Abstract: The disclosure provides a server including a housing, a plurality of hash boards, a power module and an electrical connection board. Each hash board is slidably arranged in a first accommodating space. The plurality of hash boards and the power module are respectively connected to the electrical connection board. The power module supplies power to the plurality of hash boards through the electrical connection board. The electrical connection board includes two conductive connection boards, each of which is provided with a plurality of conductive pins. The pins form multiple pairs of conductive pins in one-to-one correspondence. Each pair of conductive pins corresponds to each hash board and is electrically connected to supply power to the hash board. Each pair of conductive pins is detachably matched with each hash board to connect or disconnect the power supply path of the hash board.

Abstract: The present invention discloses a computer fan with a hollow wire-passing shaft, which comprises a frame body and a wire-passing pipe, the upper end of the wire-passing pipe extends out of the upper wall of the impeller shaft, and is provided with a fixed seat which is provided with an LCD screen which can display predetermined patterns. The LCD screen is connected with the corresponding wire body via the wire-passing channel to simplify the wiring of the wire body wherein the LCD screen can display the corresponding LOGO or the fonts or patterns, providing diversified options.

Abstract: A semiconductor package structure includes a substrate, a semiconductor die, a molding material, an interposer, and a thermal via. The substrate has a wiring structure. The semiconductor die is disposed over the substrate and is electrically coupled to the wiring structure. The molding material surrounds the semiconductor die. The interposer is disposed over the semiconductor die. The thermal via is disposed in the interposer and extends to a bottom surface of the interposer. The thermal via vertically overlaps the semiconductor die.

Abstract: An array substrate and a display panel are provided. A driving circuit layer of the array substrate includes a low temperature polysilicon thin film transistor and a low temperature polycrystalline oxide thin film transistor which are electrically connected with each other. A hydrogen blocking layer is formed on at least one of an upper side and a lower side of an oxide active layer of the low temperature polysilicon thin film transistor. The hydrogen blocking layer can block hydrogen ions in other film layers to invade the oxide active layer and avoid that device characteristics are drifted.

Abstract: A back side illumination (BSI) image sensor includes an epitaxial substrate, a deep trench isolation (DTI) structure from one surface to the other surface of the epitaxial substrate, a buried oxide layer on the epitaxial substrate, an epitaxial layer, a well region, a floating diffusion (FD) region, a shallow trench isolation (STI) structure, and vertical transfer gates (VTGs). The buried oxide layer has openings exposing the epitaxial substrate, and the epitaxial layer is formed on the epitaxial substrate and covers the buried oxide layer. The well region is in the epitaxial layer and the epitaxial substrate. The FD region is in the well region above the buried oxide layer, and a width of the buried oxide layer is larger than that of the FD region. The STI structure is in the epitaxial layer. The VTGs are in the epitaxial layer and through the openings of the buried oxide layer.

Abstract: The invention provides a signal detector. The signal detector comprises a housing, having a connector and a display unit; a tuner, configured to receive a cable signal; a microcontroller unit (MCU), electrically connected with the tuner and the display unit; a scanning switch, electrically connected with the MCU; a power supply, configured to supply a power to the MCU; and a power switch, electrically connected with the MCU.

Abstract: A wafer cleaning apparatus includes a chamber, a rotary chuck, a liquid spray post, a top lid, a liquid conveying pipeline, a protection pipeline, and a leak sensor. The rotary chuck is located in the chamber, and is configured to attach a wafer cassette. The liquid spray post is located in the chamber. The liquid spray post faces the wafer cassette. The top lid is located on the chamber. The liquid spray post is disposed on the bottom surface of the top lid. The liquid conveying pipeline is located outside the chamber and communicates the liquid spray post, and is disposed along a bottom surface and an external sidewall of the top lid. The protection pipeline sleeves on the liquid conveying pipeline. The leak sensor is located in the protection pipeline, and is located under the lowest section of the liquid conveying pipeline.

Abstract: The present disclosure discloses a firmware update method having firmware update troubleshooting mechanism. Partial data included in firmware data is used as test data to perform a test process to write the test data to a firmware storage terminal by using a control interface of a processing terminal according to the setting of access parameters, read the written test data from the firmware storage terminal through the control interface and compare the written test data and the test data to generate a comparison result. A parameter adjustment process is performed when the comparison result indicates a mismatching condition such that the test process is performed again and the parameter adjustment process is further performed. When the comparison result indicates a matching condition, the firmware data is transmitted to the processing terminal and is written to the firmware storage terminal by using the control interface.

Abstract: A multi-die package on package includes a bottom package having a first device die and a second device die. A top package including a memory die is stacked on the bottom package.

Abstract: ETA (estimated time of arrival) calculation for a mobile machine is disclosed. The ETA of the mobile machine to a destination is calculated by obtaining a current pose of the mobile machine, obtaining a global path from the current pose of the mobile machine to the destination, obtaining a local path, calculating a dynamic ETA for each pair of the consecutive poses in the local path and summing the calculated dynamic ETAs, calculating a baseline ETA for each pair of consecutive poses from a pose in the global path that is closest to the last pose in the local path to the last pose in the global path and summing the calculated baseline ETAs, and obtaining a total ETA to the destination based on the dynamic ETA and the baseline ETA.

Abstract: Provided are antibodies that specifically bind to T-cell immunoglobulin domain and mucin domain 3 (Tim-3). The anti-Tim-3 antibodies can be used to treat, prevent or diagnose immune, cancerous, infectious diseases or other pathological disorders that may be modulated by Tim-3-mediated functions.

Abstract: A display panel and a manufacturing method thereof are provided. The display panel includes a base substrate, a first active layer, a first gate insulating layer, a first gate layer, and a second gate insulating layer stacked in sequence on the base substrate, and a metal layer, a first interlayer dielectric layer, a first source, and a first drain. A first metal portion and a second metal portion of the metal layer are respectively filled in a first through hole and a second through hole of the second gate insulating layer and are electrically connected to the first active layer.

Abstract: The present invention provides a liquid-cooled integrated cabinet, which belongs to the technical field of servers, and comprises a main body. A power distribution module is provided at the upper end of the main body, and multiple computing power modules which constitute a computing power center are parallelly provided on one side of the lower end of the main body; cooling fans stacked on top and bottom in multiple layers are arranged on the other side thereof; the computing power module is cooled by a liquid-cooled module, and the liquid-cooled module is a front and rear drawing structure relative to the main body. The cooling fan bears 8%-12% of the heat dissipation capacity. A cold plate shell in the liquid-cooled module contacts and conducts heat with a chip in the computing power module.

Abstract: A semiconductor device includes a first layer structure, a second layer structure, a bridge die, a first SoC and a second SoC. The bridge die is disposed between the first layer structure and the second layer structure. The first SoC and the second SoC are disposed on the second layer structure. The first SoC and the second SoC are electrically connected through the bridge die.

Abstract: Collision avoidance for a mobile machine having a plurality of sensors is disclosed. The mobile machine is avoided from colliding with a collision object by fusing sensor data received from the plurality of sensors to obtain a plurality of data points corresponding to the collision object, calculating a closed-form solution of a distance between the mobile machine and each of the plurality of data points, calculating a maximum allowed velocity of the mobile machine based on the shortest distance between the mobile machine and the plurality of data points and a current velocity of the mobile machine, and controlling the mobile machine to move according to the maximum allowed velocity.

Abstract: Provided are antibodies that specifically bind to Programmed Death-1 (PD1, Pdcd-1, or CD279) and inhibit PD1-mediated cellular signaling and activities in immune cells, antibodies binding to a set of amino acid residues required for its ligand binding, and uses of these antibodies to treat or diagnose cancer, infectious diseases or other pathological disorders modulated by PD1-mediated functions.