Patents by Inventor Hao Chen

Hao Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200334191
    Abstract: A method for processing a multi-media signal and an associated multi-media device are provided. The method includes: receiving a first audio signal within the multi-media signal from a display device through a first transmission interface of a multi-media device; converting the first audio signal into a second audio signal applicable to a second transmission interface of the multi-media device; and outputting the second audio signal to an audio device through the second transmission interface for playback.
    Type: Application
    Filed: January 16, 2020
    Publication date: October 22, 2020
    Inventors: Chao-Min Lai, Chia-Hao Wu, Yan-Jyun Chen, Guo-Yuan Luo
  • Publication number: 20200337045
    Abstract: Methods, systems, and devices are described for wireless communication at a device. A wireless device may be configured with a transmission time interval (TTI) bundling parameter. The device may then identify one or more resources for an uplink (UL) control channel based on the TTI bundling parameter (e.g., using either an implicit or an explicit indication from another wireless node such as a serving cell of a base station) and transmit the UL control channel using the identified resources. The device may also identify a downlink control information (DCI) format based on the TTI bundling parameter. For example, a resource allocation granularity level may be associated with the bundling parameter, and the length of a DCI field may depend on the resource allocation granularity level.
    Type: Application
    Filed: July 7, 2020
    Publication date: October 22, 2020
    Inventors: Wanshi Chen, Peter Gaal, Hao Xu
  • Publication number: 20200333711
    Abstract: Embodiments described provide dynamic imaging systems that compensates for pattern defects resulting from distortion caused by warpage of the substrate. The methods and apparatus described are useful to create compensated exposure patterns. The dynamic imaging system includes an inspection system configured to provide 3D profile measurements and die shift measurements of the first substrate to the interface configured to provide compensated pattern data to the digital lithography system configured to receive the compensated pattern data from the interface and expose the photoresist with a compensated pattern.
    Type: Application
    Filed: June 30, 2020
    Publication date: October 22, 2020
    Inventors: Ching-Chang CHEN, Chien-Hua LAI, Wei-Chung CHEN, Shih-Hao KUO, Hsiu-Jen WANG
  • Publication number: 20200336641
    Abstract: Systems, methods, and non-transitory computer readable media may be configured to characterize optical characteristics of optical elements. An optical element mount may be configured to carry an optical element. A calibration display may be configured to display a calibration object. The calibration object may include a known visual pattern. Multiple images of the calibration object may be obtained. The multiple images may be acquired using the optical element carried by the optical element mount. The multiple images may include different perspectives of the calibration object. Optical characteristics of the optical element may be characterized based on the known visual pattern and the different perspectives of the calibration object.
    Type: Application
    Filed: June 2, 2020
    Publication date: October 22, 2020
    Inventors: Yubo Zhang, Xiang Yu, Tiancheng Lou, Jun Peng, Kai Chen, Yiming Liu, Sinan Xiao, Tianyi Li, Yin Zhong, Hao Song
  • Publication number: 20200333188
    Abstract: A material optical transition analysis method and system are provided, the method includes: determining a dielectric function spectrum of a material to be analyzed, calculating a second derivative spectrum of the dielectric function spectrum related to the excitation light energy, and performing the CP fitting analysis on the second derivative spectrum to obtain a CP analysis result diagram of the material; drawing an energy band structure diagram and a PDOS diagram of the material, and drawing an energy difference diagram between CBs and VBs according to the energy band structure diagram of the material; determining spatial positions of CPs and the corresponding CBs and the VBs according to the CP analysis result diagram of the material and the energy difference diagram between the CBs and the VBs; and finally indicating the CBs and the VBs in the energy band structure diagram, and determining the particle types participating in formation of the CPs in the PDOS diagram to complete the material optical transi
    Type: Application
    Filed: July 25, 2019
    Publication date: October 22, 2020
    Applicant: HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY
    Inventors: Honggang Gu, Baokun Song, Shiyuan Liu, Mingsheng Fang, Xiuguo Chen, Hao Jiang
  • Publication number: 20200336256
    Abstract: Provided are an information processing method, a communication device and a storage medium. The information processing method which is applied to a first communication device includes: sending X sets of parameter values jointly encoding M types of transmission parameters, where the M types of transmission parameters include a beam indication and/or a quasi-co-location indication parameter, where the beam indication is used for indicating a beam, the quasi-co-location indication parameter is used for indicating a parameter of the beam, and M>1; selecting Y sets of parameter values from the X sets of parameter values, where X>=Y>=1; and sending a selection indication based on the Y sets of parameter values, where the selection indication is used for selecting the Y sets of parameter values from the X sets of parameter values for a data transmission.
    Type: Application
    Filed: February 20, 2020
    Publication date: October 22, 2020
    Inventors: Yijian Chen, Zhaohua Lu, Yu Ngok Li, Hao Wu, Bo Gao
  • Publication number: 20200329720
    Abstract: The present disclosure discloses a microwave processing method for food made of flour and rice fermented with sourdough and belongs to the technical field of food processing. It comprises: adding a sourdough to the raw material to prepare a steamed cake batter; fermenting the batter under the dielectric constant of 20˜34, the loss factor of 6.3˜9.0, the moisture content of 45˜55% and the water activity of 0.920˜0.980; and using microwave heating to obtain the microwave-steamed cake. Due to the regulating effect of the sourdough fermentation on the dielectric properties of the food material, it solves the problems of hard core, textual firmness and toughness, dryness and weak flavor caused by fast and uneven microwave heating without adding food additives; meanwhile, the sourdough fermentation process is optimized and the DY and additive amount of the sourdough are controlled to obtain the microwave-steamed cake with larger specific volume, lower hardness, more fine and uniform pores and better taste.
    Type: Application
    Filed: June 30, 2020
    Publication date: October 22, 2020
    Inventors: Daming FAN, Bowen YAN, Yejun WU, Huizhang LIAN, Kai WANG, Jianxin ZHAO, Hao ZHANG, Huayu YANG, Xiuxiu LI, Yin ZHANG, Jinbiao FEI, Wenguo ZHOU, Ke PANG, Jianlian HUANG, Qingmiao ZHANG, Wei CHEN
  • Publication number: 20200333132
    Abstract: The invention discloses a rapid measurement method for an ultra-thin film optical constant, which includes following steps: S1: using a p-light amplitude reflection coefficient rp and an s-light amplitude reflection coefficient rs of an incident light irradiating to an ultra-thin film to be measured to express an amplitude reflection coefficient ratio ? of the ultra-thin film: ? = r p r s ; S2: performing a second-order Taylor expansion to ? = r p r s at df=0 while taking 2?df/? as a variable to obtain a second-order approximation form; S3: performing merging, simplifying and substituting processing to the second-order approximation form for transforming the same into a one-variable quartic equation; S4: solving the one-variable quartic equation to obtain a plurality of solutions of the optical constant of the ultra-thin film, and obtaining a correct solution through conditional judgment, so as to achieve the rapid measurement for the ultra-thin film optical constant.
    Type: Application
    Filed: July 15, 2019
    Publication date: October 22, 2020
    Applicant: HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY
    Inventors: Honggang Gu, Shiyuan Liu, Simin Zhu, Baokun Song, Hao Jiang, Xiuguo Chen
  • Publication number: 20200332244
    Abstract: The present invention discloses a piezoelectric ultrasonic microinjection device based on a flexible hinge mechanism. The device includes: a cover, a flexible hinge mechanism, a base, a screw cap and an end cap fixedly assembled together, the base being provided with a pump interface; and a micropipette fixedly mounted in the base, the screw cap and the end cap and extending outward, the micropipette being in communication with the pump interface; wherein the flexible hinge mechanism comprises a housing, a piezoelectric ceramic package module encapsulated in the housing, a central shaft fixedly mounted with the piezoelectric ceramic package module and the base, and a vibration output shaft extending from the piezoelectric ceramic package module into the central shaft, a plurality of flexible hinge beams being disposed between the central shaft and the housing.
    Type: Application
    Filed: May 22, 2018
    Publication date: October 22, 2020
    Inventors: Haibo HUANG, Xiwei GAO, Liguo CHEN, Fei ZHOU, Hao GUO, Lingfeng CHANG, Jizhu LIU, Yangjun WANG, Lining SUN
  • Patent number: 10811384
    Abstract: A semiconductor package includes a redistribution structure, at least one semiconductor device, a heat dissipation component, and an encapsulating material. The at least one semiconductor device is disposed on and electrically connected to the redistribution structure. The heat dissipation component is disposed on the redistribution structure and includes a concave portion for receiving the at least one semiconductor device and an extending portion connected to the concave portion and contacting the redistribution structure, wherein the concave portion contacts the at least one semiconductor device. The encapsulating material is disposed over the redistribution structure, wherein the encapsulating material fills the concave portion and encapsulates the at least one semiconductor device.
    Type: Grant
    Filed: December 13, 2019
    Date of Patent: October 20, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shih-Wei Chen, Chih-Hua Chen, Hsin-Yu Pan, Hao-Yi Tsai, Lipu Kris Chuang, Tin-Hao Kuo
  • Patent number: 10812252
    Abstract: In aspects of string matching in encrypted data, a computing device stores homomorphic encrypted data as a dataset, and implements a string matching application that receives an encrypted query string as a query of the homomorphic encrypted data. The string matching application can then apply algorithms to perform addition and multiplication operations, and determine whether there are matching strings of the encrypted query string in the dataset. The string matching application can compute, for each row of the dataset, a sum of some function of dataset bits and query bits for a row result, and multiply the row results of the computed rows to determine matching strings. Alternatively, the string matching application can compute, for each row of the dataset, a product over some function of the dataset bits and the query bits for a row result, and add the row results of the computed rows to determine matching strings.
    Type: Grant
    Filed: June 22, 2017
    Date of Patent: October 20, 2020
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Kim Henry Martin Laine, Hao Chen, Gizem S. Cetin, Yuhou Xia, Peter B. Rindal, Kristin Estella Lauter
  • Patent number: 10810153
    Abstract: The present invention provides a chip processing device and a method for chip processing using the same, where the device can program, detect, reset or inspect a plurality of chips, and meanwhile has one or more functions of programming, detecting, identifying, resetting or inspecting. The plurality of chips has different communication interfaces, and/or uses different communication protocols. The chip processing device can be configured to program, detect, identify, reset or inspect a chip after obtaining the model of the chip to be processed, thus having higher universality.
    Type: Grant
    Filed: February 26, 2016
    Date of Patent: October 20, 2020
    Assignee: APEX MICROELECTRONICS CO., LTD.
    Inventors: Meichao Qi, Jinxin Liu, Peng Lou, Bin Zhou, Hao Chen
  • Patent number: 10813082
    Abstract: Certain aspects of the present disclosure propose techniques for transmission time interval (TTI) bundling for control channels (e.g., physical downlink control channel (PDCCH) and enhanced PDCCH) in long term evolution (LTE). According to certain aspects a method is provided for wireless communications. The method may be performed, for example, by a user equipment (UE). The method generally includes determining a first set of possible decoding candidates for the downlink control channel in a first subframe of the bundle of subframes and a second set of possible decoding candidates for the downlink control channel in a second subframe in the bundle of subframes, wherein the first set of possible decoding candidates and the second set of possible decoding candidates are different and processing the bundle of subframes based, at least in part, on the determination.
    Type: Grant
    Filed: April 29, 2014
    Date of Patent: October 20, 2020
    Assignee: QUALCOMM Incorporated
    Inventors: Wanshi Chen, Hao Xu, Tingfang Ji, Peter Gaal
  • Patent number: 10813100
    Abstract: Certain aspects of the present disclosure relate to techniques for assigning resources for low cost user equipments (UEs). A method for wireless communications by a user equipment (UE) is provided. The method generally includes determining a first bandwidth, within a second bandwidth, for resources available for downlink data transmissions, wherein the first bandwidth is greater than the second bandwidth, determining a third bandwidth for resources available for uplink transmissions, wherein a bandwidth for resources available for uplink transmissions is different than the bandwidth for resources available for downlink transmissions, wherein the third bandwidth is greater than the first bandwidth, and communicating with a network using the determined downlink and uplink resources.
    Type: Grant
    Filed: October 17, 2016
    Date of Patent: October 20, 2020
    Assignee: QUALCOMM Incorporated
    Inventors: Wanshi Chen, Hao Xu, Peter Gaal
  • Patent number: 10808593
    Abstract: An internal combustion engine makes available exhaust gas which can be treated by means of a catalytic converter and a particle filter. A method for determining the particle load of the particle filter comprises steps of determining the storage capacity of the catalytic converter for oxygen and determining the particle load of the particle filter on the basis of the determined storage capacity in the controller.
    Type: Grant
    Filed: March 27, 2018
    Date of Patent: October 20, 2020
    Assignee: Vitesco Technologies GmbH
    Inventors: Michael Nienhoff, Paul Rodatz, Hong Zhang, Hao Chen
  • Patent number: 10812231
    Abstract: Methods, systems, and devices for wireless communication are described. A user equipment (UE) may use multiple-input multiple-output (MIMO) layer specific and codeword specific communication configurations to communicate with multiple base stations. For example, multiple base stations may be configured to provide coordinated multipoint (CoMP) transmissions to the UE. One or more of the base stations may transmit a set of communications configurations to the UE that includes at least one MIMO layer specific or codeword specific configuration. The UE may then receive a dynamic indication of which communication configuration to use during a specific time period. The UE may then communicate with one or more of the base stations using the indicated configuration during the specified time period.
    Type: Grant
    Filed: March 16, 2017
    Date of Patent: October 20, 2020
    Assignee: QUALCOMM Incorporated
    Inventors: Wanshi Chen, Peter Gaal, Hao Xu
  • Patent number: 10811578
    Abstract: A LED carrier includes a substrate, a conductive layer, an adhesive layer, and a reflector. The conductive layer is disposed on the substrate, and has a bonding portion and an extending portion. The bonding portion has a top surface higher than a top surface of the extending portion. The adhesive layer covers the extending portion of the conductive layer and exposes the bonding portion of the conductive layer. The reflector is disposed over the adhesive layer. The adhesive layer has a hook portion in contact with a corner of the reflector.
    Type: Grant
    Filed: March 27, 2019
    Date of Patent: October 20, 2020
    Assignee: LEXTAR ELECTRONICS CORPORATION
    Inventors: Chih-Hao Lin, Chun-Peng Lin, Chang-Han Chen, Kuang-Neng Yang, Cheng-Ta Kuo
  • Patent number: 10810135
    Abstract: In a data transmission method, an SoC obtains a first request, where the first request includes a first address of a storage medium and an operation type, and the first address is an address assigned by a processor to the storage medium in a memory address managed by the processor; determines a second address according to the first address and generating a second request message, where the second address is an address assigned by the SoC to the storage medium in a memory address managed by the SoC; and sends first control instruction to a DMA controller of the storage medium according to the second address, where the first control instruction is used to instruct the DMA controller to obtain the second request message.
    Type: Grant
    Filed: July 26, 2019
    Date of Patent: October 20, 2020
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Hao Chen, Sicong Li, Yajun Chen
  • Patent number: 10811338
    Abstract: A surface treatment and an apparatus for semiconductor packaging are provided. A surface of a conductive layer is treated to create a roughened surface. In one example, nanowires are formed on a surface of the conductive layer. In the case of a copper conductive layer, the nanowires may include a CuO layer. In another example, a complex compound is formed on a surface of the conductive layer. The complex compound may be formed using, for example, thiol and trimethyl phosphite.
    Type: Grant
    Filed: December 17, 2019
    Date of Patent: October 20, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Horng Chang, Jie-Cheng Deng, Tin-Hao Kuo, Ying-Yu Chen
  • Publication number: 20200324252
    Abstract: An air-impermeable water vapor transport membrane comprises an active layer on a microporous polymeric substrate. The active layer comprises a polyethylene-oxide containing copolymer and a polar protic solvent in an amount of about 3% to about 100% of copolymer weight in the active layer. Molecules of the protic solvent are bonded to the copolymer. The polar protic solvent reduces temperature-dependent variability in the water-vapor permeability of the membrane.
    Type: Application
    Filed: January 16, 2020
    Publication date: October 15, 2020
    Inventors: Ryan Nicholas HUIZING, Hao CHEN, Frankie Kin Bong WONG