Patents by Inventor Hao Peng

Hao Peng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250148746
    Abstract: The present disclosure discloses a chemical shift coded imaging method based on a transition region and regional iterative phasor extraction. Acquiring an initial image, and determining an initial phasor solution of the transition region based on the initial image; performing regional iterative phasor extraction in at least two set directions by taking the initial phasor solution as initial information, and obtaining a target phasor solution based on a regional iterative phasor extraction result corresponding to each set direction; and determining a first chemical composition signal and a second chemical composition signal based on the target phasor solution, and performing chemical shift coded imaging based on the first chemical composition signal and/or the second chemical composition signal.
    Type: Application
    Filed: January 13, 2025
    Publication date: May 8, 2025
    Applicant: SHENZHEN INSTITUTES OF ADVANCED TECHNOLOGY CHINESE ACADEMY OF SCIENCES
    Inventors: Hao PENG, Chao ZOU, Chuanli CHENG, Xin LIU, Hairong ZHENG
  • Patent number: 12293984
    Abstract: The present application is applicable to the field of semiconductor technology and provides a method for packaging stacking a flip chip, which includes: placing a filling template on a substrate, the filling template being provided with a through hole of a preset pattern; filling a filling material into the through hole of the filling template, and after the filling material being formed on the substrate, removing the filling template; placing a chip with solder balls on the substrate formed with the filling material, such that at least a portion of the solder balls being covered by the filling material; and connecting the chip to the substrate through the solder balls, and curing the filling material with air gaps formed between the at least a portion of the solder balls covered with the filling material.
    Type: Grant
    Filed: September 12, 2024
    Date of Patent: May 6, 2025
    Assignee: Hebei Beixin Semiconductor Technology Co., Ltd.
    Inventors: Honglei Ran, Kui Zhang, Shanbin Xi, Hao Peng, Huaguang Liu, Hailong Zhao
  • Patent number: 12288027
    Abstract: Disclosed is a text sentence processing method performed by a computer device, including: acquiring sample text sentences including entity pairs and relationship labels of the entity pairs; extracting positive and negative example sentence pairs from the sample text sentences according to the relationship labels, and performing positive-negative example sampling, to obtain a training set; inputting the training set into a relationship extraction model to generate loss values; and adjusting parameters of the relationship extraction model according to the loss values, and repeating the step of extracting positive and negative example sentence pairs from the sample text sentences according to the relationship labels to perform iterative training of the relationship extraction model until a training end condition is met, to obtain an updated relationship extraction model, the relationship extraction model being configured to identify an entity relationship of an entity pair in an input text sentence.
    Type: Grant
    Filed: December 1, 2022
    Date of Patent: April 29, 2025
    Assignee: TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
    Inventors: Zhiyuan Liu, Hao Peng, Tianyu Gao, Xu Han, Yankai Lin, Peng Li, Maosong Sun, Jie Zhou
  • Patent number: 12284876
    Abstract: An array substrate and a display panel are provided. A driving circuit layer of the array substrate includes a low temperature polysilicon thin film transistor and a low temperature polycrystalline oxide thin film transistor which are electrically connected with each other. A hydrogen blocking layer is formed on at least one of an upper side and a lower side of an oxide active layer of the low temperature polysilicon thin film transistor. The hydrogen blocking layer can block hydrogen ions in other film layers to invade the oxide active layer and avoid that device characteristics are drifted.
    Type: Grant
    Filed: March 31, 2024
    Date of Patent: April 22, 2025
    Assignee: WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
    Inventors: Huihui Zhao, Hao Peng
  • Publication number: 20250112108
    Abstract: A semiconductor package structure includes a package substrate and a semiconductor die. The package substrate includes a core structure, a heat sink, and a redistribution layer. The heat sink is embedded in the core structure. The redistribution layer includes a thermal via disposed over the heat sink. The semiconductor die is disposed over the package substrate and is thermally coupled to the heat sink through the thermal via.
    Type: Application
    Filed: July 2, 2024
    Publication date: April 3, 2025
    Inventors: Tai-Hao PENG, Yao-Tsung HUANG
  • Publication number: 20250092124
    Abstract: Provided in the present disclosure is an antibody or fragment thereof against a human growth and differentiation factor 15 (GDF15). Further provided in the present disclosure is the use of the antibody or fragment thereof in the preparation of a drug for treating diseases or conditions. The antibody or fragment thereof provided in the present disclosure can bind to human GDF15 with high affinity and specificity, blocks the interaction of GDF15 with receptor GFRAL thereof, and has a longer half-life period in vivo in comparison with antibodies of the same kind.
    Type: Application
    Filed: January 26, 2022
    Publication date: March 20, 2025
    Applicant: YUNNAN BAIYAO GROUP CO., LTD.
    Inventors: Jinying Ning, Hao Peng, Feng Hao, Feng He, Guojin Wu
  • Publication number: 20250091218
    Abstract: A system for providing medication to a customer includes a movable structure with a robotic arm including one or more joints, actuators, and segments, each of which is structured to move a robotic manipulator coupled to an end of the robotic arm. The robotic manipulator is configured to retrieve and release a container containing the medication. The robotic arm further includes a camera and microphone, as well as a computing system that includes at least one processor coupled to a memory storing instructions. When executed by the at least one processor, the memory causes the computing system to capture identifying data regarding a customer; identify the customer based on the identifying data; associate the customer with a medication order; and retrieve.
    Type: Application
    Filed: September 20, 2024
    Publication date: March 20, 2025
    Applicant: Advanced Robotics Corp.
    Inventors: Yuliang Du, Kang-Hao Peng, Flavio Ornelas, Ken Chen
  • Publication number: 20250059277
    Abstract: Provided are antibodies that specifically bind to Programmed Death-1 (PD1, Pdcd-1, or CD279) and inhibit PD1-mediated cellular signaling and activities in immune cells, antibodies binding to a set of amino acid residues required for its ligand binding, and uses of these antibodies to treat or diagnose cancer, infectious diseases or other pathological disorders modulated by PD1-mediated functions.
    Type: Application
    Filed: November 4, 2024
    Publication date: February 20, 2025
    Applicant: BeiGene Switzerland GmbH
    Inventors: Kang LI, Tong ZHANG, Jing SONG, Lanlan XU, Qi LIU, Hao PENG
  • Publication number: 20250023277
    Abstract: The present disclosure provides an electrical connection assembly including a first electrical connector and a second electrical connector. The first electrical connector includes a first terminal. The first terminal includes a contact part. The second electrical connector is configured to pluggably connect with the first electrical connector, and includes a second terminal. The second terminal includes a recess. The recess is inwardly recessed from a surface of the second terminal and includes a connection section and a bottom. The connection section is in connection between the bottom and the surface of the second terminal, and includes a plurality of contact portions. The contact part of the first terminal is in connection with the recess of the second terminal, and the contact part of the first terminal is in contact with the bottom and the contact portions of the recess of the second terminal to form a multi-points contact.
    Type: Application
    Filed: July 12, 2024
    Publication date: January 16, 2025
    Inventors: Chien-An Lai, Yu-Tai Wang, Hao-Peng Cheng, I Chen
  • Publication number: 20250006692
    Abstract: The present application is applicable to the field of semiconductor technology and provides a method for packaging stacking a flip chip, which includes: placing a filling template on a substrate, the filling template being provided with a through hole of a preset pattern; filling a filling material into the through hole of the filling template, and after the filling material being formed on the substrate, removing the filling template; placing a chip with solder balls on the substrate formed with the filling material, such that at least a portion of the solder balls being covered by the filling material; and connecting the chip to the substrate through the solder balls, and curing the filling material with air gaps formed between the at least a portion of the solder balls covered with the filling material.
    Type: Application
    Filed: September 12, 2024
    Publication date: January 2, 2025
    Inventors: Honglei RAN, Kui ZHANG, Shanbin XI, Hao PENG, Huaguang LIU, Hailong ZHAO
  • Patent number: 12163174
    Abstract: A method for producing sclareol by fermentation of cigar tobacco flower buds is provided, including: mixing cigar tobacco flower buds with deionized water, sterilizing and adding edible yeast, then fermenting at 25-30° C. and 100-300 rpm/min for 24-30 h. This method uses cigar tobacco flower buds as the sole raw material, without adding additional nutrients, and only ferments tobacco flower buds with edible yeast to synthesize sclareol. Meanwhile, this method has extremely high synthesis efficiency.
    Type: Grant
    Filed: May 13, 2024
    Date of Patent: December 10, 2024
    Assignees: Tobacco Research Institute of Hubei Province, Hubei University of Technology
    Inventors: Jun Yu, Chunlei Yang, Zhi Wang, Xiong Chen, Zongping Li, Jinpeng Yang, Hao Li, Lan Yao, Xiongfei Rao, Hao Peng, Shiping Xu, Wenming Wang
  • Publication number: 20240392325
    Abstract: A method for producing sclareol by fermentation of cigar tobacco flower buds is provided, including: mixing cigar tobacco flower buds with deionized water, sterilizing and adding edible yeast, then fermenting at 25-30° C. and 100-300 rpm/min for 24-30 h. This method uses cigar tobacco flower buds as the sole raw material, without adding additional nutrients, and only ferments tobacco flower buds with edible yeast to synthesize sclareol. Meanwhile, this method has extremely high synthesis efficiency.
    Type: Application
    Filed: May 13, 2024
    Publication date: November 28, 2024
    Inventors: JUN YU, CHUNLEI YANG, ZHI WANG, XIONG CHEN, ZONGPING LI, JINPENG YANG, HAO LI, LAN YAO, XIONGFEI RAO, HAO PENG, SHIPING XU, WENMING WANG
  • Publication number: 20240387347
    Abstract: A semiconductor package structure includes a redistribution layer, a first semiconductor die, a second semiconductor die, a molding material, and a dam structure. The redistribution layer has a first surface and a second surface opposite the first surface. The first semiconductor die and the second semiconductor die are disposed over the first surface of the redistribution layer. The molding material is arranged between the first semiconductor die and the second semiconductor die. The dam structure is disposed in the redistribution layer. The dam structure is arranged under the molding material between the first semiconductor die and the second semiconductor die.
    Type: Application
    Filed: March 6, 2024
    Publication date: November 21, 2024
    Inventors: Tai-Hao PENG, Yi-Che JIANG, Yao-Tsung HUANG
  • Patent number: 12109716
    Abstract: A system for providing medication to a customer includes a movable structure with a robotic arm including one or more joints, actuators, and segments, each of which is structured to move a robotic manipulator coupled to an end of the robotic arm. The robotic manipulator is configured to retrieve and release a container containing the medication. The robotic arm further includes a camera and microphone, as well as a computing system that includes at least one processor coupled to a memory storing instructions. When executed by the at least one processor, the memory causes the computing system to capture identifying data regarding a customer; identify the customer based on the identifying data; associate the customer with a medication order; and retrieve.
    Type: Grant
    Filed: July 20, 2021
    Date of Patent: October 8, 2024
    Assignee: Advanced Robotics Corp.
    Inventors: Yuliang Du, Kang-Hao Peng, Flavio Ornelas, Ken Chen
  • Publication number: 20240321761
    Abstract: A power module includes: an insulation layer, a plurality of conductive layers, a decoupling capacitor, and a plurality of first components, where the insulation layer includes a plurality of sub-insulation layers stacked in a thickness direction of the power module, and the sub-insulation layer is disposed between every two adjacent conductive layers. The first component is located at a sub-insulation layer in a first region and is electrically connected to a conductive layer adjacent to the sub-insulation layer at which the first component is disposed, and at least some of the first components are stacked in the thickness direction of the power module. The insulation layer located in the first region has an auxiliary accommodation cavity, the decoupling capacitor is located in the auxiliary accommodation cavity, the pins of the decoupling capacitor is electrically connected to the plurality of conductive layers.
    Type: Application
    Filed: May 2, 2024
    Publication date: September 26, 2024
    Inventors: Hao PENG, Xiaojing LIAO
  • Patent number: 12046129
    Abstract: Systems and methods of the present disclosure enable machine learning-based refinement of trajectory predictions using a processor to determine a future trajectory associated with an object state using an iterative physics algorithm. The processor utilizes a trajectory error prediction machine learning model to predict a trajectory error for the future trajectory determined for the object state. The processor determines a pseudo-measurement representative of the trajectory error based at least in part on the trajectory error for the future trajectory and determines a pseudo-measurement noise based at least in part on the pseudo-measurement. The processor determines an updated future trajectory for the future trajectory based on the pseudo-measurement and the pseudo-measurement noise of the trajectory error for the future trajectory, and causes to display a trajectory notification associated with future trajectory on a screen of a user computing device associated with a user.
    Type: Grant
    Filed: August 19, 2021
    Date of Patent: July 23, 2024
    Assignee: Rutgers, The State University of New Jersey
    Inventors: Xiaoli Bai, Hao Peng
  • Publication number: 20240242878
    Abstract: A planar transformer includes: a first primary winding layer; a second primary winding layer disposed adjacent to the first primary winding layer; a shielding layer disposed adjacent to the first primary winding layer; a first secondary winding layer disposed adjacent to the shielding layer; a second secondary winding layer disposed adjacent to the first secondary winding layer. The first primary winding layer and the second primary winding layer are located at one side of the shielding layer. The first secondary winding layer and the second secondary winding layer are located at another side of the shielding layer.
    Type: Application
    Filed: April 24, 2023
    Publication date: July 18, 2024
    Inventors: Po-Yi KUO, Hao-Peng CHENG, Chia-Hsiong HUANG, Yu-Jen LIN
  • Publication number: 20240244884
    Abstract: An array substrate and a display panel are provided. A driving circuit layer of the array substrate includes a low temperature polysilicon thin film transistor and a low temperature polycrystalline oxide thin film transistor which are electrically connected with each other. A hydrogen blocking layer is formed on at least one of an upper side and a lower side of an oxide active layer of the low temperature polysilicon thin film transistor. The hydrogen blocking layer can block hydrogen ions in other film layers to invade the oxide active layer and avoid that device characteristics are drifted.
    Type: Application
    Filed: March 31, 2024
    Publication date: July 18, 2024
    Applicant: WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
    Inventors: Huihui ZHAO, Hao PENG
  • Patent number: 12016149
    Abstract: The disclosure provides a server including a housing, a plurality of hash boards, a power module and an electrical connection board. Each hash board is slidably arranged in a first accommodating space. The plurality of hash boards and the power module are respectively connected to the electrical connection board. The power module supplies power to the plurality of hash boards through the electrical connection board. The electrical connection board includes two conductive connection boards, each of which is provided with a plurality of conductive pins. The pins form multiple pairs of conductive pins in one-to-one correspondence. Each pair of conductive pins corresponds to each hash board and is electrically connected to supply power to the hash board. Each pair of conductive pins is detachably matched with each hash board to connect or disconnect the power supply path of the hash board.
    Type: Grant
    Filed: August 9, 2021
    Date of Patent: June 18, 2024
    Assignee: CMOTION TECHNOLOGIES LIMITED
    Inventor: Hao Peng
  • Patent number: D1034368
    Type: Grant
    Filed: November 18, 2022
    Date of Patent: July 9, 2024
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Hao Peng, Guoping Wu, Zimo Yang, Ting Xu, Haibo Luo, Zedong Zeng