Abstract: A memory device of a memory module includes a CA buffer that receives a command/address (CA) signal through a bus shared by a memory device different from the memory device of the memory module, and a calibration logic circuit that identifies location information of the memory device on the bus. The memory device recognizes its own location on a bus in a memory module to perform self-calibration, and thus, the memory device appropriately operates even under an operation condition varying depending on a location in the memory module.

Abstract: A memory device of a memory module includes a CA buffer that receives a command/address (CA) signal through a bus shared by a memory device different from the memory device of the memory module, and a calibration logic circuit that identifies location information of the memory device on the bus. The memory device recognizes its own location on a bus in a memory module to perform self-calibration, and thus, the memory device appropriately operates even under an operation condition varying depending on a location in the memory module.

Abstract: An integrated circuit memory device includes a serializer configured to convert a plurality of bits of parallel read data, which are synchronized with a corresponding plurality of clock signals that are out-of-phase relative to each other, into a serial stream of the read data. This conversion is performed using a Boolean logic circuit, which is configured to receive each of the plurality of bits of parallel read data and each of the plurality of out-of-phase clock signals at corresponding inputs thereof.

Abstract: A memory device of a memory module includes a CA buffer that receives a command/address (CA) signal through a bus shared by a memory device different from the memory device of the memory module, and a calibration logic circuit that identifies location information of the memory device on the bus. The memory device recognizes its own location on a bus in a memory module to perform self-calibration, and thus, the memory device appropriately operates even under an operation condition varying depending on a location in the memory module.

Abstract: A memory device of a memory module includes a CA buffer that receives a command/address (CA) signal through a bus shared by a memory device different from the memory device of the memory module, and a calibration logic circuit that identifies location information of the memory device on the bus. The memory device recognizes its own location on a bus in a memory module to perform self-calibration, and thus, the memory device appropriately operates even under an operation condition varying depending on a location in the memory module.

Abstract: Disclosed is a level shifter. The level shifter includes a level shifting circuit, a first adjusting circuit, and a second adjusting circuit. The level shifting circuit determines whether to output a first current from a supply voltage line to an output node based on a voltage level of a first node and determines whether to output a second current from the supply voltage line to a third node based on a voltage level of a second node. The first adjusting circuit blocks an output of a third current from the third node to the first node when a clock signal having a first voltage level is received. The second adjusting circuit outputs a fourth current from the first node to a ground voltage line when the clock signal having the first voltage level is received.

Abstract: Disclosed is a level shifter. The level shifter includes a level shifting circuit, a first adjusting circuit, and a second adjusting circuit. The level shifting circuit determines whether to output a first current from a supply voltage line to an output node based on a voltage level of a first node and determines whether to output a second current from the supply voltage line to a third node based on a voltage level of a second node. The first adjusting circuit blocks an output of a third current from the third node to the first node when a clock signal having a first voltage level is received. The second adjusting circuit outputs a fourth current from the first node to a ground voltage line when the clock signal having the first voltage level is received.

Abstract: A memory device of a memory module includes a CA buffer that receives a command/address (CA) signal through a bus shared by a memory device different from the memory device of the memory module, and a calibration logic circuit that identifies location information of the memory device on the bus. The memory device recognizes its own location on a bus in a memory module to perform self-calibration, and thus, the memory device appropriately operates even under an operation condition varying depending on a location in the memory module.

Abstract: A memory device includes a delay locked loop that generates a first code for delaying a reference clock in a first operation mode that is a normal operation mode, generates a second code for delaying the reference clock in a second operation mode that is a refresh mode, and delays the reference clock in response to one of the first and second codes depending on one of the first and second operation modes, and a data output circuit that outputs a data strobe signal (DQS) using the delayed reference clock.

Abstract: An electronic circuit may include a driver, a delay circuit, a strength control circuit, and an adder circuit. The driver may generate a second signal based on a first signal. The delay circuit may delay the first signal by as much as a reference time, to generate a third signal. The strength control circuit may adjust an amplitude of the third signal to generate a fourth signal. The adder circuit may add the second signal and the fourth signal to generate a fifth signal. In a first time interval determined based on the reference time, an amplitude of the fifth signal may be greater than an amplitude of the second signal. In a second time interval except for the first time interval, the amplitude of the fifth signal may be smaller than the amplitude of the second signal. In the second time interval, the amplitude of the fifth signal may be smaller than an amplitude of the first signal.

Abstract: A memory device includes a delay locked loop that generates a first code for delaying a reference clock in a first operation mode that is a normal operation mode, generates a second code for delaying the reference clock in a second operation mode that is a refresh mode, and delays the reference clock in response to one of the first and second codes depending on one of the first and second operation modes, and a data output circuit that outputs a data strobe signal (DQS) using the delayed reference clock.

Abstract: An electronic circuit may include a driver, a delay circuit, a strength control circuit, and an adder circuit. The driver may generate a second signal based on a first signal. The delay circuit may delay the first signal by as much as a reference time, to generate a third signal. The strength control circuit may adjust an amplitude of the third signal to generate a fourth signal. The adder circuit may add the second signal and the fourth signal to generate a fifth signal. In a first time interval determined based on the reference time, an amplitude of the fifth signal may be greater than an amplitude of the second signal. In a second time interval except for the first time interval, the amplitude of the fifth signal may be smaller than the amplitude of the second signal. In the second time interval, the amplitude of the fifth signal may be smaller than an amplitude of the first signal.

Abstract: A memory device includes a first on-die termination circuit, a second on-die termination circuit, a voltage generator, and a code generator. The first on-die termination circuit may correspond to a data input buffer. The second on-die termination circuit may correspond to a command/address buffer. The voltage generator may generate a reference voltage. The code generator may generate a resistance calibration code of a selected one of the on-die termination circuits in response to the reference voltage. The reference calibration code may calibrate a resistance value of the selected on-die termination circuit.

Abstract: An operation control method of a semiconductor memory device includes executing a Delay Locked Loop (DLL) locking in response to a DLL reset signal and measuring a loop delay of a DLL. The operation control method further includes storing measured loop delay information and DLL locking information; and performing a delay control of a command path using the stored loop delay information and DLL locking information independent of the DLL, during a latency control operation.

Abstract: A memory module includes a first memory device including a first one-die termination circuit for impedance matching of a signal path and a second memory device sharing the signal path with the first memory device and including a second on-die termination circuit for impedance matching of the signal path, wherein the signal path corresponds to a command or address signal path provided from a host, and the first and second on-die termination circuits are individually controlled according to control of the host.

Abstract: A memory device includes a first on-die termination circuit, a second on-die termination circuit, a voltage generator, and a code generator. The first on-die termination circuit may correspond to a data input buffer. The second on-die termination circuit may correspond to a command/address buffer. The voltage generator may generate a reference voltage. The code generator may generate a resistance calibration code of a selected one of the on-die termination circuits in response to the reference voltage. The reference calibration code may calibrate a resistance value of the selected on-die termination circuit.

Abstract: A memory module includes a first memory device including a first one-die termination circuit for impedance matching of a signal path and a second memory device sharing the signal path with the first memory device and including a second on-die termination circuit for impedance matching of the signal path, wherein the signal path corresponds to a command or address signal path provided from a host, and the first and second on-die termination circuits are individually controlled according to control of the host.

Abstract: An operation control method of a semiconductor memory device includes executing a Delay Locked Loop (DLL) locking in response to a DLL reset signal and measuring a loop delay of a DLL. The operation control method further includes storing measured loop delay information and DLL locking information; and performing a delay control of a command path using the stored loop delay information and DLL locking information independent of the DLL, during a latency control operation.

Abstract: An operation control method of a semiconductor memory device includes executing a Delay Locked Loop (DLL) locking in response to a DLL reset signal and measuring a loop delay of a DLL. The operation control method further includes storing measured loop delay information and DLL locking information; and performing a delay control of a command path using the stored loop delay information and DLL locking information independent of the DLL, during a latency control operation.

Abstract: An operation control method of a semiconductor memory device includes executing a Delay Locked Loop (DLL) locking in response to a DLL reset signal and measuring a loop delay of a DLL. The operation control method further includes storing measured loop delay information and DLL locking information; and performing a delay control of a command path using the stored loop delay information and DLL locking information independent of the DLL, during a latency control operation.