Abstract: In an embodiment, a device includes: a passivation layer on a semiconductor substrate; a first redistribution line on and extending along the passivation layer; a second redistribution line on and extending along the passivation layer; a first dielectric layer on the first redistribution line, the second redistribution line, and the passivation layer; and an under bump metallization having a bump portion and a first via portion, the bump portion disposed on and extending along the first dielectric layer, the bump portion overlapping the first redistribution line and the second redistribution line, the first via portion extending through the first dielectric layer to be physically and electrically coupled to the first redistribution line.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes an interconnection structure over a semiconductor substrate and a conductive pillar over the interconnection structure. The conductive pillar has a protruding portion extending towards the semiconductor substrate from a lower surface of the conductive pillar. The semiconductor device structure also includes an upper conductive via between the conductive pillar and the interconnection structure and a lower conductive via between the upper conductive via and the interconnection structure. The lower conductive via is electrically connected to the conductive pillar through the upper conductive via. The conductive pillar extends across opposite sidewalls of the upper conductive via and opposite sidewalls of the lower conductive via. A top view of an entirety of the second conductive via is separated from a top view of an entirety of the protruding portion.

Abstract: A method and apparatus for sending subscriber identifiers are disclosed. The method includes: receiving information of a USIM card from a UICC in a cloud card pool over a first communication connection; receiving an identity request from a 5G SA network, wherein the identity request is for requesting acquiring a SUCI; acquiring the SUCI based on the identity request and the information of the USIM card; and sending the SUCI to the 5G SA network, wherein the SUCI is for establishing a second communication connection. The SUCI may be generated at the ME or at the UICC. The first communication connection may be a roaming communication connection and the second communication connection may be a non-roaming communication connection.

Abstract: A semiconductor device has a conductive via laterally separated from the semiconductor, an encapsulant between the semiconductor device and the conductive via, and a mark. The mark is formed from characters that are either cross-free characters or else have a overlap count of less than two. In another embodiment the mark is formed using a wobble scan methodology. By forming marks as described, defects from the marking process may be reduced or eliminated.

Abstract: A method includes forming a fin over a substrate, forming a dummy gate structure over the fin, removing a portion of the fin adjacent the dummy gate structure to form a first recess, depositing a stressor material in the first recess, removing at least a portion of the stressor material from the first recess, and after removing the at least a portion of the stressor material, epitaxially growing a source/drain region in the first recess.

Abstract: The invention presents a universal eyedrop adapter designed for efficient and hygienic eye drop administration. The adapter features a one-way valve at the top to prevent backflow, a reduced internal lumen to minimize drop wastage, and a controlled flow design for precise dispensing. The base incorporates spiral grooves for a secure fit and to prevent outflow. Constructed with an antimicrobial material, the adapter is bug-resistant, ensuring a clean application process. The ergonomic design includes a bent angle and a rounded tip to mitigate the risk of eye injury. The administration process involves attaching the adapter to most eyedrop containers, cleaning it and the receiving periorbital region with a sterile wipe, squeezing to dispense a drop at the rounded tip, and then touching the lateral canthus. The user blinks to utilize surface tension and a lateral-to-medial movement, bringing the drop onto the ocular surface.

Abstract: Embodiments of the present invention provide a hybrid system and method for distributed virtual power plants integrated intelligent net zero. In this method, a cyber physical agent (CPA) is utilized to collect a carbon emission information and an energy management information, and then an artificial intelligence (AI) optimization model of an intelligent central dispatch platform is utilized to obtain a power dispatch manner of the distributed virtual power plants based on the carbon emission information and the energy management information, such that the power dispatch manner of the distributed virtual power plants meets the requirements of enterprise economic benefits and net zero carbon emissions at the same time.

Abstract: A method is provided. The method includes determining a first bump map indicative of a first set of positions of bumps. The method includes determining, based upon the first bump map, a first plurality of bump densities associated with a plurality of regions of the first bump map. The method includes smoothing the first plurality of bump densities to determine a second plurality of bump densities associated with the plurality of regions of the first bump map. The method includes determining, based upon the second plurality of bump densities, a second bump map indicative of the first set of positions of the bumps and a set of sizes of the bumps.

Abstract: A method of transmitting signals in a display device includes receiving a first data signal at a first data rate in a first time interval, and receiving a second data signal at a second data rate in a second time interval. The second data signal is generated at the second data rate, the second data rate is different from the first data rate, and the second time interval is non-overlapping with the first time interval.

Abstract: Provided is a method for processing video data. The method includes: acquiring a second outline of at least one object in an (n+1)th image frame of a to-be-compressed video data group based on a fuzzy algorithm; determining a motion vector of the at least one object according to the second outline and a first outline of the at least one object in an nth image frame of the to-be-compressed video data group; acquiring compressed video data according to the motion vector and a start image frame of to-be-compressed video data; and sending the compressed video data to an apparatus for displaying images.

Abstract: A semiconductor device includes a substrate, an epitaxial layer, a well region, a source region, a base region, a first JFET region, a second JFET region, a gate dielectric layer and a gate layer. The epitaxial layer is at a side of the substrate. The well region is in the epitaxial layer. The source region is in the well region. The base region is in the well region and adjacent to the source region. The first JFET region is adjacent to the well region. The second JFET region is in the first JFET region. A doping concentration of the second JFET region is higher than a doping concentration of the first JFET region. The gate dielectric layer is at a side of the epitaxial layer away from the substrate. The gate layer is at a side of the gate dielectric layer away from the epitaxial layer.

Abstract: A bond pad connector to be disposed on a stretchable substrate and adapted to secure an electronic component thereon. The bond pad connector includes two spaced apart bond pads that are adapted to be disposed on the stretchable substrate to face each other. Each of the two bond pads is adapted to be connected to a respective conductive trace and includes: a stress relieve component that is adapted to be connected to the conductive trace, the stress relieve component being formed with a central hole; and an extension component extending from the stress relieve component and opposite to the conductive trace. The electronic component is secured onto the bond pad connector by attaching the electronic component to, for each of the bond pads, at least a part of the extension component.

Abstract: Methods and systems for techniques for determining control information in wireless networks are disclosed. In an implementation, a method of wireless communication includes receiving, by a wireless device, a first configuration of multiple traffic channels on multiple cells scheduled by a downlink control information (DCI) and a second configuration of multiple traffic channels on one cell scheduled by the DCI, and receiving the multiple traffic channels scheduled by the DCI.

Abstract: A display panel and a display device are provided. The display panel includes a first display region, a first optical component region, and a second optical component region. The first optical component region and the second optical component region are arranged along a first direction. The first display region at least partially surrounds the first optical component region and the second optical component region. The first display region includes first signal lines extending along the first direction. Each of some first signal lines includes a first line segment and a second line segment. The first line segment and the second line segment are electrically connected through a first connection line; and at least a portion of line segments of the first connection line is arranged in layers different from the first line segment and the second line segment.

Abstract: A device structure according to the present disclosure may include a first die having a first substrate and a first interconnect structure, a second die having a second substrate and a second interconnect structure, and a third die having a third interconnect structure and a third substrate. The first interconnect structure is bonded to the second substrate via a first plurality of bonding layers. The second interconnect structure is bonded to the third interconnect structure via a second plurality of bonding layers. The third substrate includes a plurality of photodiodes and a first transistor. The second die includes a second transistor having a source connected to a drain of the first transistor, a third transistor having a gate connected to drain of the first transistor and the source of the second transistor, and a fourth transistor having a drain connected to the source of the third transistor.

Abstract: Some implementations described herein provide techniques and apparatuses for a fixture including a semiconductor die package and methods of formation. The semiconductor die package is mounted to an interposer. In addition to the semiconductor die package, the fixture includes a lid component having a top structure and footing structures that connect the lid component to the interposer. The fixture includes a thermal interface material between a top surface of the semiconductor die package and the top structure of the lid component. The footing structures, connected to the interposer using deposits of an epoxy material, provide increase a structural rigidity of the fixture relative to another fixture not including the footing structures.

Abstract: Methods, systems, and devices for wireless communication are described to support replacing values of one or more information bit vectors with one or more corresponding sets of parity bits. A first wireless device may replace an information bit vector with a parity bit vector, using a set of information bits of the information bit vector and based on a parity check matrix, which may result in generating the set of information bits at an information bit vector corresponding to a parity bit column of the parity check matrix, during encoding. The first wireless device may perform a transmission to a second wireless device, which may receive the transmission, decode the set of information bits to the information bit vector corresponding to the parity bit column. The second wireless device may replace other bit estimates of a vector corresponding to an information bit column with the set of information bits.

Abstract: A system for MRI-guided interventional needle procedures comprises a master device providing haptic feedback to and receiving position commands from the operator, a robot controller receiving position commands and providing force information to said master device, a navigation component receiving images from an MRI scanner; said navigation component providing trajectory planning information to said robot controller, a slave robot driving a needle, the slave robot receiving control information from the robot controller, and a fiber optic sensor operatively connected to said slave robot. The fiber optic sensor provides data to the robot controller to provide force information to the master device. The master device, robot controller, navigation component, slave robot and sensor are compatible with an MRI environment and operate inside an MRI scanner room.

Abstract: A resonator includes a resonance layer, a substrate, and a barrier layer. The barrier layer is located on the substrate, and the barrier layer and the substrate form a cavity. The cavity is configured to accommodate the resonance layer. The barrier layer includes a top wall and a side wall, and an inner surface of the side wall surrounds the resonance layer. An outer surface of the side wall includes a groove, and the groove surrounds the side wall.

Abstract: A computer-implemented method for aligning a sensor to reference coordinate system includes initiating a plurality of threads, each thread executes simultaneously and independent of each other. A first thread parses data received from the sensor and stores the parsed data in a data buffer. A second thread computes an alignment transformation using the parsed data to determine alignment between the sensor and the reference coordinate system. The computing includes checking that the data buffer contains at least predetermined amount of data. If at least the predetermined amount of data exists, an intermediate result is computed using the parsed data in the data buffer; otherwise, the second thread waits for the first thread to add more data to the data buffer. The second thread outputs the intermediate result into the data buffer. A third thread outputs the alignment transformation, in response to completion of alignment computations.