Abstract: A power supply circuit for a battery management system of an energy storage system, an energy storage valve, and an energy storage station are described. When an energy storage submodule where the battery management system in the power supply circuit is located operates normally, a battery module of the energy storage submodule is selected to supply power to the battery management system. When the energy storage submodule where the battery management system is located is bypassed, energy storage submodules other than the energy storage submodule where the battery management system is located are selected to supply power to the battery management system, thereby mitigating the issue of over-discharge in the battery module of the bypassed energy storage submodule due to the continuous power consumption of the battery management system. All battery management systems are controlled to be powered by batteries of electric cabinets where the battery management systems are located.

Abstract: The demodulation circuit includes a waveform regulator, a first counter, a second counter, and an SR latch. The waveform regulator generates a regulated modulation signal according to a pair of differential isolated modulation signals, which is generated according to a modulation of an input data signal with a carrier clock signal. The first counter counts cycles of the regulated modulation signal so as to generate a set signal. The second counter counts cycles of a reference clock signal so as to generate a reset signal. The SR latch includes a set terminal for receiving the set signal, a reset terminal for receiving the reset signal, and an output terminal for outputting a demodulated output signal. The SR latch is triggered by the set signal to pull up the demodulated output signal, and is triggered by the reset signal to pull down the demodulated output signal.

Abstract: Disclosed in the present application is a data transmission method. The data transmission method includes: establishing a multipath transmission control protocol (MPTCP) connection with a network access point device, the MPTCP connection including a first TCP connection and a second TCP connection, the first TCP connection being constructed according to a first Wi-Fi connection corresponding to a first Wi-Fi module, and the second TCP connection being constructed according to a second Wi-Fi connection corresponding to a second Wi-Fi module; and transmitting network access data to the network access point device by means of the MPTCP connection.

Abstract: Embodiments of the present disclosure provide methods and apparatus for power control. A method at a network node comprises determining a value of power back-off for a first wireless device based on at least one of a number of wireless devices including the first wireless device, wherein the wireless devices including the first wireless device are co-scheduled by the network node and an estimated max power increase in an overlap area where two or more beams are to be overlapped, wherein one of the two or more beams is for the first wireless device. The method further comprises transmitting a message or data over the beam for the first wireless device, wherein an output power of the beam for the first wireless device is controlled based on the value of power back-off for the first wireless device.

Abstract: Provided is an anti-G protein-coupled receptor family class C group 5 member D (GPRC5D) antibody or a fragment thereof. Also provided is the use of the antibody or fragment thereof as an active ingredient for treatment of tumors or cancers. In addition, further provided is a bispecific antibody comprising the antibody or fragment thereof and aiming at GPRC5D and CD3.

Abstract: The present application relates to a multi-specific antibody that simultaneously targets BCMA, GPRC5D and CD3, and its use in treatment of diseases such as tumors.

Abstract: Embodiments of the present disclosure provide methods and apparatus for power control. A method at a network node comprises determining a value of power back-off for a first wireless device based on at least one of a number of wireless devices including the first wireless device, wherein the wireless devices including the first wireless device are co-scheduled by the network node and an estimated max power increase in an overlap area where two or more beams are to be overlapped, wherein one of the two or more beams is for the first wireless device. The method further comprises transmitting a message or data over the beam for the first wireless device, wherein an output power of the beam for the first wireless device is controlled based on the value of power back-off for the first wireless device.

Abstract: Provided is an antibody molecule or antigen-binding fragment thereof capable of binding to the human PD-L1. Also provided is the use of the antibody molecule or antigen-binding fragment thereof in the preparation of a medicament for treating tumors or cancers. Compared with the existing anti-PD-L1 antibodies, the provided antibody has superior affinity and dissociation rate for PD-L1, lower immunogenicity, and better tumor inhibition effects.

Abstract: The demodulation circuit includes a waveform regulator, a first counter, a second counter, and an SR latch. The waveform regulator generates a regulated modulation signal according to a pair of differential isolated modulation signals, which is generated according to a modulation of an input data signal with a carrier clock signal. The first counter counts cycles of the regulated modulation signal so as to generate a set signal. The second counter counts cycles of a reference clock signal so as to generate a reset signal. The SR latch includes a set terminal for receiving the set signal, a reset terminal for receiving the reset signal, and an output terminal for outputting a demodulated output signal. The SR latch is triggered by the set signal to pull up the demodulated output signal, and is triggered by the reset signal to pull down the demodulated output signal.

Abstract: This application discloses a package structure and a package system. The package structure may be used for packaging various types of chips, and is coupled to a PCB, so as to form the package system. The package structure includes a package base layer, a chip, a package body, and a connecting assembly. The package base layer has a first surface and a second surface that are opposite to each other. The chip is coupled to the first surface, and there is a chip pad on a surface that is of the chip and that is away from the package base layer. The package body covers the package base layer and the chip to protect the structure, and the chip pad is wired to a surface of the package body through the connecting assembly.

Abstract: A power module includes a first conductive plate, a second conductive plate, a third terminal, a first power transistor, and a second power transistor. A part of the first conductive plate serves as a first terminal. The second conductive plate is stacked with the first conductive plate. The third terminal is stacked with the first terminal. The first power transistor is disposed between the first conductive plate and the second conductive plate. A first electrode of the first power transistor is electrically connected to the first conductive plate, and a second electrode of the first power transistor is electrically connected to the second conductive plate. A first electrode of the second power transistor is electrically connected to the second conductive plate, and a second electrode of the second power transistor is electrically connected to the third terminal.

Abstract: Provided are systems and methods for multi-garment virtual try-on and editing, example implementations of which can be referred to as M&M VTO. The proposed systems allow users to visualize how various combinations of garments would look on a given person. The input for this method can include multiple garment images, an image of a person, and optionally a text description for the garment layout. The output is a high-resolution visualization of how these garments would look on the person in the desired layout. For instance, a user can input an image of a shirt, an image of a pair of pants, a description such as “rolled sleeves, shirt tucked in”, and an image of a person. The output would then be a visual representation of how the person would look wearing these garments in the specified layout.

Abstract: The disclosure discloses a chemical-shift-encoded imaging method and apparatus based on phase unwrapping, and a device. Comprises: performing phase conversion on the phasor candidate solution for the purpose of enabling a difference between a correct solution and an inverse decomposition solution of the phasor candidate solution to be within a set range, and on the basis of a phase unwrapping method, performing determination to obtain an intermediate phasor solution; determining a true phase of the intermediate phasor solution, and converting the true phase to a phasor candidate solution space to determine a target phasor solution; and on the basis of the target phasor solution, determining a first chemical component signal and a second chemical component signal, and on the basis of the first chemical component signal and/or the second chemical component signal, performing chemical-shift-encoded imaging.

Abstract: A power supply module includes a main body, a first solder pad, and a plurality of metal connection pillars. The main body has a first surface and a second surface. The main body includes a package body, a package base layer, and a power chip. The package base layer, the power chip, and the first solder pad are all disposed in the package body. The power chip is connected to the package base layer. An end of the power chip away from the package base layer is connected to the first solder pad. Each metal connection pillar has a first end connected to the first solder pad and a second end extending through the main body to an outer side of the first surface of the main body.

Abstract: This application discloses a chip package assembly, an electronic device, and a preparation method of a chip package assembly. The chip package assembly includes a package substrate, a chip, and a heat dissipation part. The package substrate includes an upper conductive layer, a lower conductive layer, and a conductive part connected between the upper conductive layer and the lower conductive layer. The chip includes a front electrode and a back electrode that are disposed opposite each other, the chip is embedded in the package substrate, the conductive part surrounds the chip, the front electrode is connected to the lower conductive layer, and the back electrode is connected to the upper conductive layer. The heat dissipation part is connected to a surface of the upper conductive layer that is away from the chip. The upper conductive layer, the lower conductive layer, and the conductive part each conduct heat.

Abstract: The present disclosure discloses a chemical shift coded imaging method based on a transition region and regional iterative phasor extraction. Acquiring an initial image, and determining an initial phasor solution of the transition region based on the initial image; performing regional iterative phasor extraction in at least two set directions by taking the initial phasor solution as initial information, and obtaining a target phasor solution based on a regional iterative phasor extraction result corresponding to each set direction; and determining a first chemical composition signal and a second chemical composition signal based on the target phasor solution, and performing chemical shift coded imaging based on the first chemical composition signal and/or the second chemical composition signal.

Abstract: The present application is applicable to the field of semiconductor technology and provides a method for packaging stacking a flip chip, which includes: placing a filling template on a substrate, the filling template being provided with a through hole of a preset pattern; filling a filling material into the through hole of the filling template, and after the filling material being formed on the substrate, removing the filling template; placing a chip with solder balls on the substrate formed with the filling material, such that at least a portion of the solder balls being covered by the filling material; and connecting the chip to the substrate through the solder balls, and curing the filling material with air gaps formed between the at least a portion of the solder balls covered with the filling material.

Abstract: Disclosed is a text sentence processing method performed by a computer device, including: acquiring sample text sentences including entity pairs and relationship labels of the entity pairs; extracting positive and negative example sentence pairs from the sample text sentences according to the relationship labels, and performing positive-negative example sampling, to obtain a training set; inputting the training set into a relationship extraction model to generate loss values; and adjusting parameters of the relationship extraction model according to the loss values, and repeating the step of extracting positive and negative example sentence pairs from the sample text sentences according to the relationship labels to perform iterative training of the relationship extraction model until a training end condition is met, to obtain an updated relationship extraction model, the relationship extraction model being configured to identify an entity relationship of an entity pair in an input text sentence.

Abstract: An array substrate and a display panel are provided. A driving circuit layer of the array substrate includes a low temperature polysilicon thin film transistor and a low temperature polycrystalline oxide thin film transistor which are electrically connected with each other. A hydrogen blocking layer is formed on at least one of an upper side and a lower side of an oxide active layer of the low temperature polysilicon thin film transistor. The hydrogen blocking layer can block hydrogen ions in other film layers to invade the oxide active layer and avoid that device characteristics are drifted.

Abstract: Provided in the present disclosure is an antibody or fragment thereof against a human growth and differentiation factor 15 (GDF15). Further provided in the present disclosure is the use of the antibody or fragment thereof in the preparation of a drug for treating diseases or conditions. The antibody or fragment thereof provided in the present disclosure can bind to human GDF15 with high affinity and specificity, blocks the interaction of GDF15 with receptor GFRAL thereof, and has a longer half-life period in vivo in comparison with antibodies of the same kind.