Abstract: A method including forming a III-V compound layer on a substrate and implanting a main dopant in the III-V compound layer to form source and drain regions. The method further includes implanting a group V species into the source and drain regions. A semiconductor device including a substrate and a III-V compound layer over the substrate. The semiconductor device further includes source and drain regions in the III-V layer, wherein the source and drain regions comprises a first dopants and a second dopant, and the second dopant comprises a group V material.

Abstract: A BSI image sensor includes a substrate including a front side and a back side opposite to the front side, a pixel sensor disposed in the substrate, and a color filter disposed over the pixel sensor. The pixel sensor includes a plurality of first micro structures disposed over the back side of the substrate, and the color filter includes a plurality of second micro structures disposed over the back side of the substrate.

Abstract: A package structure and the manufacturing method thereof are provided. The package structure includes a first package including at least one first semiconductor die encapsulated in an insulating encapsulation and through insulator vias electrically connected to the at least one first semiconductor die, a second package including at least one second semiconductor die and conductive pads electrically connected to the at least one second semiconductor die, and solder joints located between the first package and the second package. The through insulator vias are encapsulated in the insulating encapsulation. The first package and the second package are electrically connected through the solder joints. A maximum size of the solder joints is greater than a maximum size of the through insulator vias measuring along a horizontal direction, and is greater than or substantially equal to a maximum size of the conductive pads measuring along the horizontal direction.

Abstract: A compound of Formula (I) or (II), for treating or preventing an HCV infection in a subject.

Abstract: An apparatus and method for providing one or more protocols for one or more electronic devices are provided. The method includes establishing, by an electronic device configured to provide a framework interface by executing instructions stored in a memory, one or more physical channels with an external electronic device, using one or more communication modules, executing, by the electronic device, two or more application programs to interface with the framework interface, and communicating, via the framework interface, data from the two or more application programs through the one or more physical channels to the external electronic device, using at least one logical channel or session for a respective one of the two or more application programs.

Abstract: A method of forming a semiconductor device structure is provided. The method includes successively forming first and second hard mask layers over a trench pattern region of a material layer. The second hard mask layer has a first tapered opening corresponding to a portion of the trench pattern region and a passivation spacer is formed on a sidewall of the first tapered opening to form a second tapered opening therein. The method also includes forming a third tapered opening below the second tapered opening and removing a portion of the passivation spacer in a first etching process. The method also includes forming a vertical opening in the first hard mask layer below the bottom of the third tapered opening in a second etching process. The vertical opening has a width that is substantially equal to a bottom width of the third tapered opening.

Abstract: A lens mount apparatus mountable on a vehicle and a method for controlling a lens mount apparatus are described. The lens mount apparatus includes a plurality of lenses concentrically arranged around a center, and the plurality of lenses include a first lens having a first focal length and a second lens having a second focal length that is shorter than the first focal length. The method includes positioning one of the plurality of lenses, such that one of the lenses that has a focal length suitable for capturing an object is used for image capturing.

Abstract: The disclosure provided a compressing method of the grayscale compensation table of an OLED display panel, which comprising: step 10, when transmitting a set of grayscale compensation table of the OLED display panel to an encoder for encoding, firstly, performing a differential calculation on many grayscale compensation tables with a same color channel and different gray scales in the set of which to acquire a corresponding reference image and a difference image as replacements of many grayscale compensation tables; step 20, transmitting the above images to the encoder; step 30, the encoder compressing and encoding a received grayscale compensation table. The compressing method of the grayscale compensation table of the OLED display panel performs the intra-level differences between the same color component and the different grayscale compensation tables in the same OLED compensation table to improve an efficiency and a performance of the compression compensation table.

Abstract: Methods and systems to broadcast sensor outputs in an automotive environment allow sensors such as cameras to output relatively unprocessed (raw) data to two or more different processing circuits where the processing circuits are located in separate and distinct embedded control units (ECUs). A first one of the two or more different processing circuits processes the raw data for human consumption. A second one of the two or more different processing circuits processes the raw data for machine utilization such as for autonomous driving functions. Such an arrangement allows for greater flexibility in utilization of the data from the sensors without imposing undue latency in the processing stream and without compromising key performance indices for human use and machine use.

Abstract: Improved systems, methods, and techniques for generating representational state transfer (REST) requests from a client computer to a server computer. The disclosed techniques employ a REST application programming interface (also referred to as the “RESTful API”) for use in receiving the REST requests at the server computer from the client computer, and providing REST responses from the server computer to the client computer. The disclosed techniques further employ an intelligent REST client configured as a webpage (also referred to as the “intelligent REST client webpage”) that can be accessed by a browser running on the client computer, and transmitted or otherwise served by the server computer for display on the browser of the client computer. The intelligent REST client webpage may be employed by a user of the client computer for efficiently interacting with the RESTful API of the server computer.

Abstract: A wearable liquid supplying device for insulin injection is fixed on a user's body through a ring belt and includes a carrier body, a flow-guiding-and-actuating unit, a sensor, an air bag, a miniature air pump and a driving chip. The sensor measures sweat on human skin to detect a level of the blood glucose. The driving chip receives the glucose monitoring data and accordingly controls the actuation of the flow-guiding-and-actuating unit and the open/closed states of the switching valves. The miniature air pump is enabled to inhale gas into the air bag, so that the air bag is inflated and the ring belt contacts the human skin tightly. The flow-guiding-and-actuating unit is enabled to generate a pressure difference so that the insulin liquid is transported to a liquid guiding outlet through a liquid guiding channel and flows into the microneedle patch for being injected into the subcutaneous tissue.

Abstract: A method for forming a chip package is provided. The method includes disposing a chip over a redistribution structure. The redistribution structure includes a first insulating layer and a first wiring layer, and the first wiring layer is in the first insulating layer and electrically connected to the chip. The method includes bonding an interposer substrate to the redistribution structure through a conductive structure. The chip is between the interposer substrate and the redistribution structure. The interposer substrate has a recess adjacent to the redistribution structure. A first portion of the chip is in the recess. The interposer substrate includes a substrate and a conductive via structure, and the conductive via structure passes through the substrate and is electrically connected to the first wiring layer through the conductive structure.

Abstract: An automated optical inspection (AOI) image classification method includes sending a plurality of NG information of a plurality of samples from an AOI device into an Artificial Intelligence (AI) module; performing discrete output calculation on the NG information of the samples by the AI module to obtain a plurality of classification information of the samples; performing kernel function calculation on the classification information of the samples by the AI module to calculate respective similarity distances of the samples and performing weighting analysis; based on weighting analysis results of the samples, judging classification results of the samples; and based on the classification results of the samples, performing classification of the samples.

Abstract: An array substrate assembly, a method of manufacturing the array substrate assembly, a display panel and a display apparatus are disclosed. The array substrate assembly includes a drive control circuit located on the substrate and configured for driving. The drive control circuit includes a plurality of thin film transistors each including an active layer. The array substrate further includes a grounded electrostatic shield layer. The electrostatic shield layer is located between the substrate and the drive control circuit, and an orthogonal projection of the electrostatic shield layer on the substrate covers orthogonal projections of at least the active layers of the plurality of thin film transistors of the drive control circuit on the substrate.

Abstract: Semiconductor package s and methods of forming the same are disclosed. The semiconductor package includes a chip, a redistribution circuit structure and a UBM pattern. The redistribution circuit structure is disposed over and electrically connected to the chip and includes a topmost conductive pattern. The UBM pattern is disposed over and electrically connected to the topmost conductive pattern, wherein the UBM pattern includes a set of vias and a pad on the set of vias, wherein the vias are arranged in an array and electrically connected to the pad and the topmost conductive pattern.

Abstract: A semiconductor device includes a gate dielectric layer and a gate electrode formed on the gate dielectric layer. The gate electrode includes a first metal layer, a second metal layer, and a third metal layer. The first metal layer includes an oxygen-gettering composition. The second metal layer includes oxygen. The third metal layer includes an interface with a polysilicon layer.

Abstract: There are described methods and systems for facilitating identification of an object-of-interest. A face similarity score and a body similarity score of a query image relative to a gallery image are determined. A fused similarity score of the query image relative to the gallery image is determined by applying a relationship between the face similarity score, the body similarity score, and the fused similarity score. The fused similarity score is indicative of whether or not the object-of-interest and the potential object-of-interest are the same object-of-interest. For example, a machine learning process is used to fuse the face similarity score and the body similarity into the fused similarity score. The process is repeated for multiple gallery images. The gallery images may then be ranked according to their respective fused similarity scores.

Abstract: A wearable liquid supplying device for human insulin injection is fixed on a body of human through a ring belt and includes a substrate, a flow-guiding-and-actuating unit, a sensor and a driving chip. The substrate has a liquid storage chamber. The flow-guiding-and-actuating unit has a liquid guiding channel in communication with a liquid storage outlet of the liquid storage chamber and a liquid guiding outlet. The sensor measures a blood glucose level and generates measured data correspondingly. The driving chip receives the measured data from the sensor and controls the actuation of the flow-guiding-and-actuating unit and the open/closed states of the switching valves. The flow-guiding-and-actuating unit is enabled to generate a pressure difference so that the insulin liquid is transported to the liquid guiding outlet through the liquid guiding channel and flows into the microneedle patch for allowing the microneedles to inject the insulin liquid into the subcutaneous tissue.

Abstract: A ladder cord fastening seat for a non-pull window blind includes two vertical posts located opposite to each other and an arc bridge. The ladder cord fastening seat is fastened in a top beam through the two vertical posts. Each of the vertical posts has a cord inserting hole for a ladder cord to be inserted therethrough. The arc bridge is used for fastening the ladder cord. The arc bridge connects the two vertical posts in such a way that an accommodation space is defined to accommodate a transmission member located in the top beam.

Abstract: A signal processing terminal is provided that includes a signal transmission circuit and a processor. The signal transmission circuit is configured to receive a first electrical signal and a second electrical signal respectively from a first communication terminal and a second communication terminal, and to attach a first user identification header to the first electrical signal and attach a second user identification header to the second electrical signal. The processor is electrically coupled to the signal transmission circuit, and configured to process the first and second electrical signals according to the first and second user identification headers in sequence within a bus, and to generate and transmit a first and a second processed results back to the signal transmission circuit.