Abstract: The invention relates to a filter device equipped with at least one bulk acoustic wave resonator, which comprises a resonator unit and a reflection unit. The resonator unit comprises a first (3) and a second electrode (5) together with a textured piezoelectric layer (4) between the first (3) and second (5) electrodes.

Abstract: The invention describes a filter arrangement comprising a bandpass filter and a notch filter. The coupling of a notch filter, which consists of a capacitor and an inductance, to a bandpass filter comprising resonators achieves a better suppression outside the passband. The two filters can be manufactured on one substrate (1) in a small space through the use of thin-film techniques. Moreover, a transmitter, a receiver, a mobile telephone appliance, and a wireless data transfer system with such a filter arrangement are disclosed, as is a method of manufacturing such a filter arrangement.

Abstract: The invention describes a tunable filter arrangement with at least two resonators which are coupled to one another and of which at least one is connected to a capacitor with tunable capacitance. The electrical properties of the resonator, and thus the overall filter characteristic, can be changed through a change in the capacitance of the capacitor. Furthermore, a transmitter, a receiver, a mobile telephone device, and a wireless data transmission system comprising such a filter arrangement are disclosed, as is a tunable bulk acoustic wave resonator.

Abstract: The invention relates to an array of ultrasound transducers which each comprise a substrate (1), a membrane (2), a first electrode (4), a piezoelectric layer (5), and a second electrode (6), wherein the substrate (1) comprises at least one opening (3) which adjoins the membrane (2) at one side, while the piezoelectric layer (5) has a high piezoelectric coupling coefficient k and is textured. The invention further relates to an ultrasound transducer and to a method of manufacturing an array of ultrasound transducers.

Abstract: A thin-film coupler with a carrier substrate (1) and two strip lines disposed thereon, of which one represents the main coupler loop (2) and one the auxiliary coupler loop (3). The use of inexpensive carrier substrate materials and a compact construction are made possible through an integration of a strip line, a coil, or an LC combination into the auxiliary coupler loop (3). The integration of these components (4) achieves a phase shift in the frequency of the signal coupled out so that a broadband coupler is obtained which exhibits an identical coupling at at least two frequencies.

Abstract: The invention describes a tunable filter arrangement with a plurality of resonators which are coupled to one another and of which there is at least one which comprises a piezoelectric component made of a ferroelectric material and to which a DC voltage source is connected. The application of a DC voltage to the resonator renders it possible to change its electrical properties and thus the overall filter characteristic. Furthermore, a transmitter, a receiver device, and a mobile telephone device with such a filter arrangement are disclosed, aswell as a tunable bulk acoustic wave resonator.

Abstract: The invention relates to an array of ultrasound transducers which each comprise a membrane that is comprised of diamond or diamond-like carbon, a barrier structure, a piezoelectric layer, a first electrode and a second electrode. The barrier structure ensures strong adhesion of the piezoelectric layer to the barrier structure and thus to the device and that the piezoelectric layer only comprises a single phase. In addition, the barrier structure protects the membrane against oxidation/decomposition during the manufacturing process of piezoelectric layer. The invention further relates to an ultrasound transducer.

Abstract: A zero-IF-converter, particularly for digital satellite receivers, comprising a thin-film component including at least two RC filters each including a resistor and a capacitor which each comprise a lower electrode, an upper electrode and a dielectric material, said RC filters being arranged on a common substrate, is characterized by a constant amplitude and phase relationship between the base band signals I and Q.

Abstract: The invention relates to an array of ultrasound transducers which each comprise a substrate (1), a membrane (2), a first electrode (4), a piezoelectric layer (5), and a second electrode (6), wherein the substrate (1) comprises at least one opening (3) which adjoins the membrane (2) at one side, while the piezoelectric layer (5) has a high piezoelectric coupling coefficient k and is textured. The invention further relates to an ultrasound transducer and to a method of manufacturing an array of ultrasound transducers.

Abstract: The invention relates to a passive ceramic component with a carrier substrate, at least one first electrode, at least one first barrier layer, at least one dielectric, and at least one second electrode. A metal, an alloy, or a conductive oxide is used for the barrier layer.

Abstract: The invention relates to an arrangement with a semiconductor component and to a method of manufacturing the arrangement. A control terminal (9) in the semiconductor component is electrically insulated from a substrate (1) by means of a dielectric layer (11). The dielectric layer (11) is formed from aluminum nitride.

Abstract: The invention relates to an arrangement with two piezoelectric layers (2, 5) and to a method of operating the arrangement as a filter. One (2) of the two piezoelectric layers (2, 5) in the arrangement is situated between an electrode (3) and a middle electrode (4), and the other one (5) of the two piezoelectric layers (2, 5) is positioned between another electrode (6) and said middle electrode (4) such that a bulk acoustic wave resonator is formed. The one and the other electrode (3, 6) and the middle electrode (4) are connected to circuitry means for applying high-frequency signals to at least one of the two piezoelectric layers (2, 5) such that the bulk acoustic wave resonator has at least one resonance frequency when the circuitry means are in one switching state, and that the bulk acoustic wave resonator has at least one other resonance frequency different from the at least one resonance frequency when the circuitry means are in another switching state.

Abstract: The invention describes a filter arrangement as well as an electronic component, each with a bulk acoustic wave resonator unit which is present on a carrier substrate (1). A reflection element (2) is provided between the carrier substrate (1) and the bulk acoustic wave resonator unit for the purpose of acoustic insulation of the generated oscillations. This reflection element (2) may consist either of several layers of alternately high and low impedance or, if the acoustically reflecting substance has a sufficiently low impedance, of a single layer. In addition, a mobile telephone device, a transmitter, a receiver, and a wireless data transmission system as well as a method of manufacturing an electronic component are described.

Abstract: The invention relates to an array of ultrasound transducers which each comprise a substrate (1), a membrane (2), a first electrode (4), a piezoelectric layer (5), and a second electrode (6), wherein the substrate (1) comprises at least one opening (3) which adjoins the membrane (2) at one side, while the piezoelectric layer (5) has a high piezoelectric coupling coefficient k and is textured. The invention further relates to an ultrasound transducer and to a method of manufacturing an array of ultrasound transducers.

Abstract: The invention describes a method of manufacturing an electronic thin-film component comprising at least one stripline. In this method, first a metallic base layer is deposited on a substrate layer, a photoresist layer is applied to this metallic base layer, and structured in accordance with the stripline(s) to be formed. An electroconductive layer is deposited on the exposed regions of the metallic base layer. Subsequently, the photoresist is removed and the metallic base layer is etched. This method has the advantage that less metal is required as compared to other thin-film methods. Overlapping areas of the striplines can be formed readily, economically, and with small current capacitances by means of bridges. By means of the method described herein, passive components, such as thin-film couplers for high-frequency applications or thin-film coils can be readily obtained.