Abstract: Described herein are techniques related one or more systems, apparatuses, methods, etc. for integrating a near field communications (NFC) coil antenna in a portable device. For example, the NFC antenna is integrated under a metal chassis of the portable device. The metal chassis and a conductive coating—that is integrated underneath the full metal chassis—are designed to include one or more slots to provide high impedance to Eddy current induced in the conductive coating.

Abstract: An electromagnetic interference (EMI) shielding can be couplable to a circuit board. The EMI shielding can include a fence couplable to the circuit board, a lid couplable to the fence, and a shield arm extending from the lid and being configured to couple to the fence. The shield arm can be hingedly or rotatably coupled to the lid. The shield arm can be magnetically couplable to the lid. The shield arm and/or the fence can include a magnet to provide a magnetic attraction between the shield arm and the fence.

Abstract: An embodiment is a structure including a first die having an active surface with a first center point, a molding compound at least laterally encapsulating the first die, and a first redistribution layer (RDL) including metallization patterns extending over the first die and the molding compound. A first portion of the metallization patterns of the first RDL extending over a first portion of a boundary of the first die to the molding compound, the first portion of the metallization patterns not extending parallel to a first line, the first line extending from the first center point of the first die to the first portion of the boundary of the first die.

Abstract: An electrically controlled nanomagnet and a spin orbit torque magnetic random access memory (SOT-MRAM) including the same are provided. The electrically controlled nanomagnet includes: a first spin-Hall material layer including a first spin-Hall material; a second spin-Hall material layer including a second spin-Hall material; and a first magnetic layer disposed between the first spin-Hall material layer and the second spin-Hall material layer, wherein the first spin-Hall material and the second spin-Hall material are substantially mirror image to each other.

Abstract: A rack assembly has two support frames and at least one shelf that are secured to the support frames by connecting assemblies. Each connecting assembly comprises a well secured to a medial surface of each vertical tube of the support frame, and a hook that extends from each end of each shelf, with each hook having an opening extending therethrough. The connecting assembly also includes a connector that is seated inside each well, each connector having a top plate that has an elongated opening, the connector also having a body that is sized and configured to fit inside a well, the body defining two wings with a space between the wings, and wherein each wing has a bump positioned in the center of the inner surface of each wing that faces the space. Each hook is inserted through the elongated opening of a corresponding connector with the bump on each wing fitted inside the opening of the hook to retain the hook inside the body of the connector.

Abstract: A wavelength conversion module, a forming method of a wavelength conversion module, and a projection device are provided. The wavelength conversion module includes a substrate and a plurality of wavelength conversion units. The wavelength conversion units are located on the substrate, wherein the wavelength conversion units include a first wavelength conversion unit and a second wavelength conversion unit, the first wavelength conversion unit includes a first wavelength conversion material and a first doping material, the second wavelength conversion unit includes a second wavelength conversion material and a second doping material, the first wavelength conversion material and the second wavelength conversion material are different from each other, and the first doping material and the second doping material are different from each other. By the wavelength conversion units comprising different doping materials, low cost, good heat resistance and efficient light emitting are achieved.

Abstract: An optical wavelength conversion module including a substrate, a driving device, and a first phosphor material layer is provided. The first phosphor material layer is disposed on a first optical region of the substrate. A conversion beam generated by the first phosphor material layer is a yellowish green beam when a phosphor temperature of the first phosphor material layer is close to or equal to an ambient temperature. The conversion beam generated by the first phosphor material layer is a yellow beam when the phosphor temperature of the first phosphor material layer is close to or exceeds a preset temperature. The driving device is connected to the substrate. The driving device is adapted to drive the substrate to act when the optical wavelength conversion module is in an operating state, so that the yellow beam is emitted from the first optical region. An illumination module is also provided.

Abstract: An embodiment package includes a first integrated circuit die encapsulated in a first encapsulant; a first through via extending through the first encapsulant; and a conductive pad disposed in a dielectric layer over the first through via and the first encapsulant. The conductive pad comprises a first region electrically connected to the first through via and having an outer perimeter encircling an outer perimeter of the first through via in a top down view. The package further includes a first dielectric region extending through the first region of the conductive pad. A conductive material of the first region encircles the first dielectric region in the top down view.

Abstract: A semiconductor device including a circuit substrate, a chip package, and a stiffener ring is provided. The chip package is disposed on and electrically connected to the circuit substrate, the chip package includes a pair of first parallel sides and a pair of second parallel sides shorter than the pair of first parallel sides. The stiffener ring is disposed on the circuit substrate, the stiffener ring includes first stiffener portions extending along a direction substantially parallel with the pair of first parallel sides and second stiffener portions extending along the direction substantially parallel with the pair of second parallel sides. The first stiffener portions are connected to the second stiffener portions, and the second stiffener portions is mechanically weaker than the first stiffener portions. A semiconductor device including stiffener lids is also provided.

Abstract: An electromagnetic interference (EMI) shielding can be couplable to a circuit board. The EMI shielding can include a fence couplable to the circuit board, a lid couplable to the fence, and a shield arm extending from the lid and being configured to couple to the fence. The shield arm can be hingedly or rotatably coupled to the lid. The shield arm can be magnetically couplable to the lid. The shield arm and/or the fence can include a magnet to provide a magnetic attraction between the shield arm and the fence.

Abstract: A wavelength conversion module including a substrate and a wavelength conversion layer is provided. The substrate includes an axis, and the axis is located at the center of the substrate. The wavelength conversion layer is located on the substrate and includes two first wavelength conversion layers and a second wavelength conversion layer. Each of the first wavelength conversion layers includes a wavelength conversion material and a first bonding material. The second wavelength conversion layer is located between the two first wavelength conversion layers in a radial direction from the axis of the substrate to an edge of the substrate, and the second wavelength conversion layer includes the wavelength conversion material and a second bonding material. The first bonding material is different from the second bonding material. Moreover, a projection device and a forming method of the wavelength conversion module are also provided.

Abstract: A structure includes a metal pad, a passivation layer having a portion covering edge portions of the metal pad, and a dummy metal plate over the passivation layer. The dummy metal plate has a plurality of through-openings therein. The dummy metal plate has a zigzagged edge. A dielectric layer has a first portion overlying the dummy metal plate, second portions filling the first plurality of through-openings, and a third portion contacting the first zigzagged edge.

Abstract: A wavelength-converting wheel, for converting an excitation beam having an output power greater than or equal to 100 W into a conversion beam, is provided. The wavelength-converting wheel includes a turntable having an annular irradiation portion, an adhesive layer disposed at the annular irradiation portion, a reflective layer disposed on the adhesive layer, and a wavelength-converting layer. The wavelength-converting layer is disposed on the reflective layer and has a light receiving surface configured to be irradiated by the excitation beam. The invention further provides an illumination system including the wavelength-converting wheel, and a projection apparatus including the illumination system. The heat dissipating ability of the wavelength-converting wheel is improved. The material of the wavelength-converting layer is not deteriorated or damaged due to the heat of the excitation beam.

Abstract: A projector and a wavelength-converting element are disclosed. The projector includes an illumination system, a light valve and a lens. The illumination system includes a light source providing an excitation beam, and a wavelength conversion device located at a transmission path of the excitation beam. The wavelength-converting element includes a substrate having a wavelength-converting area, an optical film disposed in the wavelength-converting area of the substrate, and a fluorescent film covering the optical film and converts the excitation beam into a converting beam. The converting beam and the excitation beam constitute an illumination beam. The fluorescent film contains phosphors, wherein the phosphors having a larger particle size are distributed among or above the phosphors having a smaller particle size. The light valve converts the illumination beam into an image beam. The image beam becomes a projection beam after passing through the lens.

Abstract: A semiconductor package and a packaged electronic device are described. The semiconductor package has a foundation layer and a planar filtering circuit. The circuit is formed in the foundation layer to provide EMI/RFI mitigation. The circuit has one or more conductive traces that are patterned to form an equivalent circuit of inductors and capacitors. The one or more conductive traces include planar metal shapes, such as meanders, loops, inter-digital fingers, and patterned shapes, to reduce the z-height of the package. The packaged electronic device has a semiconductor die, a foundation layer, a motherboard, a package, and the circuit. The circuit removes undesirable interferences generated from the semiconductor die. The circuit has a z-height that is less than a z-height of solder balls used to attach the foundation layer to the motherboard. A method of forming a planar filtering circuit in a foundation layer is also described.

Abstract: A projection device for forming an image frame on a projection screen includes a first illumination system for emitting an illumination beam, a second illumination system for emitting an ultraviolet beam, a first light valve located on a transmission path of the illumination beam and for converting the illumination beam into a visible image beam, a lens located on a transmission path of the visible image beam and the ultraviolet beam and for projecting the visible image beam onto the projection screen to form an image frame area and projecting the ultraviolet beam onto the projection screen to form an opaque area, and a processor electrically connected to the first illumination system and the second illumination system and for controlling the first illumination system to emit the illumination beam and controlling the second illumination system to emit the ultraviolet beam. The image frame area partially overlaps the opaque area.

Abstract: A wavelength conversion element, a forming method of the wavelength conversion element, a wavelength conversion module and a projection device are provided. The wavelength conversion element includes a wavelength conversion material, a binder, a filling material and a plurality of cavities. The wavelength conversion material is dispersed in the binder to form a wavelength conversion layer. The filling material is located in the wavelength conversion layer. The cavities are located in the wavelength conversion layer, wherein the filling material fills some of the cavities. The wavelength conversion module includes a substrate and the above wavelength conversion element. The projection device includes the above wavelength conversion module, an excitation light source, a light valve and a projection lens. The disclosure enables the projection device to have good conversion efficiency and reliability.

Abstract: An embodiment package includes a first integrated circuit die, an encapsulent around the first integrated circuit die, and a conductive line electrically connecting a first conductive via to a second conductive via. The conductive line includes a first segment over the first integrated circuit die and having a first lengthwise dimension extending in a first direction and a second segment having a second lengthwise dimension extending in a second direction different than the first direction. The second segment extends over a boundary between the first integrated circuit die and the encapsulant.

Abstract: A projection screen for receiving a visible image beam and an ultraviolet beam from a projection device is provided. The projection screen includes a substrate, an anti-reflection layer and an anti-ultraviolet layer. The substrate includes a first surface adjacent to the projection device, a second surface away from the projection device and opposite to the first surface, a scattering reflection layer disposed between the first surface and the second surface, and an ultraviolet absorption layer disposed between the first surface and the second surface. The scattering reflection layer scatters and reflects the visible image beam. The ultraviolet absorption layer absorbs the ultraviolet beam so as to be changed from a transparent state to an opaque state. The anti-reflection layer is disposed on the first surface. The anti-ultraviolet layer is disposed at the second surface. The ultraviolet absorption layer is located between the scattering reflection layer and the anti-ultraviolet layer.

Abstract: A wavelength conversion module including a substrate and a wavelength conversion layer is provided. The substrate includes an axis, and the axis is located at the center of the substrate. The wavelength conversion layer is located on the substrate and includes two first wavelength conversion layers and a second wavelength conversion layer. Each of the first wavelength conversion layers includes a wavelength conversion material and a first bonding material. The second wavelength conversion layer is located between the two first wavelength conversion layers in a radial direction from the axis of the substrate to an edge of the substrate, and the second wavelength conversion layer includes the wavelength conversion material and a second bonding material. The first bonding material is different from the second bonding material. Moreover, a projection device and a forming method of the wavelength conversion module are also provided.