LED package
Latest Lite-On Opto Technology (Changzhou) Co., Ltd. Patents:
- Multiple pixel package structure with buried chip and electronic device using the same
- Light sensing module and electronic device using the same
- Light emitting diode structure
- Package structure with supporting frame
- Optoelectronic package having second encapsulant cover first encapsulant and photonic devices
Description
The broken line showing of the LED package is for illustrative purposes only and forms no part of the claimed design.
Claims
The ornamental design for a “LED package,” as shown and described.
Referenced Cited
U.S. Patent Documents
7242035 | July 10, 2007 | Kim et al. |
D558693 | January 1, 2008 | Shin et al. |
D605608 | December 8, 2009 | Lee et al. |
D605609 | December 8, 2009 | Lee et al. |
D606032 | December 15, 2009 | Lee et al. |
D615935 | May 18, 2010 | An et al. |
D622231 | August 24, 2010 | Sung |
D637980 | May 17, 2011 | Ko et al. |
D648286 | November 8, 2011 | Chuang |
D659655 | May 15, 2012 | Wang |
Patent History
Patent number: D690669
Type: Grant
Filed: Nov 28, 2011
Date of Patent: Oct 1, 2013
Assignees: Lite-On Opto Technology (Changzhou) Co., Ltd. (Changzhou, Jiangsu Province), Lite-On Technology Corporation (Taipei)
Inventors: Ming-Chuan Chang (New Taipei), Han-Yi Lu (Taipei), Chung-Hsien Yu (New Taipei)
Primary Examiner: Selina Sikder
Application Number: 29/407,279
Type: Grant
Filed: Nov 28, 2011
Date of Patent: Oct 1, 2013
Assignees: Lite-On Opto Technology (Changzhou) Co., Ltd. (Changzhou, Jiangsu Province), Lite-On Technology Corporation (Taipei)
Inventors: Ming-Chuan Chang (New Taipei), Han-Yi Lu (Taipei), Chung-Hsien Yu (New Taipei)
Primary Examiner: Selina Sikder
Application Number: 29/407,279
Classifications
Current U.S. Class:
Electron Or Vacuum Tube (23) (D13/180)