Patents by Inventor Hao Chen

Hao Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250012029
    Abstract: The partition monitoring method for concrete dam operation key parts provided by the disclosure firstly utilizes the extracted monitoring data time-frequency vector to partition the concrete dam key parts, and on this basis, obtains time series measurement data of different types of monitoring instruments with high temporal and spatial correlation, so as to establish a graph structure. Then, the dependence of time dimension and variable dimension of multivariate time series data is captured, and the relationship between further learning and representation of graph attention network is provided. Furthermore, the final feature representation of time series measured data is obtained, and finally the anomaly score is calculated through the final feature representation to detect anomalies. The complementary mutual verification of multiple measuring points of monitoring instruments with various types is realized. The structural integrity and spatial distribution law of concrete dams are fully embodied.
    Type: Application
    Filed: January 25, 2024
    Publication date: January 9, 2025
    Inventors: Hao CHEN, Haibin XIAO, Tengfei BAO, Daming ZHU, Yingchi MAO, Wei ZENG, Zhiyong ZHAO, Minglong YANG, Xu CHEN, Zhiting CHEN, Hua LIU, Guangyou SHI, Libing ZHANG, Haojiang ZHANG, Zhen GUAN, Fengyu XIE, Shunbo WANG, Xiaokun XU, Chenglong XIONG, Haifeng GUO
  • Publication number: 20250013157
    Abstract: Provided are a manufacturing method of an overlay mark and an overlay measurement method. The manufacturing method includes the following steps. A first stitching overlay mark structure having a plurality of first patterns is formed on a first layer. A second layer is formed on the first layer. A second stitching overlay mark structure having a plurality of second patterns is formed on the second layer. The second stitching overlay mark structure is located above the first stitching overlay mark structure, and from the top view on the second layer, the second patterns and the first patterns are alternately arranged.
    Type: Application
    Filed: August 10, 2023
    Publication date: January 9, 2025
    Applicant: United Microelectronics Corp.
    Inventors: Chun-Yi Chang, Chien-Hao Chen
  • Patent number: 12186256
    Abstract: This application provides a massager including a shell, where the shell includes a first body, a second body, and a silicone sleeve, the first body and the second body are inserted along a length direction of the shell, and the silicone sleeve sleeves the first body and the second body; a jacking assembly configured to extend and retract to drive the second body to move relative to the first body along the length direction of the shell; and an expansion assembly configured to expand so as to enlarge a diameter of the silicone sleeve outside the second body. In this application, the jacking assembly and the expansion assembly are used to increase the length and diameter of the massager.
    Type: Grant
    Filed: June 17, 2024
    Date of Patent: January 7, 2025
    Assignee: Guangzhou Tiankang Limei Electronic Technology Co., Ltd.
    Inventors: Lei Zhong, Hao Chen, Xiangteng Jiang, Xiaoting Lan
  • Patent number: 12186954
    Abstract: An injection molding system includes an injection station, a molding device, and a plunger. The injection station includes a platform including an opening and an injector over the platform. The molding device is disposed between the platform and the injector and over the opening, wherein the molding device includes a mold cavity and a clamping unit for clamping the molding device. The plunger under the platform, wherein the plunger includes a base and a rod extendable through the opening toward the molding device and retractable toward the base. An injection molding method includes conveying a molding device to an injection station and disposing the molding device between an injector and a platform; disposing a plunger under the platform; moving the injector towards the molding device; applying a plunging force on the molding device by extending the rod through the opening; and injecting a molding material into a mold cavity.
    Type: Grant
    Filed: January 20, 2021
    Date of Patent: January 7, 2025
    Assignee: KING STEEL MACHINERY CO., LTD.
    Inventors: Liang-Hui Yeh, Ching-Hao Chen
  • Publication number: 20250004193
    Abstract: A modal-conditioning, single-mode fiber generally includes a core portion and a cladding portion. The core portion includes a core and an inner cladding. The core comprises an outer radius r1 and a maximum relative refractive index ?1max. The inner cladding comprises an outer radius r2 and a relative refractive index ?2. The cladding portion surrounds the core portion and includes a low-index trench surrounding the inner cladding. The low-index trench includes an outer radius r3 and a minimum relative refractive index ?3min. The radius r2 of the inner cladding may be greater than 12 ?m and ?1max>?2>?3min. The fiber comprises a mode field diameter MFD greater than or equal to 12 ?m and less than or equal to 16 ?m at a wavelength of 1310 nm and a 30 mm diameter bend loss of less than or equal to 0.5 dB/turn at 1310 nm.
    Type: Application
    Filed: June 10, 2024
    Publication date: January 2, 2025
    Inventors: Hao Chen, Xin Chen, Ming-Jun Li, Qi Wu
  • Patent number: 12184975
    Abstract: A focus chasing method includes: determining a current preview picture from a target image acquired by a terminal; determining a position area of the current preview picture in the target image in response to determining that there is a target focus chasing object in the current preview picture; and performing focus chasing on the target focus chasing object in the current preview picture according to the position area.
    Type: Grant
    Filed: October 31, 2022
    Date of Patent: December 31, 2024
    Assignee: BEIJING XIAOMI MOBILE SOFTWARE CO., LTD.
    Inventors: Hao Chen, Jie Liu
  • Patent number: 12183590
    Abstract: A method includes depositing a silicon layer, which includes first portions over a plurality of strips, and second portions filled into trenches between the plurality of strips. The plurality of strips protrudes higher than a base structure. The method further includes performing an anneal to allow parts of the first portions of the silicon layer to migrate toward lower parts of the plurality of trenches, and performing an etching on the silicon layer to remove some portions of the silicon layer.
    Type: Grant
    Filed: March 13, 2023
    Date of Patent: December 31, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: De-Wei Yu, Chien-Hao Chen, Chia-Ao Chang, Pin-Ju Liang
  • Patent number: 12185490
    Abstract: Examples of a supporting assembly for supporting an installable component are described. The supporting assembly comprises a supporting member. The supporting assembly may further include a latch bar extending longitudinally to support the installable component. The supporting assembly may further include a coupling arm and a control knob. In an example, the control knob may be rotatable, and is to control rotation of the latch bar.
    Type: Grant
    Filed: July 31, 2020
    Date of Patent: December 31, 2024
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chun-Wei Kuo, Chien-Hao Chen, Bang-Zhong Xu, Justin Tinhsi Lee
  • Patent number: 12181916
    Abstract: A foldable computing device comprises a first frame rotatably coupled to a second frame. The second frame comprises a push-to-open mechanism comprising an actuator and a power switch located for actuation by the actuator. A detection mechanism detects a displaced position of the actuator that corresponds to releasing the foldable computing device from a closed configuration. Actuation of the power switch is detected and used with detection of the displaced position of the actuator to control an operating state of the computing device.
    Type: Grant
    Filed: October 13, 2022
    Date of Patent: December 31, 2024
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Michael Dale Jensen, James Hao-An Chen Lin, Mika Martti Ylitalo
  • Patent number: 12183629
    Abstract: A method includes forming a gate electrode on a semiconductor region, recessing the gate electrode to generate a recess, performing a first deposition process to form a first metallic layer on the gate electrode and in the recess, wherein the first deposition process is performed using a first precursor, and performing a second deposition process to form a second metallic layer on the first metallic layer using a second precursor different from the first precursor. The first metallic layer and the second metallic layer comprise a same metal. The method further incudes forming a dielectric hard mask over the second metallic layer, and forming a gate contact plug penetrating through the dielectric hard mask. The gate contact plug contacts a top surface of the second metallic layer.
    Type: Grant
    Filed: July 20, 2022
    Date of Patent: December 31, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chung-Chiang Wu, Po-Cheng Chen, Kuo-Chan Huang, Pin-Hsuan Yeh, Wei-Chin Lee, Hsien-Ming Lee, Chien-Hao Chen, Chi On Chui
  • Patent number: 12181722
    Abstract: Disclosed are apparatus and methods for a silicon photonic (SiPh) structure comprising the integration of an electrical integrated circuit (EIC); a photonic integrated circuit (PIC) disposed on top of the EIC; two or more polymer waveguides (PWGs) disposed on top of the PIC and formed by layers of cladding polymer and core polymer; and an integration fan-out redistribution (InFO RDL) layer disposed on top of the two or more PWGs. The operation of PWGs is based on the refractive indexes of the cladding and core polymers. Inter-layer optical signals coupling is provided by edge-coupling, reflective prisms and grating coupling. A wafer-level system implements a SiPh structure die and provides inter-die signal optical interconnections among the PWGs.
    Type: Grant
    Filed: August 9, 2023
    Date of Patent: December 31, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yu-Hao Chen, Hui-Yu Lee, Chung-Ming Weng, Jui-Feng Kuan, Chien-Te Wu
  • Publication number: 20240430842
    Abstract: Methods and apparatuses for operating multiple carriers in a wireless communication system. A method for a first network entity comprises: identifying a plurality of carrier frequencies for measuring carrier phases from a set of predefined carrier frequencies; estimating, based on the measured carrier phase, a distance between the first network entity and a second network entity using a carrier ranging operation that is performed between the first network entity and the second network entity; selecting, based on the estimated distance, historical information, a variation of measured distance, and channel status information, at least one carrier frequency from the plurality of carrier frequencies to refine distance measurement; and transmitting, to and receive from the second network entity, signals over the selected at least one carrier frequency.
    Type: Application
    Filed: November 29, 2023
    Publication date: December 26, 2024
    Inventors: Wei Sun, Shunyao Wu, Hao Chen, Vishnu Vardhan Ratnam, Jianzhong Zhang
  • Publication number: 20240427685
    Abstract: A non-intrusive interaction method includes an electronic device that obtains a description file of an application, where the description file indicates a function to be implemented by the application, and is defined using a non-intrusive protocol description; determines a first component based on the description file, where the first component is a component that is in components of the electronic device and that can implement the function that needs to be implemented by the application, and the component is configured based on a non-intrusive protocol to provide a device capability service and can implement an independent function; and runs, based on the description file to provide the device capability service for the application, the first component to implement the function.
    Type: Application
    Filed: June 24, 2024
    Publication date: December 26, 2024
    Inventors: Jianfeng Wang, Hao Chen, Xiaoyun Yang, Chi Guan, Xiaoxiao Chen
  • Publication number: 20240430828
    Abstract: A method includes calibrating, at a wireless device, a wireless fidelity (Wi-Fi) chipset-level timer based on a time synchronization function (TSF) frame received from a Wi-Fi access point. The method also includes performing, at the wireless device, a coarse synchronization of a microcontroller-level or CPU-level timer based on the calibrated Wi-Fi chipset-level timer. The method further includes performing, at the wireless device, a fine synchronization of the microcontroller-level or CPU-level timer after the coarse synchronization. The fine synchronization is performed according to a first time scale measured in first time units and the coarse synchronization is performed according to a second time scale measured in second time units that are a multiple of the first time units.
    Type: Application
    Filed: February 28, 2024
    Publication date: December 26, 2024
    Inventors: Feng Qi, Abhishek Sehgal, Hao Chen, Jianzhong Zhang
  • Publication number: 20240428502
    Abstract: An electronic device may include a lenticular display. The lenticular display may have a lenticular lens film formed over an array of pixels. The lenticular lenses may be configured to enable stereoscopic viewing of the display such that a viewer perceives three-dimensional images. The display may render different content layers that present different classes of content. The different classes of content may have different characteristics. As an example, a first class of content may be static content whereas a second class of content may be dynamic content. The different characteristics of each class of content may be leveraged to use a hybrid approach for content processing. The hybrid content processing may take advantage of different layers needing to be updated at different frequencies and may take advantage of sparse content in some of the layers.
    Type: Application
    Filed: May 2, 2024
    Publication date: December 26, 2024
    Inventors: Fu-Chung Huang, ByoungSuk Kim, Felipe Bacim De Araujo E Silva, Hao Chen, Igor Kozintsev, Pavel V Dudrenov, Ping-Yen Chou, Seung Wook Kim, Sheng Zhang, Victor H Yin, Wei H Yao, Wei Xiong, Yang Li, Yi Huang, Yi-Pai Huang, Justin A Meiners
  • Publication number: 20240428738
    Abstract: A pixel circuit includes a driving circuit, a first control circuit and a second control circuit. The driving circuit is configured to receive a data signal in response to a scan signal, and generate, in response to a first enable signal, a driving signal according to a first voltage and the data signal. The first control circuit is configured to: receive a first input signal in response to a first control signal, and transmit a third input signal in response to the first input signal; and receive a second input signal in response to a second control signal, and transmit a second enable signal in response to the second input signal. The second control circuit is configured to transmit the driving signal to an element to be driven in response to one of the third input signal and the second enable signal.
    Type: Application
    Filed: September 4, 2024
    Publication date: December 26, 2024
    Inventors: Li XIAO, Haoliang ZHENG, Hao CHEN, Minghua XUAN, Dongni LIU, Seungwoo HAN, Liang CHEN, Jiao ZHAO, Xue DONG
  • Patent number: 12174675
    Abstract: A holding device for retaining an installable component in a chassis of a computing device may includes a longitudinally extending first arm, and a movably coupled second arm. The holding device may further include a first engaging portion at first end of the holding device, and a second engaging portion at the second end of the holding device. The engaging portions may couple the holding device to the chassis of the computing device. Furthermore, the holding device may comprise a gripping member. The gripping member is to securely retain the installable component within the chassis of the computing device, and is movable across the length of the holding device.
    Type: Grant
    Filed: November 26, 2019
    Date of Patent: December 24, 2024
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Bangzhong Xu, Chun Wei Kuo, Cheng-Liang Gong, Chien Hao Chen
  • Patent number: 12176261
    Abstract: A structure includes a circuit substrate, a device, a metal layer, a lid and a thermal interface material layer. The device is disposed on and electrically connected to the circuit substrate. The device includes at least one semiconductor die laterally encapsulated by an insulating encapsulation. The metal layer is covering a back surface of the at least one semiconductor die and the insulating encapsulation. The lid is disposed on the circuit substrate, and the lid is adhered to the metal layer through the thermal interface material layer.
    Type: Grant
    Filed: July 21, 2023
    Date of Patent: December 24, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Hao Chen, Chin-Fu Kao, Li-Hui Cheng, Szu-Wei Lu
  • Patent number: 12172976
    Abstract: Provided are delocalized lipophilic cation (DLC) compounds and methods of using such compounds. Also provided are pharmaceutical compositions that include a DLC compound. Provided methods include methods of killing cells and methods of fluorescently labeling mitochondria by contacting the cells with a DLC compound of the present disclosure. Also provided are methods of imaging cell mitochondria, methods of determining whether a patient has a mitochondria related disease, and methods of treating a patient for a mitochondria related disease. Kits that include compounds of the present disclosure are also provided.
    Type: Grant
    Filed: January 10, 2020
    Date of Patent: December 24, 2024
    Assignee: The Board of Trustees of the Leland Stanford Junior University
    Inventors: Zhen Cheng, Hao Chen
  • Patent number: RE50258
    Abstract: A projection device includes a light source module, an optical engine module, a projection lens, a housing, and at least one first heat dissipating element. The housing comprises a first end and a second end opposite to each other. The at least one first heat dissipating element is disposed in the housing, and each of the at least one first heat dissipating element includes a first plate portion, a second plate portion, and a first fin portion. The first plate portion is connected to the light source module. The second plate portion is connected to the first plate portion. The first fin portion is connected to the second plate portion and includes a plurality of first fins arranged at intervals. These first fins are arranged between the first end and the second end.
    Type: Grant
    Filed: March 14, 2022
    Date of Patent: December 31, 2024
    Assignee: Coretronic Corporation
    Inventors: Jhih-Hao Chen, Wei-Min Chien, Tsung-Ching Lin, Shi-Wen Lin