Abstract: An optical element and a method for manufacturing the optical element are described. The optical element includes a transparent substrate, an optical layer, and an adhesive layer. The optical layer is located on a surface of the transparent substrate. The optical layer has a first surface and a second surface, which are opposite to each other. The first surface is set with various diffracting optical structures. A refractive index of the optical layer is equal to or greater than 1.4. The adhesive layer is sandwiched between the surface of the transparent substrate and the second surface of the optical layer.

Abstract: An optical element and a method for manufacturing the optical element are described. The optical element includes a transparent substrate, an optical layer, and an adhesive layer. The optical layer is located on a surface of the transparent substrate. The optical layer has a first surface and a second surface, which are opposite to each other. The first surface is set with various diffracting optical structures. A refractive index of the optical layer is equal to or greater than 1.4. The adhesive layer is sandwiched between the surface of the transparent substrate and the second surface of the optical layer.

Abstract: An image projector includes a light source capable of switchable emitting different patterns of light; and a beam shaper that shapes a light beam emitted by the light source, thereby generating a shaped pattern of light to be projected onto an object in a scene.

Abstract: Provided is a semiconductor device including a substrate, an interconnect structure, a first passivation layer, a stress buffer layer, a pad structure, and a second passivation layer. The interconnect structure is disposed on the substrate. The first passivation layer and the stress buffer layer are disposed on the interconnect structure. The pad structure includes: a lower portion embedded in the first passivation layer and the stress buffer layer, and laterally wrapped by the first passivation layer and the stress buffer layer; and an upper portion on the lower portion. The upper portion has a periphery laterally offset outward from a periphery of the lower portion, so that a bottom surface of the upper portion contacts a top surface of the stress buffer layer. The second passivation layer is disposed on the stress buffer layer and laterally wraps the upper portion of the upper portion of the pad structure.

Abstract: An inductor includes a core and a conductive spiral wound around the core. The core includes a buffer layer, an etch stop layer, and a core material layer sequentially stacked. The core material layer includes a ferromagnetic material. A total area of a vertical projection of the core material layer is smaller than an area occupied by the etch stop layer. The vertical projection of the core material layer falls entirely on the etch stop layer. The etch stop layer horizontally protrudes with respect to the core material layer.