Abstract: For simpler and safer encapsulation of components, it is proposed to generate the connection between a chip and a carrier substrate by means of bump connections that are sunk into recesses on the carrier substrate. The component thereby lies directly on the carrier substrate, in particular on a frame circumscribing the component structures on the chip.

Abstract: For a component mounted with the flip-chip technique, in particular surface wave elements, it is proposed to use a low-shrinkage ceramic substrate over which (as needed) multi-layer metallizations are produced by metal deposition. The bumps can also be produced by self-aligning metal deposition.

Abstract: For hermetic encapsulation of a component, which includes a chip with component structures applied on a substrate in a flip-chip construction, a material is applied onto the lower edge of the chip and regions of the substrate abutting the chip, and then a first continuous metal layer is applied on the back side of the chip and on the material, as well as on edge regions of the substrate abutting the material. For hermetic encapsulation, a second sealing metal layer is subsequently applied by a solvent-free process at least on those regions of the first metal layer that cover the material.

Abstract: For simpler and safer encapsulation of components, it is proposed to generate the connection between a chip and a carrier substrate by means of bump connections that are sunk into recesses on the carrier substrate. The component thereby lies directly on the carrier substrate, in particular on a frame circumscribing the component structures on the chip.

Abstract: For labeling a component provided with a metallic cover layer, it is proposed that at least one additional contrast layer is arranged over the cover layer. The contrast layer produces an optical contrast with the metallic cover layer and is capable of being eroded by a laser for producing a label.

Abstract: To hermetically encapsulate a component applied to a carrier in the flip-chip style, it is proposed to initially cover this with a film applied sealed to the component and the carrier, to structure this, and to apply over this a hermetically sealing layer, in particular a metal layer, that hermetically terminates with the carrier.

Abstract: A method is provided for manufacturing a saw filter in which a carrier plate 10 that can be separated into base plates 2 is respectively provided with interconnects in the base plate regions A and these are contacted to the active structures of SAW chips 1 in flip-chip technique. A metal foil 3 or plastic film 4 is placed onto the chip-equipped carrier plate 10 and, for example, is pressure and heat treated such that it envelopes each chip 1 (except for the chip surface facing toward the carrier plate 10) and lies hermetically tight on the carrier plate surface in regions between the chips.

Abstract: An electronic component such as a surface acoustic wave component has a chip a piezoelectric substrate with electrically conductive structures thereon and a base plate having external electrical terminal elements that are contacted to the electrically conductive structures of the chip. A protective film is applied onto the chip surface carrying the electrically conductive structures. The surface of the protective film facing away from the piezoelectric substrate carries electrical contact elements that are connected, to the electrically conductive structures of the chip via through-contacts in the protective film and/or directly via bumps, as well as to the electrical terminal elements of the base plate.

Abstract: The multiple blank can be diced into individual blanks for electronic components, in particular surface acoustic wave components. Each of the individual blanks is suitable for contact to be made with chips in the flip-chip technique and for contact to be made with the individual blanks in the SMD technique, using external connections. The multiple blank has, for each individual blank, metalized areas which are located on a network which is integrated between layers of the multiple blank and leads to a connecting terminal. Bumps are built up by depositing metal by electroplating on the metalized areas.

Abstract: A SAW component has a component system that is mounted on a base plate such that it makes electrical contact with the base plate. A protective coating is provided on a component side of the component system that faces away from a connecting region between the component system and the base plate. The protective coating forms a seal, which is proof against environmental influences, for the component system toward the base plate.

Abstract: A method for producing an electronic component includes placing an enclosed frame on a baseplate. A chip is provided to be fitted within the frame, forming a first given space between the chip and the baseplate and forming a second given space between the chip and the frame. The first given space is enclosed in a hermetically sealed manner by pressing a film onto the chip, except on a surface of the chip facing the baseplate, such that the film surrounds the chip and at least reaches the surface of the baseplate. The second given space is filled with a casting compound. The film is then removed at surface regions of the film being free of the casting compound. Finally, a cover composed of an electrically conductive material is applied on the chip, the casting compound and the frame.

Abstract: A method of making a SAW component has electrically conductive structures on a substrate. A cap cover encapsulates and seals the structures against environmental influences. An RF shield is placed on the cap cover. The RF shield is a metallization formed of a material layer sequence of TiW, Cu or Ni and Au which is then reinforced with current-less or galvanic deposition.

Abstract: The SAW component has electrical structures which are encapsulated and sealed against environmental influences by a cap cover. Connecting pads of the electrical structures are exposed in a window of the cap cover and the pads are provided with a metallization. Solderable metallized areas are formed on the cap cover, and they are connected to the pad metallizations via through-plated holes.

Abstract: The SAW component has electrically conductive structures on a substrate. A cap cover encapsulates and seals the structures against environmental influences. An RF shield is placed on the cap cover. The RF shield is a metallization formed of a material layer sequence of TiW, Cu or Ni and Au which may be reinforced with current-less or galvanic deposition.

Abstract: In a stripline laser, the spacer rods are traversed by coolant, and are of composite structure for compensating the longitudinal expansions and define the invariant spacing of the two resonator mirrors that are indirectly firmly joined with the spacer rods.

Abstract: A diffusion-cooled CO.sub.2 stripline laser having reduced ignition voltage is provided. In order to facilitate the ignition of the stripline laser, an auxiliary discharge path is provided which is formed either by segmentation of the HF electrode or by at least one auxiliary electrode that is arranged along the electrode surface and adjacent to the discharge path.

Abstract: In a stripline laser, each electrode is fashioned as a composite of a carrier part having a mechanically stable profile and a plate-shaped electrode part having integrated cooling that is hard-soldered or welded thereto and faces toward the discharge gap.

Abstract: A gas laser has a capillary which is supported inside a jacket tube by a resilient arrangement, which includes a spring washer having radially extending fingers extending from an annular portion having an axial aperture which is received on a cylindrical portion of a flange ring of the arrangement. The flange ring is soldered to the capillary tube with a glass solder in a manner which prevents the spring washer from coming in contact with the glass solder to change the properties of the spring washer.

Abstract: A stripline laser wherein the distance between a mirror and a stripline is minimized without modifying the characteristics of the laser is provided. The stripline laser prevents damaging of the mirror due to plasma discharge by providing at least two insulating strips arranged between oppositely polarized electrodes. Electrically conductive paths lie between the insulating strips. The insulating strips are arranged to guarantee a voltage division. The voltage division maintains the voltage of the electrically conductive path neighboring the mirror below a plasma-maintaining voltage.

Abstract: A waveguide laser having a pair of electrodes mounted opposite one another in the gas discharge space is provided with a spacer extending between the two electrodes. The spacer prevents movement of the electrodes from a mutually parallel position which may otherwise occur due to mechanical stresses in the laser. Beam quality is thereby maintained. The spacer has only a limited extent in the direction transverse to beam travel and/or is of a material transmissive to laser light to prevent detrimental effects on the laser. The spacer is particularly useful in CO.sub.2 lasers, such as pulsed lasers.