Abstract: An ozone purification device is disclosed. The ozone purification device comprises an ultraviolet light source and a filter. The ultraviolet light source includes an ultraviolet lamp and a LED lamp. The ultraviolet lamp generates ultraviolet rays and the LED lamp generates heat. The filter is composed of a metal composite catalyst coated with an active carbon. When ozone passes through the ultraviolet light source, ozone is irradiated by the ultraviolet light lamp and the LED lamp of the ultraviolet light source, and then passes through the metal composite catalyst and the active carbon of the filter to accelerate the decomposition of ozone into oxygen.

Abstract: A method for preventing and handling in-car air pollution includes providing an out-car gas detector to detect a polluted gas outside a car and transmit an out-car gas detection data; providing an in-car gas detector to detect a polluted gas in an interior space of the car and transmit an in-car gas detection data; providing an in-car gas exchange system for controlling and determining whether to introduce a gas outside the car into the interior space, where the in-car gas exchange system includes a cleaning unit for filtering and purifying the polluted gas in the interior space and a control driving unit for receiving and comparing the out-car gas detection data with the in-car gas detection data; and filtering and exchanging the polluted gas in the interior space after the control driving unit compares the out-car gas detection data with the in-car gas detection data.

Abstract: A method for detecting and cleaning indoor air pollution is disclosed. The method includes steps of providing a plurality of gas detection devices disposed in an indoor space for detecting a property and a concentration of an air pollution, wherein the plurality of gas detection devices detect the air pollution to output air pollution data, perform an intelligent computation to determine a location of the air pollution, and intelligently and selectively issue a controlling instruction; and providing a plurality of physical or chemical filtration devices, each of the plurality of physical or chemical filtration devices including at least one fan and at least one filter element, wherein the fan is enabled by the controlling instruction to generate a directional airflow convection for guiding the air pollution to pass through the filter element, thereby filtering and cleaning the air pollution to generate a clean and safely breathable air state.

Abstract: A central controller for completely cleaning indoor air pollution is disclosed. The central controller is disposed in an indoor space to detect air pollution and output air pollution data. Intelligence operations are implemented in accordance with the air pollution data by the central controller to determine a location of the air pollution, and a controlling instruction is intelligently and selectively issued through a wireless communication transmission to enable a plurality of physical filtration devices or a plurality of chemical filtration devices. Each physical filtration device or each chemical filtration device includes a fan and a filter element. The fan is driven upon receiving the controlling instruction to generate an airflow convection in a direction. The air pollution is removed through the filter element, so that the air pollution in the indoor space is completely cleaned to form a clean and safe breathing air state.

Abstract: A conception of locating and completely cleaning indoor air pollution is provided. A plurality of physical or chemical first devices are disposed to determine characteristics, concentrations and locations of air pollution. A fan, a physical second device or a chemical second device is selected and enabled in accordance with the position closest to the location of the air pollution to generate an airflow. Various mathematical operations and artificial intelligence operations are implemented to improve efficiency of locating the air pollution, draining the air pollution and completely cleaning the air pollution. A wired and wireless network is utilized to optimize efficacy of the physical second device or the chemical second device. The mathematical operations are utilized through the wired and wireless network to maximize effects of the physical second device and the chemical second device for completely cleaning the air pollution.

Abstract: Provided is a package structure, including a die, a plurality of through vias, an encapsulant, a plurality of first connectors, a warpage control material and a protection material. The plurality of through vias are disposed around the die. The encapsulant laterally encapsulate the die and the plurality of through vias. The plurality of first connectors are electrically connected to a first surface of the plurality of through vias. The warpage control material is disposed over a first surface of the die. The protection material is disposed over the encapsulant, around the plurality of first connectors and the warpage control material. A Young's modulus of the warpage control material is greater than a Young's modulus of the encapsulant, and the Young's modulus of the encapsulant is greater than a Young's modulus of the protection material.

Abstract: A wafer structure is disclosed and includes a chip substrate and an inkjet chip. The chip substrate is a silicon substrate fabricated by a semiconductor process on a wafer of 12 inches. The inkjet chips are formed on the chip substrate by the semiconductor process and diced into the inkjet chip. The inkjet chip includes plural ink-drop generators generated by the semiconductor process on the chip substrate. Each of the plurality of ink-drop generators includes a nozzle. A diameter of the nozzle is in a range between 0.5 micrometers and 10 micrometers. A volume of an inkjet drop discharged from the nozzle is in a range between 1 femtoliter and 3 picoliters. The ink-drop generators form plural longitudinal axis array groups having a pitch and plural horizontal axis array groups having a central stepped pitch equal to or less than 1/600 inches.

Abstract: A lens assembly module includes a base, a cover, a lens unit, an elastic element, at least two conductive elements, at least one AF coil element and at least two first magnetic elements. The cover is coupled to the base. The lens unit is movably disposed in the cover. The elastic element is coupled to the lens unit. The conductive elements are coupled to the lens unit. The AF coil element is disposed on the lens unit, and two ends of the AF coil element are electrically connected to the conductive elements, respectively. The first magnetic elements are disposed in the cover. A part of each of the inner portions is overlapped along a direction parallel to an optical axis and electrically connected to each conductive element. The AF coil element and the conductive elements are electrically connected by a welding method.

Abstract: An indoor air pollution detection and purifying prevention method is disclosed and includes: providing a plurality of gas detection devices disposed in an indoor space for detecting air pollution and outputting air pollution data; and providing a plurality of filtration devices disposed in the indoor space. Each filtration device includes a driver for receiving the air pollution data. When the driver determines that air pollution data exceeding a safety detection value, the driver controls the corresponding filtration device to be enabled. The indoor space has a cardinal number of ten-pings area, the cardinal number is multiplied by 13 to obtain a maximum number, and the plurality of gas detection devices are disposed in the indoor space based on the maximum number for enabling the plurality of filtration devices, thereby filtering and purifying the air pollution in the indoor space to generate a clean and safely breathable air state.

Abstract: A light pass aperture module, in order along a central axis, includes a blade assembly and a cap. The blade assembly includes a plurality of blades. The blades form a light pass aperture, and the light pass aperture is variable in size with the central axis as a center. The cap covers the blade assembly. The cap has a through hole, and the through hole is disposed corresponding to the light pass aperture. The cap includes a surface level down structure. The surface level down structure is disposed corresponding to one of the blades, and the surface level down structure is closer to the one blade than the through hole.

Abstract: A method includes forming regions of solder paste on a redistribution structure, wherein the solder paste has a first melting temperature; forming solder bumps on an interconnect structure, wherein the solder bumps have a second melting temperature that is greater than the first melting temperature; placing the solder bumps on the regions of solder paste; performing a first reflow process at a first reflow temperature for a first duration of time, wherein the first reflow temperature is less than the second melting temperature; and after performing the first reflow process, performing a second reflow process at a second reflow temperature for a second duration of time, wherein the second reflow temperature is greater than the second melting temperature.

Abstract: A method includes forming regions of solder paste on a redistribution structure, wherein the solder paste has a first melting temperature; forming solder bumps on an interconnect structure, wherein the solder bumps have a second melting temperature that is greater than the first melting temperature; placing the solder bumps on the regions of solder paste; performing a first reflow process at a first reflow temperature for a first duration of time, wherein the first reflow temperature is less than the second melting temperature; and after performing the first reflow process, performing a second reflow process at a second reflow temperature for a second duration of time, wherein the second reflow temperature is greater than the second melting temperature.

Abstract: A method of handling a workpiece includes the following steps. A workpiece is placed on a chuck body, wherein the workpiece includes a tape carrier extending beyond a periphery of the chuck body and a workpiece body disposed on the tape carrier, and the chuck body includes a seal ring surrounding the periphery of the chuck body; the tape carrier is clamped outside the chuck body, wherein the tape carrier leans against the seal ring and an enclosed space is formed between the chuck body, the tape carrier and the seal ring; and a vacuum seal is formed by evacuating gas from the enclosed space to pull the periphery of the workpiece toward the chuck body.

Abstract: A wafer structure is disclosed and includes a chip substrate and at least one inkjet chip having plural ink-drip generators. Each ink-drop generator includes a thermal-barrier layer, a resistance heating layer and a protective layer. The thermal-barrier layer is formed on the chip substrate, the resistance heating layer is formed on the thermal-barrier layer, a part of the protective layer is formed on the resistance heating layer, and the barrier layer is formed on the protective layer. The ink-supply chamber has a bottom in communication with the protective layer, and a top in communication with the nozzle. The thermal-barrier layer has a thickness of 500˜5000 angstroms, the protective layer has a thickness of 150˜3500 angstroms, the resistance heating layer has a thickness of 100˜500 angstroms, the resistance heating layer has a length of 5˜30 microns, and the resistance heating layer has a width of 5˜10 microns.

Abstract: An imaging lens with an optical axis includes a lens carrier and a variable through hole assembly. The lens carrier is configured for at least one lens element to be disposed therein, and the lens carrier includes a mount structure. The variable through hole assembly includes a plurality of movable blades and a rotatable element. The movable blades movably and together surround the optical axis to form a through hole, and a size of the through hole is variable by movement of the movable blades. The rotatable element is connected to the movable blades, and the rotatable element moves the movable blades to vary the size of the through hole. At least one of the movable blades and the rotatable element of the variable through hole assembly is disposed on the mount structure.

Abstract: A semiconductor package includes a substrate, a semiconductor device over the substrate and a plurality of solder joint structures bonded between the semiconductor device and the substrate, wherein each of the plurality of solder joint structures includes, by weight percent, 2% to 23% of Indium (In).

Abstract: A package structure is provided. The package structure includes a semiconductor chip and a protective layer laterally surrounding the semiconductor chip. The package structure also includes a polymer-containing element over the protective layer. The protective layer is wider than the polymer-containing element.

Abstract: A workpiece holder includes a chuck body and a seal ring. The chuck body includes a receiving surface configured to receive a workpiece and at least one vacuum port configured to apply a vacuum seal. The seal ring surrounds a side surface of the chuck body. A top surface of the seal ring is higher than the receiving surface of the chuck body, and the workpiece leans against the seal ring when the vacuum seal is applied between the workpiece and the chuck body.

Abstract: A method of air pollution filtration in a vehicle is disclosed. A plurality of purification devices are provided to detect and transmit an inside-device gas detection datum, respectively, for intelligently selecting and controlling the activation of filtering the air pollution in the inner space of the vehicle. An in-car gas exchange system and a connection device are provided. The connection device receives and compares the respective inside-device gas detection datum, and selectively transmits a control instruction to drive the in-car gas exchange system and the purification devices. The movement of the air pollution is accelerated by the gas convention of the in-car gas exchange system, so that the air pollution is directionally moved toward the corresponding one of the purification devices adjacent to the air pollution for filtration. The air pollution in the inner space of the vehicle is filtered rapidly, so as to provide clean, safe and breathable air.

Abstract: A miniature gas detection and purification device is disclosed for a user to carry with himself, and includes a main body, a purification module, a gas guider and a gas detection module. The gas detection module detects gas of surrounding environment to obtain a gas detection datum, and controls the gas guider to be operated according to the gas detection datum, so that gas is inhaled into the main body and flows through the purification module for filtration and purification, and the gas purified is finally guided to a region close to the user.