Patent number: 9738787
    Abstract: Disclosed is a composition for a silica-based insulation layer including hydrogenated polysilazane or hydrogenated polysiloxzane, wherein a concentration of a cyclic compound having a weight average molecular weight of less than 400 is less than or equal to 1,200 ppm. The composition for a silica-based insulation layer may reduce a thickness distribution during formation of a silica-based insulation layer, and thereby film defects after chemical mechanical polishing (CMP) during a semiconductor manufacturing process may be reduced.
    Type: Grant
    Filed: August 16, 2013
    Date of Patent: August 22, 2017
    Assignee: CHEIL INDUSTRY, INC.
    Inventors: Hui-Chan Yun, Taek-Soo Kwak, Mi-Young Kim, Sang-Hak Lim, Kwen-Woo Han, Go-Un Kim, Bong-Hwan Kim, Sang-Kyun Kim, Yoong-Hee Na, Eun-Su Park, Jin-Hee Bae, Hyun-Ji Song, Han-Song Lee, Seung-Hee Hong
  • Patent number: 9574108
    Abstract: A composition for forming a silica-based insulation layer, a silica-based insulation layer, and a method of manufacturing the silica-based insulation layer, the composition including a solvent; and an organosilane-based condensation polymerization product that includes a structural unit represented by the following Chemical Formula 1:
    Type: Grant
    Filed: April 23, 2014
    Date of Patent: February 21, 2017
    Assignee: CHEIL INDUSTRIES, INC.
    Inventors: Eun-Su Park, Taek-Soo Kwak, Yoong-Hee Na, Hyun-Ji Song, Han-Song Lee, Seung-Hee Hong
  • Publication number: 20160176718
    Abstract: A composition for forming a silica based layer, the composition including a silicon-containing polymer having polydispersity ranging from about 3.0 to about 30 and a solvent, and having viscosity ranging from about 1.30 centipoise (cps) to about 1.80 cps at 25° C. Also, a silica based layer is formed of the composition, and an electronic device includes the silica based layer.
    Type: Application
    Filed: August 28, 2015
    Publication date: June 23, 2016
    Inventors: Jun-Young Jang, Taek-Soo Kwak, Woo-Han Kim, Hui-Chan Yun, Jin-Hee Bae, Bo-Sun Kim, Yoong-Hee Na, Sae-Mi Park, Han-Song Lee, Wan-Hee Lim
  • Publication number: 20160177133
    Abstract: A composition for forming a silica based layer includes a silicon-containing compound including polysilazane, polysiloxazane, or a combination thereof and one or more kinds of solvent, and having a turbidity increasing rate of less than or equal to about 0.13.
    Type: Application
    Filed: September 1, 2015
    Publication date: June 23, 2016
    Inventors: Wan-Hee Lim, Taek-Soo Kwak, Han-Song Lee, Eun-Su Park, Sun-Hae Kang, Bo-Sun Kim, Sang-Kyun Kim, Sae-Mi Park, Jin-Hee Bae, Jin-Woo Seo, Jun-Young Jang, Youn-Jin Cho, Kwen-Woo Han, Byeong-Gyu Hwang
  • Publication number: 20160172188
    Abstract: A rinse solution for a silica thin film includes trimethylbenzene, diethylbenzene, indane, indene, tert-butyl toluene, methylnaphthalene, a mixture including an aromatic hydrocarbon having 12 or more carbon atoms, a mixture including an aliphatic hydrocarbon having 12 or more carbon atoms, a mixture including a hetero hydrocarbon compound including a phenyl group and an oxygen atom, or a combination thereof.
    Type: Application
    Filed: June 29, 2015
    Publication date: June 16, 2016
    Inventors: Wan-Hee Lim, Il Jung, Sang-Ran Koh, Woo-Han Kim, Ha-Neul Kim, Hui-Chan Yun, Han-Song Lee
  • Patent number: 9362030
    Abstract: A composition for forming a silica-based insulation layer, a silica-based insulation layer, and a method of manufacturing the silica-based insulation layer, the composition including a solvent; and an organosilane-based condensation polymerization product, the organosilane-based condensation polymerization product being prepared from a compound mixture, the compound mixture including compounds represented by the following Chemical Formulae 1 and 2: (R1)3SiXSi(R1)3??[Chemical Formula 1] R2e(Si)OR34-e.
    Type: Grant
    Filed: May 2, 2014
    Date of Patent: June 7, 2016
    Assignee: CHEIL INDUSTRIES, INC.
    Inventors: Eun-Su Park, Taek-Soo Kwak, Yoong-Hee Na, Hyun-Ji Song, Han-Song Lee, Seung-Hee Hong
  • Patent number: 9312122
    Abstract: A rinse liquid for an insulation layer, the rinse liquid including a solvent represented by the following Chemical Formula 1:
    Type: Grant
    Filed: November 26, 2013
    Date of Patent: April 12, 2016
    Assignee: CHEIL INDUSTRIES, INC.
    Inventors: Jin-Hee Bae, Han-Song Lee, Wan-Hee Lim, Go-Un Kim, Taek-Soo Kwak, Bo-Sun Kim, Sang-Kyun Kim, Yoong-Hee Na, Eun-Su Park, Jin-Woo Seo, Hyun-Ji Song, Youn-Jin Cho, Kwen-Woo Han, Byeong-Gyu Hwang
  • Patent number: 9240443
    Abstract: A method of preparing a gap filler agent includes adding a halosilane to a basic solvent, and, to the basic solvent and the halosilane, adding ammonia in an amount of about 50 to about 70 parts by weight based on 100 parts by weight of the halosilane at a rate of about 1 g/hr to about 15 g/hr.
    Type: Grant
    Filed: December 31, 2013
    Date of Patent: January 19, 2016
    Assignee: CHEIL INDUSTRIES, INC.
    Inventors: Jin-Hee Bae, Han-Song Lee, Taek-Soo Kwak, Go-Un Kim, Bo-Sun Kim, Sang-Kyun Kim, Yoong-Hee Na, Eun-Su Park, Jin-Woo Seo, Hyun-Ji Song, Sang-Hak Lim, Wan-Hee Lim, Seung-Hee Hong, Byeong-Gyu Hwang
  • Publication number: 20150337168
    Abstract: A composition for forming a silica based layer and a method for manufacturing a silica based layer, the composition including a silicon-containing compound, the silicon-containing compound including a hydrogenated polysilazane moiety, a hydrogenated polysiloxazane moiety, or a combination thereof, and a solvent, wherein a number of particles of the silicon-containing compound in the composition and having a particle diameter of about 0.2 ?m to about 1 ?m is less than or equal to about 10/ml.
    Type: Application
    Filed: December 5, 2014
    Publication date: November 26, 2015
    Inventors: Jin-Hee BAE, Taek-Soo KWAK, Han-Song LEE, Youn-Jin CHO, Byeong-Gyu HWANG, Bo-Sun KIM, Sae-Mi PARK, Eun-Su PARK, Jin-Woo SEO, Wan-Hee LIM, Jun-Young JANG, Kwen-Woo HAN
  • Publication number: 20150274980
    Abstract: Disclosed is a composition for a silica-based insulation layer including hydrogenated polysilazane or hydrogenated polysiloxzane, wherein a concentration of a cyclic compound having a weight average molecular weight of less than 400 is less than or equal to 1,200 ppm. The composition for a silica-based insulation layer may reduce a thickness distribution during formation of a silica-based insulation layer, and thereby film defects after chemical mechanical polishing (CMP) during a semiconductor manufacturing process may be reduced.
    Type: Application
    Filed: August 16, 2013
    Publication date: October 1, 2015
    Applicant: CHEIL INDUSTRIES INC.
    Inventors: Hui-Chan Yun, Taek-Soo Kwak, Mi-Young Kim, Sang-Hak Lim, Kwen-Woo Han, Go-Un Kim, Bong-Hwan Kim, Sang-Kyun Kim, Yoong-Hee Na, Eun-Su Park, Jin-Hee Bae, Hyun-Ji Song, Han-Song Lee, Seung-Hee Hong
  • Publication number: 20150225508
    Abstract: Disclosed is modified hydrogenated polysiloxazane prepared by reacting hydrogenated polysiloxazane with a silane compound selected from polysilane, polycyclosilane, and a silane oligomer. The modified hydrogenated polysiloxazane has a small mole ratio of nitrogen atoms relative to silicon atoms and may remarkably deteriorate a film shrinkage ratio when included in a composition for forming a silica-based insulation layer to form a silica-based insulation layer.
    Type: Application
    Filed: July 15, 2013
    Publication date: August 13, 2015
    Applicant: CHEIL INDUSTRIES INC.
    Inventors: Hyun-Ji Song, Eun-Su Park, Sang-Hak Lim, Taek-Soo Kwak, Go-Un Kim, Mi-Young Kim, Bo-Sun Kim, Bong-Hwan Kim, Yoong-Hee Na, Jin-Hee Bae, Jin-Woo Seo, Hui-Chan Yun, Han-Song Lee, Jong-Dae Jeon, Kwen-Woo Han, Seung-Hee Hong, Byeong-Gyu Hwang
  • Publication number: 20150093545
    Abstract: A composition for a silica based layer, a silica based layer, and a method of manufacturing a silica based layer, the composition including a solvent; and a silicon-containing polymer, the silicon-containing polymer having a weight average molecular weight of about 20,000 to about 160,000.
    Type: Application
    Filed: September 17, 2014
    Publication date: April 2, 2015
    Inventors: Kwen-Woo HAN, Taek-Soo KWAK, Bo-Sun KIM, Eun-Su PARK, Jin-Hee BAE, Jin-Woo SEO, Han-Song LEE, Wan-Hee LIM, Byeong-Gyu HWANG, Sang-Kyun KIM, Youn-Jin CHO
  • Patent number: 8962747
    Abstract: A resist underlayer composition includes a solvent, and an organosilane condensation polymerization product of: a compound represented by the following Chemical Formula 1, a compound represented by the following Chemical Formula 2, and a compound represented by the following Chemical Formula 3, [R1O]3Si—X??[Chemical Formula 1] [R2O]3Si—R3??[Chemical Formula 2] [R4O]3Si—Si[OR5]3.
    Type: Grant
    Filed: July 2, 2012
    Date of Patent: February 24, 2015
    Assignee: Cheil Industries, Inc.
    Inventors: Mi-Young Kim, Woo-Jin Lee, Kwen-Woo Han, Han-Song Lee, Sang-Kyun Kim, Jong-Seob Kim
  • Publication number: 20150044883
    Abstract: A composition for forming a silica-based insulation layer, a silica-based insulation layer, and a method of manufacturing the silica-based insulation layer, the composition including a solvent; and an organosilane-based condensation polymerization product that includes a structural unit represented by the following Chemical Formula 1:
    Type: Application
    Filed: April 23, 2014
    Publication date: February 12, 2015
    Inventors: Eun-Su PARK, Taek-Soo KWAK, Yoong-Hee NA, Hyun-Ji SONG, Han-Song LEE, Seung-Hee HONG
  • Publication number: 20150044358
    Abstract: A composition for forming a silica-based insulation layer, a silica-based insulation layer, and a method of manufacturing the silica-based insulation layer, the composition including a solvent; and an organosilane-based condensation polymerization product, the organosilane-based condensation polymerization product being prepared from a compound mixture, the compound mixture including compounds represented by the following Chemical Formulae 1 and 2: (R1)3SiXSi(R1)3??[Chemical Formula 1] R2e(Si)OR34-e.
    Type: Application
    Filed: May 2, 2014
    Publication date: February 12, 2015
    Inventors: Eun-Su PARK, Taek-Soo KWAK, Yoong-Hee NA, Hyun-Ji SONG, Han-Song LEE, Seung-Hee HONG
  • Publication number: 20140315367
    Abstract: A rinse liquid for an insulation layer, the rinse liquid including a solvent represented by the following Chemical Formula 1:
    Type: Application
    Filed: November 26, 2013
    Publication date: October 23, 2014
    Inventors: Jin-Hee BAE, Han-Song LEE, Wan-Hee LIM, Go-Un KIM, Taek-Soo KWAK, Bo-Sun KIM, Sang-Kyun KIM, Yoong-Hee NA, Eun-Su PARK, Jin-Woo SEO, Hyun-Ji SONG, Youn-Jin CHO, Kwen-Woo HAN, Byeong-Gyu HWANG