Abstract: A protection device for rotatably supporting a portable electronic device includes a cover, a holder and a transmission cable. The holder has a first surface and a second surface opposite to each other. A sunken slot is formed on the first surface which supports the portable electronic device. A hole structure of the holder is connected to the sunken slot and formed between the first surface and the second surface, and an arc structure is disposed on the second surface to rotatably assemble with a rotary portion of the cover. A section of the transmission cable is connected to a first connector to be disposed inside the sunken slot, another section of cable is connected to a second connector to be embedded into the cover, and a middle section of the cable pierces through the hole structure to electrically connect the first connector with the second connector.

Abstract: A testing holder for a chip unit, a multi site holding frame for plural chip units and a method for testing a die thereof are provided. The proposed multi site holding frame for testing plural chip units simultaneously includes a first holder frame having a plurality of testing holders. Each of the plurality of testing holders includes a holder body containing a specific one of the plural chip units, and a pressure releasing device formed on the holder body to release an insertion pressure when the specific one of the plural chip units is inserted in the holder body.

Abstract: Half-duplex (HD) operations enable low cost implementations of LTE terminals. Traditionally, HD operations may be linked to a particular frequency band which may not allow a mix of full-duplex (FD) and HD terminals in the same frequency band. Therefore, certain aspects of the present disclosure provide techniques for enabling coexistence, in a given frequency band, of HD and FD terminals, by introducing frequency bands designated for HD operation and overlapping existing frequency bands designated for FD operation.

Abstract: A display module including a backlight module and a display panel is provided. The backlight module includes a light guide plate and a light source module. The light guide plate has a light incident surface, a light-exiting surface, a light-guiding inclined surface, a bottom surface, and a lateral surface, wherein the light-guiding inclined surface is connected to the light incident surface and the light-exiting surface; the light incident surface, the light-guiding inclined surface, and a portion of the bottom surface constitute a wedge portion while the light-exiting surface, the lateral surface, and other portions of the bottom surface constitute a plate portion. The light source module is disposed at the light incident surface and emits light into the wedge portion. The display panel is disposed on the light guide plate and has a side. The side of the display panel has a projection disposed in the light-guiding inclined surface or the plate portion.

Abstract: A method for fabricating a MEMS device includes providing a micro-electro-mechanical system (MEMS) substrate having a sacrificial layer on a first side, providing a carrier including a plurality of cavities, bonding the first side of the MEMS substrate on the carrier, forming a first bonding material layer on a second side of the MEMS substrate, applying a sacrificial layer removal process to the MEMS substrate, providing a semiconductor substrate including a second bonding material layer and bonding the semiconductor substrate on the second side of the MEMS substrate.

Abstract: Systems and methods are presented for identifying individuals through facial recognition, voice recognition, or the like, recalling past recorded conversations with the identified individuals, and recording and inventorying conversations with the individuals with mobile devices. In some embodiments, a method is presented. The method may include identifying, at a device, an individual through facial recognition, voice recognition, or a unique RFID. The method may also include recording a conversation with the identified individual, and recalling past relevant recorded conversations based on the identification of the individual, and transmitting the recording of the conversation to a display system configured to display the recording of the event.

Abstract: A method and system for utilizing the biometric factors reflected in the typing as a kind of physiological password, to create a rhythmic password specific to the user, and to authenticate based on the rhythmic password. The method includes providing an original training text to a user, receiving an input training text provided by the user according to the original training text, extracting rhythmic characteristic values between adjacent text units of the input training text, and generating a rhythmic password of the user based on the extracted rhythmic characteristic values between adjacent text units. The invention utilizes the rhythm of a user inputting text can bring multiple advantages, including enhanced security of the password, and saving the user's cost of memorizing the password.

Abstract: An illumination device includes a base, a light-emitting module, a first layer, and a second layer. The light-emitting module is disposed on the base for generating a progressive-type light-emitting intensity. The first layer encapsulates the light-emitting module. The second layer encloses the first layer. The second layer has a progressive-type thickness corresponding to the progressive-type light-emitting intensity, and both the progressive-type light-emitting intensity and the progressive-type thickness are decreased or increased gradually, thus the progressive-type light-emitting intensity can be transformed into the same light-emitting intensity through the progressive-type thickness of the second layer.

Abstract: A semiconductor device is provided. The semiconductor device includes a substrate of a first conductivity type and an epitaxial structure of the first conductivity type disposed on the substrate. The semiconductor device further includes a well region having a first doping concentration of a second conductivity type disposed in the epitaxial structure and the substrate. The semiconductor device further includes a drain region and a source region respectively formed in the epitaxial structure inside and outside of the well region. The semiconductor device further includes a body region of the first conductivity type disposed under the source region, and a pair of first and second doped regions disposed in the well region between the drain region and the source region. The first and second doped regions extend outside of the well region and toward the body region.

Abstract: The present invention discloses a touch sensing circuit for capacitive touch panel formed on a substrate comprises a transparent conductive layer having a thickness of 100 ?-500 ?; a conductive layer having a thickness of 1000 ?-5000 ?; and an insulating layer having a thickness of 1 ?m-5 ?m disposed between the transparent conductive layer and the conductive layer.

Abstract: The invention provides a novel strain of cadmium-removing Lactobacillus plantarum bacterium, CCFM8610, which has a good tolerance to acidic environments. Lactobacillus plantarum CCFM8610 has a good tolerance to cadmium-containing medium and can effectively bind cadmium in vitro. Animal studies have shown that it can effectively reduce tissue cadmium accumulation and facilitate fecal cadmium excretion. Lactobacillus plantarum CCFM8610 has a great potential to be used as an active ingredient in cadmium-removing pharmaceutical drugs and fermented foods.

Abstract: A resistive memory device is provided, comprising a bottom electrode, a patterned dielectric layer with a via formed on the bottom electrode, a barrier layer formed at sidewalls and a bottom surface of the via as a liner, a ring-shaped metal layer formed at sidewalls and a bottom surface of the barrier layer, and a ring-shaped metal oxide formed on a top surface of the ring-shaped metal layer.

Abstract: A method for collecting a signal with a frequency lower than a Nyquist frequency includes, by a data transmitting end, selecting a suitable transformation base matrix for an input signal, deriving a sparse representation of the signal using the transformation base matrix to determine a sparsity of the signal, calculating a number M of compressive sampling operations according to the sparsity, sampling the signal with fNYQ/M using M channels, and integrating sampling values of each channel to obtain M measurement values. A reconstruction end reconstructs an original signal by solving optimization problems. Based on theory, compressive sampling can be performed on a sparse signal or a signal represented in a sparse manner with a frequency much lower than the Nyquist frequency, overcoming restrictions of the typical Nyquist sampling theorem. The method can be implemented simply and decrease pressure on data collection, storage, transmission and processing.

Abstract: In one embodiment a method of extending power supply hold-up time by controlling a transformer turn ratio may include an input capacitor receiving an input voltage of a transformer unit. A first control transistor may switch a first transformer winding to an on state in response to the input voltage being above a voltage threshold level. The first control transistor may switch the first transformer winding to an off state in response to the input voltage being below the voltage threshold level. A second control transistor may switch a second transformer winding to an on state in response to the input voltage being below the voltage threshold level, wherein the first transformer winding and the second transformer winding may include separate windings located on a same side of a magnetic core of the transformer unit. In an embodiment the transformer unit may include a power supply unit.

Abstract: A proxy apparatus includes a processor and a memory storing instructions executed by the processor to determine whether a received packet has a corresponding application proxy and, if so, apply application proxy processing optimizations to the packet plus overlay network optimizations to the packet. Wherein the application proxy processing optimizations include header reduction for header fields that remain static from transmission to transmission.

Abstract: A method and system is disclosed for providing access to the body of a FinFET device. In one embodiment, a FinFET device for characterization comprises an active fin comprising a source fin, a depletion fin, and a drain fin; a side fin extending from the depletion fin and coupled to a body contact for providing access for device characterization; and a gate electrode formed over the depletion fin and separated therefrom by a predetermined dielectric layer, wherein the gate electrode and the dielectric layer thereunder have a predetermined configuration to assure the source and drain fins are not shorted.

Abstract: A sapphire pad conditioner includes a sapphire substrate having multiple protrusions on a surface and a holder arranged to hold the sapphire substrate. The sapphire substrate is used for conditioning a chemical mechanical planarization (CMP) pad.

Abstract: In one aspect, a method for providing design point recommendations for an integrated circuit (IC) design is disclosed. The method comprises receiving an IC design along with a reference PPA (power, performance, area) metric at a reference design point, and a target PPA metric. The method also comprises estimating trial PPA metrics for the IC design at multiple design points, wherein estimating trial PPA metric at each design point includes accessing a PPA database containing PPA metrics for multiple test components, determining scale factors from the reference design point to the trial design point for test components equivalent to components of the IC design, and applying the scale factors to the reference PPA metric to determine the trial PPA metric for the trial design point. The method further comprises recommending a trial design point based on the estimated trial PPA metric and the received target PPA metric.

Abstract: A package includes a molding compound, a through-via penetrating through the molding compound, a device die molded in the molding compound, and a buffer layer on and contacting the molding compound. An opening is through the buffer layer to the through-via. The buffer layer has ripples in a plane parallel to an interface between the molding compound and the buffer layer and around a circumference of the opening. Other embodiments contemplate an additional package bonded to the package, and methods for forming the package.