Patents by Inventor Hao Chuang

Hao Chuang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200227461
    Abstract: Various embodiments of the present application are directed to a narrow band filter with high transmission and an image sensor comprising the narrow band filter. In some embodiments, the filter comprises a first distributed Bragg reflector (DBR), a second DBR, a defect layer between the first and second DBRs, and a plurality of columnar structures. The columnar structures extend through the defect layer and have a refractive index different than a refractive index of the defect layer. The first and second DBRs define a low transmission band, and the defect layer defines a high transmission band dividing the low transmission band. The columnar structures shift the high transmission band towards lower or higher wavelengths depending upon a refractive index of the columnar structures and a fill factor of the columnar structures.
    Type: Application
    Filed: April 1, 2020
    Publication date: July 16, 2020
    Inventors: Cheng Yu Huang, Chun-Hao Chuang, Chien-Hsien Tseng, Kazuaki Hashimoto, Keng-Yu Chou, Wei-Chieh Chiang, Wen-Hau Wu
  • Publication number: 20200220577
    Abstract: A wireless charging signal transmitting method includes continuously transmitting short beacons in a time cycle, each short beacon being used to detect a load change; and transmitting a long beacon only when the short beacons detect the load change to start detecting one or more connection broadcast signals. Moreover, a wireless power transmitting unit is also provided. Accordingly, the method and the device reduce the power consumption of a wireless charging system during the standby period.
    Type: Application
    Filed: January 8, 2020
    Publication date: July 9, 2020
    Applicant: NEWVASTEK CO., LTD.
    Inventors: Ming-Liang Fang, Sheng-Kuan Chen, Chih-Hao Chuang
  • Patent number: 10700117
    Abstract: Methods for forming an image sensor structure are provided. The method includes forming a light-sensing region in a substrate and forming a storage node adjacent to light-sensing region in the substrate. The method further includes forming a front side isolation structure partially surrounding an upper portion of the light-sensing region and forming a trench fully surrounding a bottom portion of the light-sensing region to expose a bottom surface of the front side isolations structure. The method further includes forming a backside isolation structure in the trench.
    Type: Grant
    Filed: November 27, 2018
    Date of Patent: June 30, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Yuichiro Yamashita, Chun-Hao Chuang, Hirofumi Sumi
  • Patent number: 10672812
    Abstract: An image sensor includes a color filter array and a light receiving element. The color filter array includes plural repeating unit cells including first, second, and third unit cells. The first and second unit cells are adjacent to each other in a first direction, the second and third unit cells are adjacent to each other in a second direction transverse to the first direction. Each of the first, second, and third unit cells includes at least one first yellow filter configured to transmit a green component and a red component of incident light, and each of the first, second, and third unit cells does not comprise a red filter configured to transmit the red component of the incident light. The light receiving element is configured to convert the incident light transmitted by the color filter array into electric signals.
    Type: Grant
    Filed: July 8, 2019
    Date of Patent: June 2, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Wei-Chieh Chiang, Keng-Yu Chou, Chun-Hao Chuang, Chien-Hsien Tseng, Kazuaki Hashimoto
  • Patent number: 10651220
    Abstract: Various embodiments of the present application are directed to a narrow band filter with high transmission and an image sensor comprising the narrow band filter. In some embodiments, the filter comprises a first distributed Bragg reflector (DBR), a second DBR, a defect layer between the first and second DBRs, and a plurality of columnar structures. The columnar structures extend through the defect layer and have a refractive index different than a refractive index of the defect layer. The first and second DBRs define a low transmission band, and the defect layer defines a high transmission band dividing the low transmission band. The columnar structures shift the high transmission band towards lower or higher wavelengths depending upon a refractive index of the columnar structures and a fill factor of the columnar structures.
    Type: Grant
    Filed: October 10, 2018
    Date of Patent: May 12, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Cheng Yu Huang, Chun-Hao Chuang, Chien-Hsien Tseng, Kazuaki Hashimoto, Keng-Yu Chou, Wei-Chieh Chiang, Wen-Hau Wu
  • Patent number: 10651225
    Abstract: In some embodiments, the present disclosure relates to a three-dimensional integrated chip. The three-dimensional integrated chip includes a first integrated chip (IC) die and a second IC die. The first IC die has a first image sensor element configured to generate electrical signals from electromagnetic radiation within a first range of wavelengths. The second IC die has a second image sensor element configured to generate electrical signals from electromagnetic radiation within a second range of wavelengths that is different than the first range of wavelengths. A first band-pass filter is arranged between the first IC die and the second IC die and is configured to reflect electromagnetic radiation that is within the first range of wavelengths.
    Type: Grant
    Filed: October 18, 2018
    Date of Patent: May 12, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Cheng Yu Huang, Chun-Hao Chuang, Chien-Hsien Tseng, Kazuaki Hashimoto, Keng-Yu Chou, Wei-Chieh Chiang, Wen-Hau Wu
  • Publication number: 20200144848
    Abstract: A cigar lighter having a wireless electricity receiving function includes a housing, a first electric-conductor, a second electric-conductor, a receive coil, a rectifier module, a voltage adjustment module, and an output end. The first electric-conductor and the second electric-conductor protrude from the housing to be in contact with a first electrode terminal and a second electrode terminal of a connector. The receive coil is located on the housing. The rectifier module is located in a chamber of the housing, and the rectifier module is electrically connected to the receive coil. The voltage adjustment module is located in the chamber and is electrically connected to the first electric-conductor, the second electric-conductor, and the rectifier module. The output end is located at one end of the housing and is electrically connected to the voltage adjustment module. In addition, a portable power supply device having a wireless electricity receiving function is also provided.
    Type: Application
    Filed: November 6, 2019
    Publication date: May 7, 2020
    Applicant: NEWVASTEK CO., LTD.
    Inventors: Ming-Liang Fang, Sheng-Kuan Chen, Chih-Hao Chuang
  • Publication number: 20200144847
    Abstract: A wireless charging converting apparatus includes a circuit board, a receive coil, a primary circuit, a transmit coil, a high-frequency magnetic isolation sheet, and a low-frequency magnetic isolation sheet. The receive coil is located on the circuit board to receive a high-frequency magnetic signal and convert the high-frequency magnetic signal into a first alternating-current signal. The primary circuit is located on the circuit board to receive the first alternating-current signal and convert the first alternating-current signal into a second alternating-current signal. The transmit coil is to convert the second alternating-current signal into a low-frequency magnetic signal. The low-frequency magnetic isolation sheet is located between the transmit coil and the circuit board. The high-frequency magnetic isolation sheet is located between the low-frequency magnetic isolation sheet and the receive coil. In addition, a protective shell having a wireless charging converting apparatus is also provided.
    Type: Application
    Filed: November 6, 2019
    Publication date: May 7, 2020
    Applicant: NEWVASTEK CO., LTD.
    Inventors: Ming-Liang Fang, Sheng-Kuan Chen, Chih-Hao Chuang
  • Publication number: 20200119076
    Abstract: A BSI image sensor includes a substrate including a front side and a back side opposite to the front side, a pixel sensor disposed in the substrate, and a color filter disposed over the pixel sensor. The pixel sensor includes a plurality of first micro structures disposed over the back side of the substrate. The color filter includes a plurality of second micro structures disposed over the back side of the substrate. Each of the first micro structures has a first height, and each of the second micro structures has a second height. The second height is less than the first height.
    Type: Application
    Filed: December 13, 2019
    Publication date: April 16, 2020
    Inventors: WEI-CHIEH CHIANG, KENG-YU CHOU, CHUN-HAO CHUANG, WEN-HAU WU, JHY-JYI SZE, CHIEN-HSIEN TSENG, KAZUAKI HASHIMOTO
  • Publication number: 20200105815
    Abstract: In some embodiments, the present disclosure relates to a three-dimensional integrated chip. The three-dimensional integrated chip includes a first integrated chip (IC) die and a second IC die. The first IC die has a first image sensor element configured to generate electrical signals from electromagnetic radiation within a first range of wavelengths. The second IC die has a second image sensor element configured to generate electrical signals from electromagnetic radiation within a second range of wavelengths that is different than the first range of wavelengths. A first band-pass filter is arranged between the first IC die and the second IC die and is configured to reflect electromagnetic radiation that is within the first range of wavelengths.
    Type: Application
    Filed: October 18, 2018
    Publication date: April 2, 2020
    Inventors: Cheng Yu Huang, Chun-Hao Chuang, Chien-Hsien Tseng, Kazuaki Hashimoto, Keng-Yu Chou, Wei-Chieh Chiang, Wen-Hau Wu
  • Publication number: 20200098808
    Abstract: An image sensor package is provided. The image sensor package comprises a package substrate, and an image sensor chip arranged over the package substrate. The integrated circuit device further comprises a protection layer overlying the image sensor chip having a planar top surface and a bottom surface lining and contacting structures under the protection layer, and an on-wafer shield structure spaced around a periphery of the image sensor chip. The height of the image sensor package can be reduced since a discrete cover glass or an infrared filter and corresponding intervening materials are no longer needed since being replaced by the build in protection layer. The size of the image sensor package can be reduced since a discrete light shield and corresponding intervening materials are no longer needed since being replaced by the build in on wafer light shield structure.
    Type: Application
    Filed: December 20, 2018
    Publication date: March 26, 2020
    Inventors: Wen-Hau Wu, Chun-Hao Chuang, Kazuaki Hashimoto, Keng-Yu Chou, Wei-Chieh Chiang, Cheng Yu Huang
  • Publication number: 20200098801
    Abstract: The present disclosure, in some embodiments, relates to an integrated chip. The integrated chip has an image sensor within a substrate. A first dielectric has an upper surface that extends over a first side of the substrate and over one or more trenches within the first side of the substrate. The one or more trenches laterally surround the image sensor. An internal reflection structure arranged over the upper surface of the first dielectric. The internal reflection structure is configured to reflect radiation exiting from the substrate back into the substrate.
    Type: Application
    Filed: November 26, 2019
    Publication date: March 26, 2020
    Inventors: Keng-Yu Chou, Chun-Hao Chuang, Chien-Hsien Tseng, Kazuaki Hashimoto, Wei-Chieh Chiang, Cheng Yu Huang, Wen-Hau Wu, Chih-Kung Chang, Jhy-Jyi Sze
  • Publication number: 20200098813
    Abstract: In some embodiments, an image sensor is provided. The image sensor includes a photodetector disposed in a semiconductor substrate. A wave guide filter having a substantially planar upper surface is disposed over the photodetector. The wave guide filter includes a light filter disposed in a light filter grid structure. The light filter includes a first material that is translucent and has a first refractive index. The light filter grid structure includes a second material that is translucent and has a second refractive index less than the first refractive index.
    Type: Application
    Filed: May 20, 2019
    Publication date: March 26, 2020
    Inventors: Cheng Yu Huang, Chun-Hao Chuang, Chien-Hsien Tseng, Kazuaki Hashimoto, Keng-Yu Chou, Wei-Chieh Chiang, Wen-Chien Yu, Ting-Cheng Chang, Wen-Hau Wu, Chih-Kung Chang
  • Publication number: 20200091754
    Abstract: A low-energy-consumption high-frequency wireless charging system for a lithium battery, the main structure comprises a power-supply module connected in series with a first resonant unit; wherein the first resonant unit is electrically connected to a resonance-tuning module; wherein the resonance-tuning module comprises a first shunt unit and a second resonant unit both electrically connected with the first resonant unit; and the first shunt unit is electrically connected to a third resonant unit and a rectifier module; wherein the third resonant unit is connected in parallel with the rectifier module; and the rectifier module is electrically connected with a voltage stabilizing module which is connected in parallel with a power-storage element. When the power-storage element is charging, the resonance-tuning module has a charging curve with better efficiency to achieve the effect of Class-E wireless fast charging.
    Type: Application
    Filed: September 17, 2018
    Publication date: March 19, 2020
    Inventors: Ming Liu, Chengbin Ma, Ming-Liang Fang, Chih-Hao Chuang
  • Publication number: 20200091210
    Abstract: A BSI image sensor includes a substrate including a front side and a back side opposite to the front side, a pixel sensor disposed in the substrate, an isolation structure surrounding the pixel sensor and disposed in the substrate, a dielectric layer disposed over the pixel sensor on the front side of the substrate, and a plurality of conductive structures disposed in the dielectric layer and arranged to align with the isolation structure.
    Type: Application
    Filed: November 22, 2019
    Publication date: March 19, 2020
    Inventors: WEN-HAU WU, KENG-YU CHOU, CHUN-HAO CHUANG, WEI-CHIEH CHIANG, CHIEN-HSIEN TSENG, KAZUAKI HASHIMOTO
  • Patent number: 10594205
    Abstract: A high-frequency half-wave rectifier system of low-harmonicity and high-efficiency, which mainly comprises: a current output device having an output end and a first flow-return end respectively at both ends, a rectifying module, a resonant tuning unit, a first node, a voltage regulator module, at least one load element, a grounding portion, and at least one flow-return path. By means of the above structure, a simple circuit configuration and appropriate capacitance value setting are used to control the duty cycle of the rectifying module to approximately 74 nanoseconds and adjust the output power and improve the AC to DC conversion efficiency for the rectifying module under the low electromagnetic interference condition.
    Type: Grant
    Filed: August 1, 2018
    Date of Patent: March 17, 2020
    Assignee: NEWVASTEK CO., LTD.
    Inventors: Ming Liu, Chengbin Ma, Ming-Liang Fang, Chih-Hao Chuang
  • Publication number: 20200058636
    Abstract: A transient voltage suppression device includes a lightly-doped semiconductor structure, a first doped well, a first heavily-doped area, a first buried area, and a second heavily-doped area. The lightly-doped semiconductor structure has a first conductivity type. The first doped well has a second conductivity type and is formed in the lightly-doped semiconductor structure. The first heavily-doped area has the second conductivity type and is formed in the first doped well. The first buried area has the first conductivity type and is formed in the lightly-doped semiconductor structure and under the first doped well, and the first buried area is adjacent to the first doped well. The second heavily-doped area has the second conductivity type and is formed in the lightly-doped semiconductor structure.
    Type: Application
    Filed: August 20, 2018
    Publication date: February 20, 2020
    Inventors: KUN-HSIEN LIN, ZI-PING CHEN, CHE-HAO CHUANG
  • Publication number: 20200051971
    Abstract: A floating base silicon controlled rectifier is provided, which at least comprises a first conductivity type layer; a second conductivity type well formed in the first conductivity type layer; a first conductivity type heavily doped region coupled to a first node and formed in the second conductivity type well; and a second conductivity type heavily doped region coupled to a second node and formed in the first conductivity type layer. The first conductivity type and the second conductivity type are opposite. When the first conductivity type is N type, the second conductivity type is P type. Alternatively, when the first conductivity type is P type, the second conductivity type is N type. By employing the proposed present invention, the floating base silicon controlled rectifier acts as a forward diode, and an input capacitance can be greatly reduced.
    Type: Application
    Filed: August 13, 2018
    Publication date: February 13, 2020
    Inventors: Chih-Ting YEH, Che-Hao CHUANG
  • Publication number: 20200044475
    Abstract: The present invention relates to a multi-receiving wireless charging system and the method thereof. The main structure comprises: A wireless power supply component which wirelessly transmits a power signal to a plurality of receiving components, and the power signal is pass though one receiving element, one receiving compensation element, one receiving resistance element, and one rectifier element in each of the receiving components; and then the power signal is transmitted to the load element. Therefore, the chance of overheating is reduced and the charging efficiency is increased.
    Type: Application
    Filed: August 1, 2018
    Publication date: February 6, 2020
    Inventors: Ming Liu, Chengbin Ma, Ming-Liang Fang, Chih-Hao Chuang
  • Publication number: 20200044556
    Abstract: A high-frequency half-wave rectifier system of low-harmonicity and high-efficiency, which mainly comprises: a current output device having an output end and a first flow-return end respectively at both ends, a rectifying module, a resonant tuning unit, a first node, a voltage regulator module, at least one load element, a grounding portion, and at least one flow-return path. By means of the above structure, a simple circuit configuration and appropriate capacitance value setting are used to control the duty cycle of the rectifying module to approximately 74 nanoseconds and adjust the output power and improve the AC to DC conversion efficiency for the rectifying module under the low electromagnetic interference condition.
    Type: Application
    Filed: August 1, 2018
    Publication date: February 6, 2020
    Inventors: Ming Liu, Chengbin Ma, Ming-Liang Fang, Chih-Hao Chuang