Abstract: An electronic paper display apparatus including an electronic paper display panel and a driver apparatus is provided. The electronic paper display panel displays image frames and includes a plurality of display modes. The driver apparatus is electrically connected to the electronic paper display panel. The driver apparatus determines what display mode the electronic paper display panel is in according to image data. The driver apparatus selects a driving signal to drive the electronic paper display panel to display the image frames according to the display mode of the electronic paper display panel. The image data is encoded according to one of a plurality of encoding methods to include information related to the display mode of the electronic paper display panel.

Abstract: Package structures and methods of forming package structures are described. A method includes depositing and patterning a first dielectric material. The first dielectric material is deposited in first and second package component regions and in a scribe line region. The scribe line region is disposed between the first and second package component regions. The patterning the first dielectric material forms a first dielectric layer in each of the first and second package component regions and a dummy block in the scribe line region. The dummy block is separated from the first dielectric layer in each of the first and second package component regions. The method further includes forming a metallization pattern on the first dielectric layer; depositing a second dielectric material on the first dielectric layer and the metallization pattern; and patterning the second dielectric material to form a second dielectric layer.

Abstract: An optical interconnect structure includes a lens array and a waveguide substrate. The lens array has a dummy lens. The waveguide substrate has a dummy core, a dummy mirror corresponding to the dummy core, and an inspection opening for injecting inspection light into the dummy core to reach the dummy mirror. In the optical interconnect structure, the lens array is mounted on the waveguide substrate such that the dummy lens of the lens array is positioned on the dummy mirror by monitoring inspection light from the inspection opening.

Abstract: An electronic paper display apparatus including an electronic paper display panel to display an image page, a display driver coupled to the electronic paper display panel, and a data processor coupled to the display driver. The display driver drives the electronic paper display panel to display a plurality of image frames according to image data, so as to display the image page. The data processor converts a first look-up table into a second look-up table and merges a current frame and a previous frame into a combined frame. The data processor generates the image data according to the combined frame and the second look-up table and outputs the image data. The image frames include the current frame and the previous frame. A driving method of the electronic paper display apparatus is also provided.

Abstract: Particular embodiments described herein provide for a connector shield that can include a main body, a shield portion to shield electromagnetic radiation from a connector, and a support portion. The main body can be removably secured to the connector. The shield portion includes lossy material and the shield portion is not grounded. The connector can include connection lines and the connection lines are at least partially inside a cavity of the shield portion.

Abstract: An apparatus is provided which comprises: an oscillator circuit to generate a clock signal and transmit the clock signal over a signal line; a ground reference plane associated with the signal line; and one or more patterns formed in the ground reference plane, wherein the one or more patterns in the ground reference plane is to filter out noise from the clock signal transmitted over the signal line.

Abstract: An embodiment device includes an integrated circuit die and a first metallization pattern over the integrated circuit die. The first metallization pattern includes a first dummy pattern having a first hole extending through a first conductive region. The device further includes a second metallization pattern over the first metallization pattern. The second metallization pattern includes a second dummy pattern having a second hole extending through a second conductive region. The second hole is arranged projectively overlapping a portion of the first hole and a portion of the first conductive region.

Abstract: An optical interconnect structure includes a lens array and a waveguide substrate. The lens array has a dummy lens. The waveguide substrate has a dummy core, a dummy mirror corresponding to the dummy core, and an inspection opening for injecting inspection light into the dummy core to reach the dummy mirror. In the optical interconnect structure, the lens array is mounted on the waveguide substrate such that the dummy lens of the lens array is positioned on the dummy mirror by monitoring inspection light from the inspection opening.

Abstract: An optical interconnect structure includes a lens array and a waveguide substrate. The lens array has a dummy lens. The waveguide substrate has a dummy core, a dummy mirror corresponding to the dummy core, and an inspection opening for injecting inspection light into the dummy core to reach the dummy mirror. In the optical interconnect structure, the lens array is mounted on the waveguide substrate such that the dummy lens of the lens array is positioned on the dummy mirror by monitoring inspection light from the inspection opening.

Abstract: Embodiments herein may relate to a package with one or more layers. A silicon die may be coupled with the one or more layers via an adhesive. A package stiffener may also be coupled with the adhesive adjacent to the die. A magnetic thin film may be coupled with the package stiffener. Other embodiments may be described and/or claimed.

Abstract: A method includes etching a semiconductor substrate to form trenches extending into the semiconductor substrate, and depositing a first dielectric layer into the trenches. The first dielectric layer fills lower portions of the trenches. A Ultra-Violet (UV) treatment is performed on the first dielectric layer in an oxygen-containing process gas. The method further includes depositing a second dielectric layer into the trenches. The second dielectric layer fills upper portions of the trenches. A thermal treatment is performed on the second dielectric layer in an additional oxygen-containing process gas. After the thermal treatment, an anneal is performed on the first dielectric layer and the second dielectric layer.

Abstract: A lift mechanism, comprising: a post, two sliding elements, and a constant force spring. One sliding element supports a display and has a rolling member for rolling contacting a post side of the post. Another sliding element is provided at another post side and fixed with the other sliding element across the post body by a connecting structure, so that the two sliding elements pulling each other slide coherently along the two post sides. The constant force spring is provided at one post end of the post and extends an end fixed to the connecting structure to stop the two sliding elements. A thin-type supporting device comprises the lift mechanism and a flat-shaped support. A post is fixed with two post ends to inner walls of the flat-shaped support, so that the sliding element connected with the display slides along a longitudinal long hole on the flat-shaped support.

Abstract: A computing device includes a charging coil for producing a charging current when placed in a magnetic field of a wireless power transmitter. A wireless charging operating frequency is associated with wireless charging of a battery of the computing device by the charging coil and the wireless power transmitter. An electrically conductive substrate has a plurality of gaps for reducing eddy currents when the electrically conductive substrate is disposed between the charging coil and the wireless power transmitter during charging of the battery. A plurality of filters each electrically bridge a respective one of the gaps. Each filter attenuates signals within a range of frequencies including the wireless charging operating frequency.

Abstract: Techniques and mechanisms for providing a reference potential with a flexible circuit device. In an embodiment, the flexible circuit device includes a first interconnect to exchange a signal and a second interconnect to exchange a reference potential that facilitates shielding of the signal. The first and second interconnects are variously coupled to a printed circuit board (PCB) via a first contact and a second contact of a hardware interface. During such coupling, a maximum height of the second interconnect from a side of the PCB at the hardware interface is greater than a maximum height of the first interconnect from the side of the PCB at the hardware interface. In another embodiment, a distance of the first contact from an end of the flexible circuit device is different than a distance of the second contact from the end of the flexible circuit device.

Abstract: An electronic device includes a display, a timer and computing hardware configured to execute a software product. Execution of the software product results in generating and rendering a graphical user interface on the display with four or more user-selectable graphical objects. Selection of a first user-selectable graphical object at a first spatial position on the graphical user interface and a movement of the selected first user-selectable graphical object along a path towards a second user-selectable graphical object at a second spatial position is detected and a position of the first user-selectable graphical object is exchanged with the position of the second user-selectable graphical object. If, during a predetermined time period, a selection of a third user-selectable graphical object and a movement of the third user-selectable graphical object towards a fourth user-selectable graphical object is detected, the positions of the third and fourth objects is exchanged.

Abstract: A rack assembly has two support frames and at least one shelf that are secured to the support frames by connecting assemblies. Each connecting assembly comprises a well secured to a medial surface of each vertical tube of the support frame, and a hook that extends from each end of each shelf, with each hook having an opening extending therethrough. The connecting assembly also includes a connector that is seated inside each well, each connector having a top plate that has an elongated opening, the connector also having a body that is sized and configured to fit inside a well, the body defining two wings with a space between the wings, and wherein each wing has a bump positioned in the center of the inner surface of each wing that faces the space. Each hook is inserted through the elongated opening of a corresponding connector with the bump on each wing fitted inside the opening of the hook to retain the hook inside the body of the connector.

Abstract: An embodiment package includes a first integrated circuit die, an encapsulant around the first integrated circuit die, and a conductive line electrically connecting a first conductive via to a second conductive via. The conductive line includes a first segment over the first integrated circuit die and having a first lengthwise dimension extending in a first direction and a second segment having a second lengthwise dimension extending in a second direction different than the first direction. The second segment extends over a boundary between the first integrated circuit die and the encapsulant.

Abstract: A polymeric ionic liquid has a formula (I), where A1, A2, B, k, Q, and Z are as defined in the specification. An intermediate polymer for making the polymeric ionic liquid, a process for producing the polymeric ionic liquid, a process for producing a polymer membrane including the polymeric ionic liquid, a process for preparing a gel polymer electrolyte including the polymer membrane, and a binder including the polymeric ionic liquid are also disclosed.