Abstract: An earphone device is provided and includes: a wireless or wired transceiver module configured to receive a first electrical signal from an electronic device via a wireless or wired transmission network; a first compensation module connected to the wireless or wired transceiver module and arranged in a streaming audio gain compensating filter of an active noise cancellation chip, where the first compensation module is used to implement a frequency response curve to calculate a frequency response of the first electrical signal in each frequency band, and to generate a first filter parameter of a target frequency response curve via a first compensation gain conversion model, so that the first filter parameter gain compensates the first electrical signal in each of the frequencies; and a first transducer connected to the first compensation module to convert the first electrical signal gain compensating into sound and then transmit the sound.

Abstract: The invention provides a cup, the cup has a cup body and a cup opening. The cup opening has a front cup rim, a rear cup rim, a left area cup rim and a right area cup rim. The cup opening is set at different everted angles at different positions of the cup rim. When drinking a beverage from the cup rim with different everted angles, the beverage can flow toward different positions on a tongue to experience different flavors of the beverage.

Abstract: An extreme ultraviolet (EUV) photolithography system cleans debris from an EUV reticle. The system includes a cleaning electrode configured to be positioned adjacent the EUV reticle. The system includes a voltage source that helps draw debris from the EUV reticle toward the cleaning electrode by applying a voltage of alternating polarity to the cleaning electrode.

Abstract: A test socket is provided and includes a base with a first surface, a second surface opposing the first surface and through holes, a conductive elastic sheet located on the first surface, and a plurality of elastic metal members with first contact ends facing toward the conductive elastic sheet. The first contact ends include bumps suitable for inserting into the conductive elastic sheet, and each elastic metal member may be prevented from being contaminated by covering the base with the conductive elastic sheet. When the elastic metal members are pressured to insert the bumps into the conductive elastic sheet, a low resistance better than the resistance of the elastic metal members without squeezing can be obtained. When the bumps are inserted into the conductive elastic sheet, the surface of the bumps can be cleaned and the elastic metal members are stably in contact with the conductive elastic sheet.

Abstract: An extreme ultraviolet (EUV) photolithography system cleans debris from an EUV reticle. The system includes a cleaning electrode configured to be positioned adjacent the EUV reticle. The system includes a voltage source that helps draw debris from the EUV reticle toward the cleaning electrode by applying a voltage of alternating polarity to the cleaning electrode.

Abstract: A self-fitting hearing compensation device with real-ear measurement is provided and includes: a first transducer, which receives a first test signal from a device and converts the first test signal into a first electrical signal; a first hearing compensation module, which is connected to the first transducer and performs gain compensation on the first electrical signal; a second transducer, which is connected to the first hearing compensation module, converts the gain-compensated first electrical signal into sound, and transmits the sound into an ear canal; and a third transducer, which synchronously converts the sound transmitted in the ear canal into a second electrical signal, so as to transmit the second electrical signal to the device via a wireless transmission network. In addition, a self-fitting hearing compensation method and a computer program product are also provided.

Abstract: A hearing compensation device is provided and includes a transducer, which receives sound to convert the sound into electrical signals; and a noise reduction module and a hearing compensation module, which are connected to the transducer to receive the electrical signals synchronously. The noise reduction module generates opposite signals with the same energy as the electrical signals to remove ambient noise. The hearing compensation module obtains a real-time customized audiogram or a hearing table according to a user's current real environment. Multiple sets of parameters of multiple filters are searched via active noise cancellation technology with optimization method and loss function to generate an optimal filter parameter value, such that the noise reduction module and the hearing compensation module disposed in the same chip perform real-time and/or synchronous processing to provide a hearing aid with reduced signal delay, real-time and user customization.

Abstract: A resin composition and a metal clad substrate are provided. The resin composition includes: 20 phr to 40 phr of an epoxy resin, 40 phr to 60 phr of a modified benzoxazine resin, 2 phr to 10 phr of a maleimide resin, and 25 phr to 50 phr of fillers. The modified benzoxazine resin contains a DOPO group. Based on a total weight of the modified benzoxazine resin being 100 wt %, an amount of the DOPO group ranges from 10 wt % to 20 wt %.

Abstract: An earphone device is provided and includes: a wireless or wired transceiver module configured to receive a first electrical signal from an electronic device via a wireless or wired transmission network; a first compensation module connected to the wireless or wired transceiver module and arranged in a streaming audio gain compensating filter of an active noise cancellation chip, where the first compensation module is used to implement a frequency response curve to calculate a frequency response of the first electrical signal in each frequency band, and to generate a first filter parameter of a target frequency response curve via a first compensation gain conversion model, so that the first filter parameter gain compensates the first electrical signal in each of the frequencies; and a first transducer connected to the first compensation module to convert the first electrical signal gain compensating into sound and then transmit the sound.

Abstract: A self-fitting hearing compensation device with real-ear measurement is provided and includes: a first transducer, which receives a first test signal from a device and converts the first test signal into a first electrical signal; a first hearing compensation module, which is connected to the first transducer and performs gain compensation on the first electrical signal; a second transducer, which is connected to the first hearing compensation module, converts the gain-compensated first electrical signal into sound, and transmits the sound into an ear canal; and a third transducer, which synchronously converts the sound transmitted in the ear canal into a second electrical signal, so as to transmit the second electrical signal to the device via a wireless transmission network. In addition, a self-fitting hearing compensation method and a computer program product are also provided.

Abstract: A hearing compensation device is provided and includes a transducer, which receives sound to convert the sound into electrical signals; and a noise reduction module and a hearing compensation module, which are connected to the transducer to receive the electrical signals synchronously. The noise reduction module generates opposite signals with the same energy as the electrical signals to remove ambient noise. The hearing compensation module obtains a real-time customized audiogram or a hearing table according to a user's current real environment. Multiple sets of parameters of multiple filters are searched via active noise cancellation technology with optimization method and loss function to generate an optimal filter parameter value, such that the noise reduction module and the hearing compensation module disposed in the same chip perform real-time and/or synchronous processing to provide a hearing aid with reduced signal delay, real-time and user customization.

Abstract: An extreme ultraviolet (EUV) photolithography system cleans debris from an EUV reticle. The system includes a cleaning electrode configured to be positioned adjacent the EUV reticle. The system includes a voltage source that helps draw debris from the EUV reticle toward the cleaning electrode by applying a voltage of alternating polarity to the cleaning electrode.

Abstract: An extreme ultraviolet (EUV) photolithography system cleans debris from an EUV reticle. The system includes a cleaning electrode configured to be positioned adjacent the EUV reticle. The system includes a voltage source that helps draw debris from the EUV reticle toward the cleaning electrode by applying a voltage of alternating polarity to the cleaning electrode.

Abstract: A semiconductor device includes channel region, first and second two-dimensional metallic contacts, a gate structure, and first and second metal contacts. The channel region includes a two-dimensional semiconductor material. The first two-dimensional metallic contact is disposed at a side of the channel region and includes a two-dimensional metallic material. The second two-dimensional metallic contact is disposed at an opposite side of the channel region and includes the two-dimensional metallic material. The gate structure is disposed on the channel region in between the first and second two-dimensional metallic contacts. The first metal contact is disposed at an opposite side of the first two-dimensional metallic contact with respect to the channel region. The second metal contact is disposed at an opposite side of the second two-dimensional metallic contact with respect to the channel region.

Abstract: A package includes a chip formed in a first area of the package and a molding compound formed in a second area of the package adjacent to the first area. A first polymer layer is formed on the chip and the molding compound, a second polymer layer is formed on the first polymer layer, and a plurality of interconnect structures is formed between the first polymer layer and the second polymer layer. A metal-insulator-metal (MIM) capacitor is formed on the second polymer layer and electrically coupled to at least one of the plurality of interconnect structures. A metal bump is formed over and electrically coupled to at least one of the plurality of interconnect structures.

Abstract: A semiconductor device includes channel region, first and second two-dimensional metallic contacts, a gate structure, and first and second metal contacts. The channel region includes a two-dimensional semiconductor material. The first two-dimensional metallic contact is disposed at a side of the channel region and includes a two-dimensional metallic material. The second two-dimensional metallic contact is disposed at an opposite side of the channel region and includes the two-dimensional metallic material. The gate structure is disposed on the channel region in between the first and second two-dimensional metallic contacts. The first metal contact is disposed at an opposite side of the first two-dimensional metallic contact with respect to the channel region. The second metal contact is disposed at an opposite side of the second two-dimensional metallic contact with respect to the channel region.

Abstract: An extreme ultraviolet (EUV) photolithography system cleans debris from an EUV reticle. The system includes a cleaning electrode configured to be positioned adjacent the EUV reticle. The system includes a voltage source that helps draw debris from the EUV reticle toward the cleaning electrode by applying a voltage of alternating polarity to the cleaning electrode.

Abstract: A semiconductor device includes channel region, first and second two-dimensional metallic contacts, a gate structure, and first and second metal contacts. The channel region includes a two-dimensional semiconductor material. The first two-dimensional metallic contact is disposed at a side of the channel region and includes a two-dimensional metallic material. The second two-dimensional metallic contact is disposed at an opposite side of the channel region and includes the two-dimensional metallic material. The gate structure is disposed on the channel region in between the first and second two-dimensional metallic contacts. The first metal contact is disposed at an opposite side of the first two-dimensional metallic contact with respect to the channel region. The second metal contact is disposed at an opposite side of the second two-dimensional metallic contact with respect to the channel region.

Abstract: The present disclosure provides an integrated circuit. The integrated circuit includes a semiconductor substrate; and a passive polysilicon device disposed over the semiconductor substrate. The passive polysilicon device further includes a polysilicon feature; and a plurality of electrodes embedded in the polysilicon feature.

Abstract: A method for detecting dimension of box based on depth map includes: receiving a depth map generated by a camera, the depth map corresponds to pixels of an image including a box; performing a coordinate transformation to transform the depth map into camera coordinates of each of the pixels; dividing some of the pixels into plural blocks, each of blocks includes a number of the pixels adjacent to each other; statistically analyzing an average normal vector of each of the blocks according to the camera coordinates of the pixels of each of the blocks; classifying the blocks into plural clusters according to the average normal vector of each of the blocks; performing a plane extraction to obtain edge vectors according to plane formulas of the clusters; obtaining vertexes of the box according to the edge vectors; and obtaining a dimension of the box according the vertexes.