Patents by Inventor Hao A. Lu

Hao A. Lu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240153708
    Abstract: A wound capacitor package structure includes a wound assembly, a conductive assembly, a package assembly, a bottom seat plate and a pin protection assembly. The conductive assembly includes a first and a second conductive pin. The package assembly is configured for enclosing the wound assembly. The bottom seat plate is disposed on a bottom side of the package assembly. The pin protection assembly includes a first pin protection layer configured to partially cover the first conductive pin, and a second pin protection layer configured to partially cover the second conductive pin. The first conductive pin includes a first exposed portion exposed outside the package assembly, and the second conductive pin includes a second exposed portion exposed outside the package assembly. The first and the second pin protection layer are disposed on the first and the second exposed portion for protecting the first and the second conductive pin, respectively.
    Type: Application
    Filed: February 17, 2023
    Publication date: May 9, 2024
    Inventors: CHIEH LIN, CHUNG-JUI SU, CHENG-HAO LU
  • Publication number: 20240155433
    Abstract: Embodiments of a system, device and method for configuring reference signaling are disclosed. In some embodiments, a method includes determining, by a wireless communication device, N sets of parameters, determining, by the wireless communication device according to a layer 1 measurement, whether a condition of an event is satisfied, and identifying, by the wireless communication device according to the determination, M sets of parameters from the N sets of parameters. In some embodiments, N is a positive integer value. In some embodiments, M is smaller than or equal to N.
    Type: Application
    Filed: November 10, 2023
    Publication date: May 9, 2024
    Applicant: ZTE CORPORATION
    Inventors: Shujuan ZHANG, Zhaohua LU, Bo GAO, Chuangxin JIANG, Hao WU
  • Patent number: 11979868
    Abstract: Disclosed are a control information sending method and detecting method, a base station, a terminal, and a computer storage medium. The method includes: a base station determining first-type physical layer control information, which is used for indicating a first-type control parameter of a second-type physical layer control channel; determining second-type physical layer control information, which is used for indicating a second-type control parameter of a data channel; sending the first-type physical layer control information; and sending the second-type physical layer control information on the second-type physical layer control channel.
    Type: Grant
    Filed: February 14, 2021
    Date of Patent: May 7, 2024
    Assignee: ZTE CORPORATION
    Inventors: Yijian Chen, Zhaohua Lu, YuNgok Li, Hao Wu, Peng Hao
  • Patent number: 11975415
    Abstract: An aeronautical aluminum alloy minimum-quantity-lubrication milling machining device includes a machine tool worktable and spindle connected with a machine tool power system. The spindle is connected with a tool holder that is fixed with a cutting tool. The machine tool worktable is provided with a machine tool fixture, the tool holder is connected with a minimum-quantity-lubrication mechanism, the machine tool fixture includes a fixture body that is fixedly provided with a limit block for contact with two adjacent side surfaces of a workpiece, the fixture body is provided with a plurality of clamping elements capable of pressing the workpiece against an upper surface of the fixture body, and a top of the clamping element is provided with a detection member for detecting a relative position between the clamping element and the spindle. The device can avoid interference and contact between a nozzle and the clamping element.
    Type: Grant
    Filed: June 7, 2021
    Date of Patent: May 7, 2024
    Assignees: QINGDAO UNIVERSITY OF TECHNOLOGY, SHANXI JINZHAO AVIATION TECHNOLOGY CO., LTD.
    Inventors: Min Yang, Hao Ma, Changhe Li, Xifeng Wu, Yixue Han, Yuying Yang, Xin Cui, Xufeng Zhao, Naiqing Zhang, Qidong Wu, Teng Gao, Yanbin Zhang, Bingheng Lu, Mingzheng Liu, Dongzhou Jia, Xiaowei Zhang, Xiaoming Wang
  • Publication number: 20240142833
    Abstract: An electronic device includes a substrate, a driving element, a first insulating layer, a pixel electrode layer, and a common electrode layer. The driving element is disposed on the substrate. The first insulating layer is disposed on the driving element. The pixel electrode layer is disposed on the first insulating layer. The first insulating layer comprises a hole, and the pixel electrode layer is electrically connected to the driving element through the hole. The common electrode layer is disposed on the pixel electrode layer. The common electrode layer comprises a slit, and the slit has an edge, and the edge is disposed in the hole.
    Type: Application
    Filed: January 11, 2024
    Publication date: May 2, 2024
    Applicant: Innolux Corporation
    Inventors: Wei-Yen Chiu, Ming-Jou Tai, You-Cheng Lu, Yi-Shiuan Cherng, Yi-Hsiu Wu, Chia-Hao Tsai, Yung-Hsun Wu
  • Publication number: 20240146148
    Abstract: The invention discloses a convenient human and animal power drive permanent magnet power generation and storage system, comprising a grip power drive power generation system; the grip power drive power generation system is a dumbbell-shaped grip power generation device, comprising a grip handle and power generation devices provided at both ends of the grip handle; the power generation device is composed of a permanent magnet generator, a tensioning wheel, a spring sheet, a winder ratchet device, and a battery; folding buckles are provided between the power generation devices at both ends and the grip handle so as to be folded inward. The invention solves the problem of continuous power guarantee of wearable intelligent device; in the invention, the grip-type slow gear is designed as a spring tensioning device similar to a mechanical watch; the stress generated during the grip tightens the spring.
    Type: Application
    Filed: November 29, 2022
    Publication date: May 2, 2024
    Inventors: Yifei Lu, Feng Lu, Hao Wei, Tong Zhang, Yuanzhe Ge
  • Publication number: 20240142732
    Abstract: A method includes forming a first waveguide over a substrate; forming a first layer of low-dimensional material on the first waveguide; forming a first layer of dielectric material over the first layer of low-dimensional material; forming a second layer of low dimensional material on the first layer of dielectric material; and forming a first conductive contact that electrically contacts the first layer of low-dimensional material and a second conductive contact that electrically contacts the second layer of low-dimensional material.
    Type: Application
    Filed: January 6, 2023
    Publication date: May 2, 2024
    Inventors: Chih-Hsin Lu, Chin-Her Chien, Chung-Hao Tsai, Chuei-Tang Wang, Chen-Hua Yu
  • Publication number: 20240145380
    Abstract: In some embodiments, the present disclosure relates to an integrated chip that includes a first interconnect dielectric layer arranged over a substrate. An interconnect wire extends through the first interconnect dielectric layer, and a barrier structure is arranged directly over the interconnect wire. The integrated chip further includes an etch stop layer arranged over the barrier structure and surrounds outer sidewalls of the barrier structure. A second interconnect dielectric layer is arranged over the etch stop layer, and an interconnect via extends through the second interconnect dielectric layer, the etch stop layer, and the barrier structure to contact the interconnect wire.
    Type: Application
    Filed: January 5, 2024
    Publication date: May 2, 2024
    Inventors: Hsin-Chieh Yao, Chung-Ju Lee, Chih Wei Lu, Hsi-Wen Tien, Wei-Hao Liao, Yu-Teng Dai
  • Patent number: 11972557
    Abstract: Provided are a vibration object monitoring method and apparatus, a computer device, and a storage medium. The method includes: in response to detecting that a vibration object exists in a monitoring video picture for a target monitoring region, a vibration object region in the monitoring video picture is determined, where the vibration object region is a region where the vibration object is located in the monitoring video picture; displacement information of a key point of the vibration object in the vibration object region is recorded; vibration information of the vibration object in the monitoring video picture is determined based on the displacement information; and a vibration object monitoring result for the target monitoring region is generated according to the vibration information. The abnormal vibration monitoring can be performed on the vibration object in the target monitoring region in time according to this method.
    Type: Grant
    Filed: March 8, 2021
    Date of Patent: April 30, 2024
    Assignee: CSG POWER GENERATION CO., LTD.
    Inventors: Yumin Peng, Zhiqiang Wang, Hao Zhang, Hengjun Chen, Xun Hu, Tuixiang Feng, Liqun Sun, Man Chen, Yong Lu, Tao Liu, Kai Lin, Yulin Han
  • Patent number: 11972975
    Abstract: A method of forming a semiconductor device structure is provided. The method includes forming a masking structure with first openings over a semiconductor substrate and correspondingly forming metal layers in the first openings. The method also includes recessing the masking structure to form second openings between the metal layers and forming a sacrificial layer surrounded by a first liner in each of the second openings. In addition, after forming a second liner over the sacrificial layer in each of the second openings, the method includes removing the sacrificial layer in each of the second openings to form a plurality of air gaps therefrom.
    Type: Grant
    Filed: June 24, 2021
    Date of Patent: April 30, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hsi-Wen Tien, Wei-Hao Liao, Yu-Teng Dai, Hsin-Chieh Yao, Chih-Wei Lu, Chung-Ju Lee, Shau-Lin Shue
  • Patent number: 11974104
    Abstract: A linearity compensation method for a sound producing device (SPD) includes steps of: applying a test signal on a first SPD; obtaining an acoustic measurement result generated from the first SPD according to the test signal; generating a compensation curve according to the acoustic measurement result; and performing a linearity compensation operation on a second SPD according to the compensation curve.
    Type: Grant
    Filed: January 13, 2022
    Date of Patent: April 30, 2024
    Assignee: xMEMS Labs, Inc.
    Inventors: Jemm Yue Liang, Yanchen Lu, Hao-Hsin Chang
  • Publication number: 20240131955
    Abstract: A method and a system for controlling battery swapping of a vehicle and a vehicle are provided. The method includes: receiving, by a vehicle control unit (VCU), a battery swapping instruction, and transmitting the battery swapping instruction to a battery manager when the vehicle is in a high-voltage power-on state; transmitting, by the battery manager, an enable instruction to a direct current (DC) charger assembly in response to the received battery swapping instruction; and performing, by the DC charger assembly, a starting operation in response to the enable instruction, so as to provide a power supply voltage to a vehicle load after an electrical connection between a power battery pack and a high-voltage circuit of the vehicle is cut off during battery swapping of the vehicle.
    Type: Application
    Filed: December 22, 2023
    Publication date: April 25, 2024
    Applicant: BYD COMPANY LIMITED
    Inventors: Hao LU, Zhicheng TAN, Hongtao SHE, Mingyang GUO, Keqi ZHANG
  • Publication number: 20240136428
    Abstract: Improved inner spacers for semiconductor devices and methods of forming the same are disclosed.
    Type: Application
    Filed: January 2, 2024
    Publication date: April 25, 2024
    Inventors: Wen-Kai Lin, Che-Hao Chang, Chi On Chui, Yung-Cheng Lu
  • Patent number: 11965309
    Abstract: The present disclosure relates to a leveling control method, device and system, a motor grader. The leveling control method includes: acquiring elevations of a current position of a blade of a motor grader and a target position, and a movement speed of the motor grader, wherein the target position is on the ground with a certain horizontal distance from the current position along a movement direction of the motor grader; determining a movement time of the blade from the current position to the target position from the horizontal distance and the movement speed; determining a lifting speed of a lifting cylinder from an elevation difference between the elevation of the target position and the elevation of the current position and the movement time; and controlling the lifting cylinder to adjust the blade to move from the current position to the target position according to the lifting speed.
    Type: Grant
    Filed: July 29, 2020
    Date of Patent: April 23, 2024
    Assignee: JIANGSU XCMG CONSTRUCTION MACHINERY RESEARCH INSTITUTE LTD.
    Inventors: Zhiqiang Hou, Bin Zhao, Hao Liu, Shengli Lu
  • Patent number: 11968152
    Abstract: Disclosed are techniques, systems, apparatuses, and methods of wireless communication. In one aspect, a method of wireless communication is disclosed. The method includes transmitting, by a first communications node to a second communications node, a set of information for transmission of reference signals or channels, wherein the set of information includes: timing information related to a transmission timing of the reference signals or channels, timing information related to when an antenna group or a group of reference signals and/or channels related to the antenna group is activated, or an identification of one or more antenna groups associated with the reference signals or channels.
    Type: Grant
    Filed: August 9, 2018
    Date of Patent: April 23, 2024
    Assignee: ZTE Corporation
    Inventors: Yu Ngok Li, Bo Gao, Hao Wu, Shujuan Zhang, Chuangxin Jiang, Huahua Xiao, Yijian Chen, Zhaohua Lu
  • Patent number: 11961762
    Abstract: A method includes forming a first conductive feature, depositing a passivation layer on a sidewall and a top surface of the first conductive feature, etching the passivation layer to reveal the first conductive feature, and recessing a first top surface of the passivation layer to form a step. The step comprises a second top surface of the passivation layer. The method further includes forming a planarization layer on the passivation layer, and forming a second conductive feature extending into the passivation layer to contact the first conductive feature.
    Type: Grant
    Filed: June 30, 2022
    Date of Patent: April 16, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ming-Da Cheng, Tzy-Kuang Lee, Song-Bor Lee, Wen-Hsiung Lu, Po-Hao Tsai, Wen-Che Chang
  • Patent number: 11962382
    Abstract: Provided are a method and apparatus for sending a channel state, a method and apparatus for receiving a channel state and a storage medium. The method for sending a channel state includes following steps: a channel state report for characterizing a channel state comprising a precoding matrix is determined; and the channel state report for characterizing the channel state comprising the precoding matrix is sent, where the channel state report includes: a number of reported coefficients in coefficient matrixes for the precoding matrix and the reported coefficients in the coefficient matrixes for the precoding matrix; where the reported coefficients in the coefficient matrixes for the precoding matrix are used for indicating the precoding matrix.
    Type: Grant
    Filed: October 28, 2021
    Date of Patent: April 16, 2024
    Assignee: ZTE Corporation
    Inventors: Yong Li, Hao Wu, Guozeng Zheng, Zhaohua Lu
  • Patent number: 11962657
    Abstract: Systems and methods are provided for discoverability detection of network services. The present disclosure provides for a cloud-based network insight server that collects performance information of a network and a network agent, communicating with the cloud-based network insight server, that monitors discoverability of network services hosted by devices on the network. The network agent receives configuration information from the cloud-based network insight server and transmits discoverability states of the devices to the cloud-based network insight server based on executing a service discovery process through an access point on the network.
    Type: Grant
    Filed: July 25, 2022
    Date of Patent: April 16, 2024
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Hao Lu, Rahul Bahal, Mohd Shahnawaz Siraj, Kannan Konath
  • Publication number: 20240120338
    Abstract: A semiconductor device structure is provided. The semiconductor device has a first dielectric wall between an n-type source/drain region and a p-type source/drain region to physically and electrically isolate the n-type source/drain region and the p-type source/drain region from each other. A second dielectric wall is formed between a first channel region connected to the n-type source/drain region and a second channel region connected to the p-type source/drain region. A contact is formed to physically and electrically connect the n-type source/drain region with the p-type source/drain region, wherein the contact extends over the first dielectric wall. The first electric wall has a gradually decreasing width W5 towards a tip of the dielectric wall from a top contact position between the first dielectric wall and either the n-type source/drain region or the p-type source/drain region.
    Type: Application
    Filed: February 15, 2023
    Publication date: April 11, 2024
    Inventors: Ta-Chun LIN, Ming-Che CHEN, Yu-Hsuan LU, Chih-Hao CHANG
  • Publication number: 20240120402
    Abstract: A semiconductor device structure, along with methods of forming such, are described. The semiconductor device structure includes a first dielectric feature extending along a first direction, the first dielectric feature comprising a first dielectric layer having a first sidewall and a second sidewall opposing the first sidewall, a first semiconductor layer disposed adjacent the first sidewall, the first semiconductor layer extending along a second direction perpendicular to the first direction, a second dielectric feature extending along the first direction, the second dielectric feature disposed adjacent the first semiconductor layer, and a first gate electrode layer surrounding at least three surfaces of the first semiconductor layer, and a portion of the first gate electrode layer is exposed to a first air gap.
    Type: Application
    Filed: November 19, 2023
    Publication date: April 11, 2024
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Jia-Ni YU, Kuo-Cheng CHIANG, Mao-Lin HUANG, Lung-Kun CHU, Chung-Wei HSU, Chun-Fu LU, Chih-Hao WANG, Kuan-Lun CHENG