Patents by Inventor Hao Peng

Hao Peng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11916918
    Abstract: Disclosed are some implementations of systems, apparatus, methods and computer program products for executing process flows. A request to initiate execution of a flow is processed, where the request is received from a first user. The flow includes a plurality of flow elements, where each of the flow elements represents a corresponding set of computer-readable instructions. Execution of the flow is initiated and an operation mode assigned to one of the flow elements is determined. A set of computer-readable instructions corresponding to the flow element is executed according to the operation mode such that an identity of the first user is recorded in association with an operation on a database record, wherein permissions allocated in a user profile to the first user do not provide the first user permission to cause the operation on the database record.
    Type: Grant
    Filed: April 14, 2020
    Date of Patent: February 27, 2024
    Assignee: Salesforce, Inc.
    Inventors: Yucheng Wang, Saravanan Adaikkalavan, Hao Wu, Hugh Cockburn, Colin Frank, Kaysha Chandran, William Charles Eidson, Timothy Peng
  • Patent number: 11856730
    Abstract: The present invention provides a liquid-cooled integrated cabinet, which belongs to the technical field of servers, and comprises a main body. A power distribution module is provided at the upper end of the main body, and multiple computing power modules which constitute a computing power center are parallelly provided on one side of the lower end of the main body; cooling fans stacked on top and bottom in multiple layers are arranged on the other side thereof; the computing power module is cooled by a liquid-cooled module, and the liquid-cooled module is a front and rear drawing structure relative to the main body. The cooling fan bears 8%-12% of the heat dissipation capacity. A cold plate shell in the liquid-cooled module contacts and conducts heat with a chip in the computing power module.
    Type: Grant
    Filed: September 6, 2021
    Date of Patent: December 26, 2023
    Assignee: CMOTION TECHNOLOGIES LIMITED
    Inventors: Changjiang Ge, Minghui Sun, Hao Peng, Bin Yang, Zhenhui Li
  • Publication number: 20230387025
    Abstract: A semiconductor device includes a first layer structure, a second layer structure, a bridge die, a first SoC and a second SoC. The bridge die is disposed between the first layer structure and the second layer structure. The first SoC and the second SoC are disposed on the second layer structure. The first SoC and the second SoC are electrically connected through the bridge die.
    Type: Application
    Filed: March 28, 2023
    Publication date: November 30, 2023
    Inventors: Tai-Hao PENG, Yao-Tsung HUANG
  • Patent number: 11797013
    Abstract: Collision avoidance for a mobile machine having a plurality of sensors is disclosed. The mobile machine is avoided from colliding with a collision object by fusing sensor data received from the plurality of sensors to obtain a plurality of data points corresponding to the collision object, calculating a closed-form solution of a distance between the mobile machine and each of the plurality of data points, calculating a maximum allowed velocity of the mobile machine based on the shortest distance between the mobile machine and the plurality of data points and a current velocity of the mobile machine, and controlling the mobile machine to move according to the maximum allowed velocity.
    Type: Grant
    Filed: December 25, 2020
    Date of Patent: October 24, 2023
    Assignees: UBTECH NORTH AMERICA RESEARCH AND DEVELOPMENT CENTER CORP, UBTECH ROBOTICS CORP LTD
    Inventors: Dejun Guo, Kang-Hao Peng, Dan Shao, Yang Shen, Huan Tan
  • Publication number: 20230303689
    Abstract: Provided are antibodies that specifically bind to Programmed Death-1 (PD1, Pdcd-1, or CD279) and inhibit PD1-mediated cellular signaling and activities in immune cells, antibodies binding to a set of amino acid residues required for its ligand binding, and uses of these antibodies to treat or diagnose cancer, infectious diseases or other pathological disorders modulated by PD1-mediated functions.
    Type: Application
    Filed: April 28, 2023
    Publication date: September 28, 2023
    Inventors: Kang LI, Tong ZHANG, Jing SONG, Lanlan XU, Qi LIU, Hao PENG
  • Publication number: 20230262810
    Abstract: Disclosed in the present application is a data transmission method. The data transmission method includes: establishing a multipath transmission control protocol (MPTCP) connection with a network access point device, the MPTCP connection including a first TCP connection and a second TCP connection, the first TCP connection being constructed according to a first Wi-Fi connection corresponding to a first Wi-Fi module, and the second TCP connection being constructed according to a second Wi-Fi connection corresponding to a second Wi-Fi module; and transmitting network access data to the network access point device by means of the MPTCP connection.
    Type: Application
    Filed: April 28, 2023
    Publication date: August 17, 2023
    Applicant: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.
    Inventors: Wei LIU, Hao PENG
  • Patent number: 11673951
    Abstract: Provided are antibodies that specifically bind to Programmed Death-1 (PD1, Pdcd-1, or CD279) and inhibit PD1-mediated cellular signaling and activities in immune cells, antibodies binding to a set of amino acid residues required for its ligand binding, and uses of these antibodies to treat or diagnose cancer, infectious diseases or other pathological disorders modulated by PD1-mediated functions.
    Type: Grant
    Filed: November 14, 2019
    Date of Patent: June 13, 2023
    Assignee: BEIGENE SWITZERLAND GMBH
    Inventors: Kang Li, Tong Zhang, Jing Song, Lanlan Xu, Qi Liu, Hao Peng
  • Publication number: 20230156632
    Abstract: Embodiments of the present disclosure provide methods and apparatus for power control. A method at a network node comprises determining a value of power back-off for a first wireless device based on at least one of a number of wireless devices including the first wireless device, wherein the wireless devices including the first wireless device are co-scheduled by the network node and an estimated max power increase in an overlap area where two or more beams are to be overlapped, wherein one of the two or more beams is for the first wireless device. The method further comprises transmitting a message or data over the beam for the first wireless device, wherein an output power of the beam for the first wireless device is controlled based on the value of power back-off for the first wireless device.
    Type: Application
    Filed: April 24, 2020
    Publication date: May 18, 2023
    Inventors: Yue Huang, Hao Peng, Yongquan Qiang
  • Publication number: 20230139831
    Abstract: To extract necessary information, documents are received, converted to text, and stored in a database. A request for information is then received, and relevant documents and/or document passages are selected from the stored documents. The needed information is then extracted from the relevant documents. The various processes use one or more artificial intelligence (AI), image processing, and/or natural language processing (NLP) techniques.
    Type: Application
    Filed: September 30, 2021
    Publication date: May 4, 2023
    Inventors: Wensu Wang, Kuikui Gao, Yuhao Sun, Hao Peng
  • Publication number: 20230100376
    Abstract: Disclosed is a text sentence processing method performed by a computer device, including: acquiring sample text sentences including entity pairs and relationship labels of the entity pairs; extracting positive and negative example sentence pairs from the sample text sentences according to the relationship labels, and performing positive-negative example sampling, to obtain a training set; inputting the training set into a relationship extraction model to generate loss values; and adjusting parameters of the relationship extraction model according to the loss values, and repeating the step of extracting positive and negative example sentence pairs from the sample text sentences according to the relationship labels to perform iterative training of the relationship extraction model until a training end condition is met, to obtain an updated relationship extraction model, the relationship extraction model being configured to identify an entity relationship of an entity pair in an input text sentence.
    Type: Application
    Filed: December 1, 2022
    Publication date: March 30, 2023
    Inventors: Zhiyuan LIU, Hao PENG, Tianyu GAO, Xu HAN, Yankai LIN, Peng LI, Maosong SUN, Jie ZHOU
  • Patent number: 11595490
    Abstract: Embodiments of the disclosure provide methods and systems for implementing a function for an application using a middleware on a computer. An exemplary method may include initializing an application node in the middleware corresponding to the application, the initializing comprising binding the function to the application node and associating the application node with a cryptor, connecting the middleware to a remote device through a transport layer using the cryptor, publishing a message to invoke the function from the application node, through the middleware, to the cryptor, and communicating with the remote device to invoke the function, using the cryptor, based on the message.
    Type: Grant
    Filed: April 14, 2021
    Date of Patent: February 28, 2023
    Assignee: UBKANG (QINGDAO) TECHNOLOGY CO., LTD.
    Inventors: Kang-Hao Peng, Dejun Guo, Huan Tan
  • Publication number: 20230036995
    Abstract: A power supply module includes a main body, a first solder pad, and a plurality of metal connection pillars. The main body has a first surface and a second surface. The main body includes a package body, a package base layer, and a power chip. The package base layer, the power chip, and the first solder pad are all disposed in the package body. The power chip is connected to the package base layer. An end of the power chip away from the package base layer is connected to the first solder pad. Each metal connection pillar has a first end connected to the first solder pad and a second end extending through the main body to an outer side of the first surface of the main body.
    Type: Application
    Filed: July 27, 2022
    Publication date: February 2, 2023
    Applicant: Huawei Digital Power Technologies Co., Ltd.
    Inventors: Xiaojing LIAO, Hao PENG
  • Publication number: 20230021432
    Abstract: This application discloses a chip package assembly, an electronic device, and a preparation method of a chip package assembly. The chip package assembly includes a package substrate, a chip, and a heat dissipation part. The package substrate includes an upper conductive layer, a lower conductive layer, and a conductive part connected between the upper conductive layer and the lower conductive layer. The chip includes a front electrode and a back electrode that are disposed opposite each other, the chip is embedded in the package substrate, the conductive part surrounds the chip, the front electrode is connected to the lower conductive layer, and the back electrode is connected to the upper conductive layer. The heat dissipation part is connected to a surface of the upper conductive layer that is away from the chip. The upper conductive layer, the lower conductive layer, and the conductive part each conduct heat.
    Type: Application
    Filed: July 25, 2022
    Publication date: January 26, 2023
    Applicant: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Hao PENG, Xiaojing LIAO, Zhaozheng HOU
  • Publication number: 20230018603
    Abstract: This application discloses a package structure and a package system. The package structure may be used for packaging various types of chips, and is coupled to a PCB, so as to form the package system. The package structure includes a package base layer, a chip, a package body, and a connecting assembly. The package base layer has a first surface and a second surface that are opposite to each other. The chip is coupled to the first surface, and there is a chip pad on a surface that is of the chip and that is away from the package base layer. The package body covers the package base layer and the chip to protect the structure, and the chip pad is wired to a surface of the package body through the connecting assembly.
    Type: Application
    Filed: July 12, 2022
    Publication date: January 19, 2023
    Inventors: Hao PENG, Xiaojing LIAO
  • Publication number: 20220396624
    Abstract: Provided is an antibody molecule or antigen-binding fragment thereof capable of binding to the human PD-L1. Also provided is the use of the antibody molecule or antigen-binding fragment thereof in the preparation of a medicament for treating tumors or cancers. Compared with the existing anti-PD-L1 antibodies, the provided antibody has superior affinity and dissociation rate for PD-L1, lower immunogenicity, and better tumor inhibition effects.
    Type: Application
    Filed: October 21, 2019
    Publication date: December 15, 2022
    Inventors: Jinying NING, Hao PENG, Feng HAO, Feng HE
  • Publication number: 20220337669
    Abstract: Embodiments of the disclosure provide methods and systems for implementing a function for an application using a middleware on a computer. An exemplary method may include initializing an application node in the middleware corresponding to the application, the initializing comprising binding the function to the application node and associating the application node with a cryptor, connecting the middleware to a remote device through a transport layer using the cryptor, publishing a message to invoke the function from the application node, through the middleware, to the cryptor, and communicating with the remote device to invoke the function, using the cryptor, based on the message.
    Type: Application
    Filed: April 14, 2021
    Publication date: October 20, 2022
    Applicants: UBTECH NORTH AMERICA RESEARCH AND DEVELOPMENT CENTER CORP, UBTECH ROBOTICS CORP LTD
    Inventors: Kang-Hao PENG, Dejun GUO, Huan TAN
  • Publication number: 20220320211
    Abstract: An array substrate and a display panel are provided. A driving circuit layer of the array substrate includes a low temperature polysilicon thin film transistor and a low temperature polycrystalline oxide thin film transistor which are electrically connected with each other. A hydrogen blocking layer is formed on at least one of an upper side and a lower side of an oxide active layer of the low temperature polysilicon thin film transistor. The hydrogen blocking layer can block hydrogen ions in other film layers to invade the oxide active layer and avoid that device characteristics are drifted.
    Type: Application
    Filed: August 26, 2020
    Publication date: October 6, 2022
    Inventors: Huihui ZHAO, Hao PENG
  • Publication number: 20220310669
    Abstract: A display panel and a manufacturing method thereof are provided. The display panel includes a base substrate, a first active layer, a first gate insulating layer, a first gate layer, and a second gate insulating layer stacked in sequence on the base substrate, and a metal layer, a first interlayer dielectric layer, a first source, and a first drain. A first metal portion and a second metal portion of the metal layer are respectively filled in a first through hole and a second through hole of the second gate insulating layer and are electrically connected to the first active layer.
    Type: Application
    Filed: November 12, 2020
    Publication date: September 29, 2022
    Inventors: Jiaqing HE, Jixiang GONG, Hao PENG
  • Patent number: D995565
    Type: Grant
    Filed: September 10, 2021
    Date of Patent: August 15, 2023
    Assignee: CMOTION TECHNOLOGIES LIMITED
    Inventors: Changjiang Ge, Minghui Sun, Hao Peng, Bin Yang, Zhenhui Li
  • Patent number: D998759
    Type: Grant
    Filed: September 16, 2020
    Date of Patent: September 12, 2023
    Inventors: Dongsheng Zhou, Bree Hao Peng, Gene Zhou