Patents by Inventor Hao Hsu

Hao Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • HIGH THROUGHPUT AND HIGH POSITION ACCURATE METHOD FOR PARTICLE INSPECTION OF MASK PODS
    Publication number: 20230049308
    Abstract: In a method of inspecting an outer surface of a mask pod, a stream of air is directed at a first location of a plurality of locations on the outer surface. One or more particles are removed by the directed stream of air from the first location on the outer surface. Scattered air from the first location of the outer surface is extracted and a number of particles in the extracted scattered air is determined as a sampled number of particles at the first location. The mask pod is moved and the stream of air is directed at other locations of the plurality of locations to determine the sampled number of particles in extracted scattered air at the other locations. A map of the particles on the outer surface of the mask pod is generated based on the sampled number of particles at the plurality of locations.
    Type: Application
    Filed: August 13, 2021
    Publication date: February 16, 2023
    Inventors: Shih-Jui HUANG, ShinAn KU, Ting-Hao HSU, Hsin-Chang LEE
  • SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
    Publication number: 20230050785
    Abstract: A semiconductor structure and a manufacturing method thereof are provided. The method includes the following steps. A plurality of conductive balls is placed over a circuit substrate, where each of the conductive balls is placed over a contact area of one of a plurality of contact pads that is accessibly revealed by a patterned mask layer. The conductive balls are reflowed to form a plurality of external terminals with varying heights connected to the contact pads of the circuit substrate, where a first external terminal of the external terminals formed in a first region of the circuit substrate and a second external terminal of the external terminals formed in a second region of the circuit substrate are non-coplanar.
    Type: Application
    Filed: August 12, 2021
    Publication date: February 16, 2023
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ting-Yu Yeh, Ching-He Chen, Kuo-Chiang Ting, Weiming Chris Chen, Chia-Hao Hsu, Kuan-Yu Huang, Shu-Chia Hsu
  • Voltage regulator with power rail tracking
    Patent number: 11579648
    Abstract: Disclosed herein are related to an integrated circuit to regulate a supply voltage. In one aspect, the integrated circuit includes a metal rail including a first point, at which a first functional circuit is connected, and a second point, at which a second functional circuit is connected. In one aspect, the integrate circuit includes a voltage regulator coupled between the first point of the metal rail and the second point of the metal rail. In one aspect, the voltage regulator senses a voltage at the second point of the metal rail and adjusts a supply voltage at the first point of the metal rail, according to the sensed voltage at the second point of the metal rail.
    Type: Grant
    Filed: November 24, 2021
    Date of Patent: February 14, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Haruki Mori, Hidehiro Fujiwara, Zhi-Hao Chang, Yangsyu Lin, Yu-Hao Hsu, Yen-Huei Chen, Hung-Jen Liao, Chiting Cheng
  • MEMORY DEVICE AND METHOD OF OPERATING THE SAME
    Publication number: 20230041094
    Abstract: A memory device and a method of operating the memory device are disclosed. In one aspect, the memory device includes a word line driver connected to a word line, a row of memory cells connected to the word line, each memory cell powered by a first supply voltage, and a power circuit. The power circuit is configured to provide the first supply voltage to the word line driver when a read condition is satisfied, and a second supply voltage to the word line driver when the read condition is not satisfied, the second supply voltage being less than the first supply voltage.
    Type: Application
    Filed: February 11, 2022
    Publication date: February 9, 2023
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tsung-Hsien Huang, Wei-jer Hsieh, Tsung-Yuan Huang, Yu-Hao Hsu
  • Notebook computer
    Patent number: 11573486
    Abstract: A notebook computer including a screen, a body, and a camera module is provided. The body is pivotally connected to the screen so that the screen is opened and closed relative to the body. The camera module is stored in one of the screen and the body and includes a photosensitive element and a first polarizer. The first polarizer is disposed between the screen and the photosensitive element. The screen includes a display panel and a second polarizer. The second polarizer is disposed between the display panel and the first polarizer. The first polarizer and the second polarizer have different polarization directions.
    Type: Grant
    Filed: October 19, 2021
    Date of Patent: February 7, 2023
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Hsin Yeh, Cheng-Hao Hsu, Ting-Hsuan Yu, Han-Tsai Liu, Jyh-Chyang Tzou, Chih-Wen Chiang
  • Electronic device with conductive lines on different levels
    Patent number: 11567377
    Abstract: An electronic device is provided. The electronic device includes a substrate, a driving circuit disposed on the substrate, an active area disposed on the substrate, and a wiring group disposed on the substrate and between the driving circuit and the active area. The wiring group includes a first conductive line and a second conductive line. The first conductive line has a first section and a second section electrically connected to the first section and disposed between the first section and the active area. The second conductive line includes a third section and a fourth section electrically connected to the third section and disposed between the third section and the active area. The first section and the second section are not the same layer. The first section and the fourth section are the same layer. The second section and the third section are the same layer.
    Type: Grant
    Filed: July 29, 2020
    Date of Patent: January 31, 2023
    Assignee: INNOLUX CORPORATION
    Inventors: Chih-Hao Hsu, Chia-Min Yeh, Hsieh-Li Chou, Cheng-Tso Chen, Hui-Min Huang, Li-Wei Sung, Yu-Ti Huang
  • Optical fingerprint sensor, preparation method thereof, and display device
    Patent number: 11562596
    Abstract: Disclosed are an optical fingerprint sensor, a preparation method thereof and a display device. The optical fingerprint sensor includes: a substrate; and a sensor unit, disposed on the substrate and including a thin film transistor and a photosensor electrically connected to the thin film transistor, where the thin film transistor includes a source electrode, a drain electrode, a semiconductor layer, and a light shield layer formed over a channel region between the source electrode and the drain electrode and shielding the semiconductor layer exposed in the channel region.
    Type: Grant
    Filed: March 31, 2021
    Date of Patent: January 24, 2023
    Assignees: BEIHAI HKG OPTOELECTRONICS TECHNOLOGY CO., LTD., HKC CORPORATION LIMITED
    Inventors: En-tsung Cho, Fengyun Yang, Je-hao Hsu, Haijiang Yuan
  • RANDOM-ACCESS OCCASION SELECTION FOR REDUCED-CAPABILITY USER EQUIPMENT
    Publication number: 20220417997
    Abstract: Methods, systems, and devices for wireless communications are described. The described techniques relate to improved methods, systems, devices, and apparatuses that support random-access occasion (RO) selection for reduced-capability (RedCap) user equipment (UEs). A RedCap UE operating in a half-duplex mode may use the techniques described herein to efficiently select an RO in which to transmit a random-access preamble based on a duration between a latest received downlink transmission and the RO satisfying a threshold duration. The UE may receive system information mapping a set of synchronization signal blocks (SSBs) to a set of ROs. The UE may then select an RO from the set of ROs in which to transmit the random-access preamble such that the UE has sufficient time to transition from a receive mode to a transmit mode to transmit the random-access preamble.
    Type: Application
    Filed: March 3, 2022
    Publication date: December 29, 2022
    Inventors: Jing Lei, Chao Wei, Muhammad Nazmul Islam, Linhai He, Yongle Wu, Chun-Hao Hsu, Murali Menon
  • Package containing device dies and interconnect die and redistribution lines
    Patent number: 11532585
    Abstract: A method includes bonding a first device die and a second device die to an interconnect die. The interconnect die includes a first portion over and bonded to the first device die, and a second portion over and bonded to the second device die. The interconnect die electrically connects the first device die to the second device die. The method further includes encapsulating the interconnect die in an encapsulating material, and forming a plurality of redistribution lines over the interconnect die.
    Type: Grant
    Filed: December 14, 2020
    Date of Patent: December 20, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kuo-Chiang Ting, Chi-Hsi Wu, Shang-Yun Hou, Tu-Hao Yu, Chia-Hao Hsu, Ting-Yu Yeh
  • POWER CONTROL SCHEME FOR ACTIVE BANDWIDTH PART TRANSITION
    Publication number: 20220394632
    Abstract: Disclosed are techniques for wireless communication. In an aspect, BS transmits first and second configurations for first and second BWPs to UE. The first BWP is set as an active BWP based on the first configuration. BS transmits TCP command(s) that set an active power control adjustment state. BS transitions the active BWP from the first BWP to the second BWP based on the second configuration. The active power control adjustment state is maintained after the active BWP transition (e.g., not reset to some default state).
    Type: Application
    Filed: June 8, 2021
    Publication date: December 8, 2022
    Inventors: Chun-Hao HSU, Nachiket NANADIKAR, Dinesh Kumar DEVINENI, Deepak WADHWA
  • BEAM DETERMINATION PRIOR TO BEAM ACTIVATION INDICATION
    Publication number: 20220394720
    Abstract: Various aspects of the present disclosure generally relate to systems, apparatuses, and methods for beam determination prior to an indication of an activated beam. A user equipment may receive a configuration for one or more transmission configuration indicator (TCI) states; receive downlink control information that schedules a downlink transmission after a time offset; determine, prior to receiving an indication of an activated TCI state of the one or more TCI states, a beam for receiving the downlink transmission; and receive the downlink transmission using the beam. Numerous other aspects are provided.
    Type: Application
    Filed: August 18, 2022
    Publication date: December 8, 2022
    Inventors: Yan ZHOU, Tao LUO, Chun-Hao HSU, Ruhua HE
  • RECEIVER ADJUSTMENT FOR WIRELESS COMMUNICATION
    Publication number: 20220385441
    Abstract: Methods, systems, and devices for wireless communications are described. In some examples, a user equipment (UE) may communicate with a base station using multiple receivers and receive an indication from the base station to activate a second bandwidth part of a set of bandwidth parts configured for the UE. In response to the indication, the UE may switch from operating in a first bandwidth part to operating in the second bandwidth part and adjust a quantity of active receivers at the UE based on switching from operating in the first bandwidth part to operating in the second bandwidth part. Additionally or alternatively, the UE may adjust the quantity of active receivers at the UE based on monitoring for downlink grants from the base station.
    Type: Application
    Filed: May 28, 2021
    Publication date: December 1, 2022
    Inventors: Yung-Yih Jian, Chun-Hao Hsu, Peter Pui Lok Ang, Alexei Yurievitch Gorokhov, Andrew Chen, Ping Liu, Fnu Saikrishna Vasudevan, Arundhathi Rajshekher Swami, Madhup Chandra, Shailesh Maheshwari
  • CHIP PACKAGE STRUCTURE WITH HEAT CONDUCTIVE LAYER
    Publication number: 20220384286
    Abstract: A chip package structure is provided. The chip package structure includes a substrate. The chip package structure includes a chip over the substrate. The chip package structure includes a first heat conductive layer between the heat-spreading wall structure and the chip. The chip package structure includes a second heat conductive layer over the chip and surrounded by the first heat conductive layer. The chip package structure includes a heat-spreading lid over the substrate and covering the heat-spreading wall structure, the first heat conductive layer, the second heat conductive layer, and the chip. The heat-spreading lid is bonded to the substrate, the heat-spreading wall structure, the first heat conductive layer, and the second heat conductive layer.
    Type: Application
    Filed: August 9, 2022
    Publication date: December 1, 2022
    Inventors: Shin CHI, Chien Hao HSU, Kuo-Chin CHANG, Cheng-Nan LIN, Mirng-Ji LII
  • Dynamic UE beam switching for mmWave measurements in asynchronous networks
    Patent number: 11516824
    Abstract: Dynamic User Equipment (UE) beam switching for millimeter wave (mmWave) measurements in asynchronous networks is discussed in which a UE configured with a plurality of UE beams receives timing information of detected cells in an asynchronous network, and calculates, based on the timing information, a maximum offset for the detected cells indicating a timing difference between a pair of cells of the detected cells that is larger than a timing difference between any other pair of the detected cells. A UE beam switch from a UE beam to another UE beam of the plurality of beams is scheduled based on the maximum offset, which includes using the maximum offset to determine how often the UE beam switch can be performed. Other aspects and features are also claimed and described.
    Type: Grant
    Filed: February 28, 2019
    Date of Patent: November 29, 2022
    Assignee: QUALCOMM Incorporated
    Inventors: Ting Kong, Chun-Hao Hsu, Yongle Wu, Yong Li, Jun Zhu, Raghu Narayan Challa
  • SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20220367335
    Abstract: A semiconductor device includes a dielectric interposer, a first redistribution layer, a second redistribution layer and conductive structures. The conductive structures are through the dielectric interposer, wherein the conductive structures are electrically connected to the first redistribution layer and the second redistribution layer. Each of the conductive structures has a tapered profile. A width of each of the conductive structures proximal to the first redistribution layer is narrower than a width of each of the conductive structure proximal to the second redistribution layer.
    Type: Application
    Filed: July 29, 2022
    Publication date: November 17, 2022
    Inventors: KUO-CHIANG TING, CHI-HSI WU, SHANG-YUN HOU, TU-HAO YU, CHIA-HAO HSU, PIN-TSO LIN, CHIA-HSIN CHEN
  • SYNCHRONIZED HINGES FOR FOLDABLE DISPLAYS
    Publication number: 20220365568
    Abstract: Embodiments of synchronized hinges for foldable displays are described. In some embodiments, a hinge may include: a first bracket coupled to a first shaft via a first arm, a second bracket coupled to a second shaft via a second arm, and a synchronization bracket coupled to the first and second shafts.
    Type: Application
    Filed: May 12, 2021
    Publication date: November 17, 2022
    Applicant: Dell Products, L.P.
    Inventors: Christopher A. Torres, Enoch Chen, Anthony J. Sanchez, Chia-Hao Hsu, Hsu Hong Yao, Mo-Yu Zhang
  • SEMICONDUCTOR DEVICE AND OPERATION METHOD THEREOF
    Publication number: 20220360222
    Abstract: A device includes a substrate, a first electrode and a second electrode. The first electrode is disposed on the substrate, and configured to receive an input signal. The second electrode is disposed on the substrate, and configured to output an output signal based on the input signal. When the input signal is configured to oscillate within a first range between a first voltage value and a second voltage value with a first frequency, the output signal is an inverted version of the input signal, and has the first frequency. When the input signal is configured to oscillate within a second range including the first voltage value without the second voltage value with the first frequency, the output signal has a second frequency which is approximately twice of the first frequency.
    Type: Application
    Filed: July 22, 2022
    Publication date: November 10, 2022
    Applicants: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., NATIONAL TAIWAN UNIVERSITY
    Inventors: Jenn-Gwo HWU, Ting-Hao HSU
  • IMMERSION COOLING SYSTEM AND ELECTRONIC APPARATUS HAVING THE SAME
    Publication number: 20220361377
    Abstract: An immersion cooling system including a rack and at least one immersion cooling module is provided. The immersion cooling module includes a chassis and a condensation pipeline. The chassis is slidably disposed on the rack and is adapted to accommodate a coolant. At least one heat generating component is adapted to be disposed in the chassis to be immersed in the liquid coolant. The condensation pipeline is disposed in the chassis and is located above the liquid coolant. In addition, an electronic apparatus having the immersion cooling system is also provided.
    Type: Application
    Filed: August 9, 2021
    Publication date: November 10, 2022
    Applicant: Wiwynn Corporation
    Inventors: Yu-Cheng Chu, Chin-Hao Hsu, Tsung-Han Li, Ting-Yu Pai
  • Modified polyvinyl alcohol-based polymer and its application
    Patent number: 11492436
    Abstract: The present disclosure provides a modified polyvinyl alcohol-based polymer, which comprises a modifying monomer unit represented by Formula wherein, X is a moiety comprising an alkenyl group, and the modified polyvinyl alcohol-based polymer has a saponification degree of 67 mol % to 78 mol % and a modification rate of 0.02 mol % to 1.5 mol %. The modified polyvinyl alcohol-based polymer is suitable to be used as a dispersant for suspension polymerization, to make the obtained polyvinyl chloride-based resin have reduced particle diameter and few coarse particles.
    Type: Grant
    Filed: January 24, 2022
    Date of Patent: November 8, 2022
    Assignee: CHANG CHUN PETROCHEMICAL CO., LTD.
    Inventors: Jyun-Ru Sun, Huan-Ming Chang, Cheng-Fan Wang, Chia-Hao Hsu
  • MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
    Publication number: 20220336321
    Abstract: A manufacturing method of a semiconductor package includes the following steps. An encapsulated semiconductor package is provided on a substrate. A heat dissipation sheet is cut into a plurality of heat dissipation films. The plurality of heat dissipation films are attached on the encapsulated semiconductor package, wherein the plurality of heat dissipation films jointly cover an upper surface of the encapsulated semiconductor package. A cover lid is provided on the substrate, wherein the cover lid is in contact with the plurality of heat dissipation films.
    Type: Application
    Filed: July 4, 2022
    Publication date: October 20, 2022
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ting-Yu Yeh, Cing-He Chen, Kuo-Chiang Ting, Weiming Chris Chen, Chia-Hao Hsu