Patents by Inventor Hao-Ming Lien

Hao-Ming Lien has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060279997
    Abstract: A method of using a non-volatile memory that utilizes a charge-trapping layer for data storage is described. A refresh step is performed, after the non-volatile memory is subject to multiple write/erase cycles causing hard-to-erase electrons in the charge-trapping layer, to eliminate the hard-to-erase electrons. After the refresh step, the non-volatile memory is used again.
    Type: Application
    Filed: June 8, 2005
    Publication date: December 14, 2006
    Applicant: MACRONIX INTERNATIONAL CO., LTD.
    Inventors: CHENG-HSING HSU, CHAO-I WU, HAO-MING LIEN, MING-HSIANG HSUEH
  • Publication number: 20030190873
    Abstract: A chemical-mechanical polishing platform that comprises a polishing table, a wafer carrier, a polishing pad, a slurry supplier, a conditioner, and a means for cleaning the polishing pad. With respect to in-situ or ex-situ chemical-mechanical polishing, the wafer carrier, conditioner, and means for cleaning the polishing pad are adequately disposed above the polishing pad. The chemical-mechanical polishing is performed by rotation of the polishing pad; the region of the polishing pad that has polished the wafer then passes sequentially through the conditioner, the means for cleaning that removes diamond particles that may drop on the polishing pad, and through the slurry supplier that provides adequate slurry such that the polishing process can be repeated without scraping damage of the wafer. The means for cleaning of the present invention can have any shapes adapted to remove diamond particles on the polishing pad, such as circular or cylindrical brush sweeper.
    Type: Application
    Filed: April 9, 2001
    Publication date: October 9, 2003
    Inventors: Jiun-Fang Wang, Ming-Cheng Yang, Hao-Ming Lien, Sam Chou
  • Publication number: 20020182986
    Abstract: A polishing pad includes a body formed of a polishing pad material and having a top polishing surface and a bottom surface; and an indicator disposed in said body and extending from an upper region of the body near the top polishing surface toward said bottom surface, for indicating wear of the polishing pad body during a life cycle of the polishing pad. An apparatus for polishing semiconductor wafers includes a polishing platen; a motor for rotating the polishing platen; and a polishing pad as described above mounted on the polishing platen. A method of polishing semiconductor wafers includes optically inspecting the indicator means to determine the wear of the body.
    Type: Application
    Filed: May 29, 2001
    Publication date: December 5, 2002
    Inventors: Jen-Chieh Tung, Hao-Ming Lien, Jiun-Fang Wang