Patents by Inventor Hao Shi
Hao Shi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240138010Abstract: Provided is a method for retrieving a lost-of-contact mobile terminal. The method is applied to a first control terminal, and includes: receiving a first lost-of-contact distress signal a first mobile terminal forwarded by a server; displaying a help seeking interface; sending, in response to a help-retrieving instruction, a first help-retrieving request to the server; and receiving a first confirmation help message from a second control terminal from the server, wherein the first confirmation help message indicates that the second control terminal agrees to help retrieve the first mobile terminal.Type: ApplicationFiled: September 19, 2022Publication date: April 25, 2024Inventors: Qianwen JIANG, Yongzhong ZHANG, Hao ZHANG, Lili CHEN, Peng HAN, Huidong HE, Juanjuan SHI, Weihua DU
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Package structure comprising buffer layer for reducing thermal stress and method of forming the same
Patent number: 11961777Abstract: A package structure and a method of forming the same are provided. The package structure includes a first die, a second die, a first encapsulant, and a buffer layer. The first die and the second die are disposed side by side. The first encapsulant encapsulates the first die and the second die. The second die includes a die stack encapsulated by a second encapsulant encapsulating a die stack. The buffer layer is disposed between the first encapsulant and the second encapsulant and covers at least a sidewall of the second die and disposed between the first encapsulant and the second encapsulant. The buffer layer has a Young's modulus less than a Young's modulus of the first encapsulant and a Young's modulus of the second encapsulant.Type: GrantFiled: June 27, 2022Date of Patent: April 16, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Wei-Chih Chen, Chien-Hsun Lee, Chung-Shi Liu, Hao-Cheng Hou, Hung-Jui Kuo, Jung-Wei Cheng, Tsung-Ding Wang, Yu-Hsiang Hu, Sih-Hao Liao -
Publication number: 20240119747Abstract: A deep neural network-based method for detecting living cell morphology may include identifying and locating one or more living cells within an acquired image to be detected by using a deep neural network-based target detection model, so as to extract one or more living single cell images. segmenting the image of the one or more living single cells by using a deep neural network-based cell segmentation model, so as to obtain one or more feature part of the one or more living single cells. and analyzing and determining a morphological parameter of the one or more living single cells based on the one or more feature parts. Thus, the activity of the detected cells can be ensured, and a non-destructive, accurate, and rapid detection of living cell morphology can be achieved.Type: ApplicationFiled: April 1, 2022Publication date: April 11, 2024Inventors: Guole LIU, Jie JIN, Hao SHI, Yuqiang JIANG, Ge YANG, Tao YANG
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Patent number: 11954011Abstract: An apparatus and a method for executing a customized production line using an artificial intelligence development platform, a computing device and a computer readable storage medium are provided. The apparatus includes: a production line executor configured to generate a native form of the artificial intelligence development platform based on a file set, the native form to be sent to a client accessing the artificial intelligence development platform so as to present a native interactive page of the artificial intelligence development platform; and a standardized platform interface configured to provide an interaction channel between the production line executor and the artificial intelligence development platform. The production line executor is further configured to generate an intermediate result by executing processing logic defined in the file set and to process the intermediate result by interacting with the artificial intelligence development platform via the standardized platform interface.Type: GrantFiled: October 28, 2020Date of Patent: April 9, 2024Assignee: BEIJING BAIDU NETCOM SCIENCE AND TECHNOLOGY CO., LTD.Inventors: Yongkang Xie, Ruyue Ma, Zhou Xin, Hao Cao, Kuan Shi, Yu Zhou, Yashuai Li, En Shi, Zhiquan Wu, Zihao Pan, Shupeng Li, Mingren Hu, Tian Wu
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Patent number: 11953740Abstract: A package structure including a photonic, an electronic die, an encapsulant and a waveguide is provided. The photonic die includes an optical coupler. The electronic die is electrically coupled to the photonic die. The encapsulant laterally encapsulates the photonic die and the electronic die. The waveguide is disposed over the encapsulant and includes an upper surface facing away from the encapsulant. The waveguide includes a first end portion and a second end portion, the first end portion is optically coupled to the optical coupler, and the second end portion has a groove on the upper surface.Type: GrantFiled: May 14, 2021Date of Patent: April 9, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo, Tsung-Yuan Yu, Hua-Kuei Lin, Che-Hsiang Hsu
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Publication number: 20240113071Abstract: An integrated circuit package including electrically floating metal lines and a method of forming are provided. The integrated circuit package may include integrated circuit dies, an encapsulant around the integrated circuit dies, a redistribution structure on the encapsulant, a first electrically floating metal line disposed on the redistribution structure, a first electrical component connected to the redistribution structure, and an underfill between the first electrical component and the redistribution structure. A first opening in the underfill may expose a top surface of the first electrically floating metal line.Type: ApplicationFiled: January 5, 2023Publication date: April 4, 2024Inventors: Chung-Shi Liu, Mao-Yen Chang, Yu-Chia Lai, Kuo-Lung Pan, Hao-Yi Tsai, Ching-Hua Hsieh, Hsiu-Jen Lin, Po-Yuan Teng, Cheng-Chieh Wu, Jen-Chun Liao
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Patent number: 11947173Abstract: A package includes a photonic layer on a substrate, the photonic layer including a silicon waveguide coupled to a grating coupler; an interconnect structure over the photonic layer; an electronic die and a first dielectric layer over the interconnect structure, where the electronic die is connected to the interconnect structure; a first substrate bonded to the electronic die and the first dielectric layer; a socket attached to a top surface of the first substrate; and a fiber holder coupled to the first substrate through the socket, where the fiber holder includes a prism that re-orients an optical path of an optical signal.Type: GrantFiled: May 5, 2023Date of Patent: April 2, 2024Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo, Tsung-Yuan Yu, Hua-Kuei Lin, Che-Hsiang Hsu
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Patent number: 11950454Abstract: A display panel and a display device are disclosed, the display panel comprises: a base substrate; and pixel circuits in an array, the display panel comprises a light transmittance region and a display region around the light transmittance region, the pixel circuits are disposed in the display region, a gate line of each row of m rows of pixel circuits is divided into a first gate line portion and a second gate line portion which are connected through an auxiliary gate line, a data line of each column of n columns of pixel circuits is divided into a first data line portion and a second data line portion which are connected through an auxiliary data line.Type: GrantFiled: May 11, 2020Date of Patent: April 2, 2024Assignees: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.Inventors: Ling Shi, Hao Zhang, Yipeng Chen, Wenqiang Li, Chienpang Huang
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Publication number: 20240101956Abstract: The present disclosure discloses a novel strain of Glutamicibacter, derived from insects, which efficiently degrades bifenthrin, belonging to the field of microbial strains. The Glutamicibacter CCTCC NO: M20221445 of the present disclosure was isolated from the intestinal tract of bifenthrin-resistant Ectropis grisescens Warren larvae. It exhibits unique genomic characteristics, growth and phenotypic traits, physiological and biochemical characteristics, as well as the ability to utilize and degrade bifenthrin efficiently. Specifically, it can effectively degrade bifenthrin. Based on phenotypic features, physiological and biochemical characteristics, chemical composition, and molecular biology-based polyphasic classification, Glutamicibacter CCTCC NO: M20221445 is identified as a new species. This bacterium possesses the capability to efficiently degrade bifenthrin, laying the foundation for biological control of E. grisecens and offering new microbial resources to address pesticide residue problems.Type: ApplicationFiled: December 1, 2023Publication date: March 28, 2024Inventors: Yanhua LONG, Xiayu Li, Ting Fang, Hao Gui, Meiqi Wang, Haiyue Wang, Yanru Bao, Anqi Shi, Yuhan Pan, Linlin Zhou, Xiaochun Wan, Yunqiu Yang
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Publication number: 20240105821Abstract: A structure of a two-dimensional material-based device having an air-gap and a method for preparing same comprises a substrate, a gate, an dielectric, a two-dimensional material-based film, and source and drain electrodes; the air-gap is formed between the two-dimensional material-based film and the side wall of the dielectric on the gate, or the air-gap is formed between the dielectric and the gate; two-dimensional material-based devices of the above structure utilize the ductility and flexibility of two-dimensional materials to reduce the coupling between the gate and the source/drain electrodes, thereby reducing the parasitic capacitance and the circuit delay; also, the structure ensures that a part of the contact region of the source and drain electrodes with the two-dimensional material can be controlled by the gate, and can thus avoid the reduction in electrical properties and keep a low resistance of the device.Type: ApplicationFiled: November 9, 2023Publication date: March 28, 2024Applicant: NANJING UNIVERSITYInventors: Xinran Wang, Dongxu Fan, Weisheng Li, Hao Qiu, Yi Shi
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Patent number: 11942464Abstract: In an embodiment, a method includes: aligning a first package component with a second package component, the first package component having a first region and a second region, the first region including a first conductive connector, the second region including a second conductive connector; performing a first laser shot on a first portion of a top surface of the first package component, the first laser shot reflowing the first conductive connector of the first region, the first portion of the top surface of the first package component completely overlapping the first region; and after performing the first laser shot, performing a second laser shot on a second portion of the top surface of the first package component, the second laser shot reflowing the second conductive connector of the second region, the second portion of the top surface of the first package component completely overlapping the second region.Type: GrantFiled: July 19, 2021Date of Patent: March 26, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Hao-Jan Pei, Hsiu-Jen Lin, Wei-Yu Chen, Philip Yu-Shuan Chung, Chia-Shen Cheng, Kuei-Wei Huang, Ching-Hua Hsieh, Chung-Shi Liu, Chen-Hua Yu
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Publication number: 20240098270Abstract: Provided is a method for processing video data. The method includes: acquiring a second outline of at least one object in an (n+1)th image frame of a to-be-compressed video data group based on a fuzzy algorithm; determining a motion vector of the at least one object according to the second outline and a first outline of the at least one object in an nth image frame of the to-be-compressed video data group; acquiring compressed video data according to the motion vector and a start image frame of to-be-compressed video data; and sending the compressed video data to an apparatus for displaying images.Type: ApplicationFiled: September 20, 2022Publication date: March 21, 2024Inventors: Huidong HE, Peng HAN, Hao ZHANG, Lili CHEN, Qianwen JIANG, Ruifeng QIN, Juanjuan SHI, Weihua DU
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Patent number: 11935804Abstract: In an embodiment, a device includes: an integrated circuit die; an encapsulant at least partially surrounding the integrated circuit die, the encapsulant including fillers having an average diameter; a through via extending through the encapsulant, the through via having a lower portion of a constant width and an upper portion of a continuously decreasing width, a thickness of the upper portion being greater than the average diameter of the fillers; and a redistribution structure including: a dielectric layer on the through via, the encapsulant, and the integrated circuit die; and a metallization pattern having a via portion extending through the dielectric layer and a line portion extending along the dielectric layer, the metallization pattern being electrically coupled to the through via and the integrated circuit die.Type: GrantFiled: April 10, 2023Date of Patent: March 19, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Tzu-Sung Huang, Ming Hung Tseng, Yen-Liang Lin, Hao-Yi Tsai, Chi-Ming Tsai, Chung-Shi Liu, Chih-Wei Lin, Ming-Che Ho
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Patent number: 11928439Abstract: A translation method is provided, including: encoding to-be-processed text information to obtain a source vector representation sequence, the to-be-processed text information belonging to a first language; obtaining a source context vector corresponding to a first instance according to the source vector representation sequence, the source context vector indicating to-be-processed source content in the to-be-processed text information at the first instance; determining a translation vector according to the source vector representation sequence and the source context vector; and decoding the translation vector and the source context vector, to obtain target information of the first instance, the target information belonging to a second language.Type: GrantFiled: January 22, 2020Date of Patent: March 12, 2024Assignee: TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITEDInventors: Zhaopeng Tu, Hao Zhou, Shuming Shi
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Publication number: 20240077631Abstract: The present disclosure relates to a seismic imaging free gas structure identification method and system, The method includes: acquiring a seismic imaging dataset, and annotating free gas structures in the seismic imaging sample data set to obtain a training dataset; using a generative adversarial network (GAN) to expand the training dataset for network training, wherein the GAN includes a generative network and a discrimination network; conducting domain conversion on original label data of the free gas training samples to obtain annotating labels: training a Bayesian neural network according to the free gas training datasets and labels, to obtain a free gas structure identification model; acquiring actual seismic imaging data of a target work area; and conducting, according to the actual seismic imaging data, identification by using the free gas structure identification model.Type: ApplicationFiled: January 18, 2023Publication date: March 7, 2024Applicant: Institute of Geomechanics, Chinese Academy of Geological SciencesInventors: Hao ZHANG, Chongyuan ZHANG, Xingqiang FENG, Hui SHI
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Patent number: 11923349Abstract: A semiconductor structure includes a die and a first connector. The first connector is disposed on the die. The first connector includes a first connecting housing, a first connecting element and a first connecting portion. The first connecting element is electrically connected to the die and disposed at a first side of the first connecting housing. The first connecting portion is disposed at a second side different from the first side of the first connecting housing, wherein the first connecting portion is one of a hole and a protrusion with respect to a surface of the second side of the first connecting housing.Type: GrantFiled: June 30, 2022Date of Patent: March 5, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chi-Hui Lai, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Tin-Hao Kuo
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Publication number: 20240067583Abstract: The present disclosure relates to a thermal coupling method for preparing ethylene by ethanol dehydration and device thereof. The device includes an ethanol dehydration reaction system, a quenching compression system, an alkaline washing system, a molecular sieve drying system and an ethylene purification and propylene refrigeration cycle system; ethanol dehydration reaction products in the ethanol dehydration reaction system serve as a heat source for preheating, vaporization and superheating of a raw material of ethanol; tower bottoms of an evaporation tower in the quenching compression system serve as a heat source for preheating of a feed stream of the evaporation tower and heating of an overhead gas of a quenching tower; products of ethylene in the alkaline washing system serve as a cold source for cooling of crude ethylene.Type: ApplicationFiled: June 19, 2023Publication date: February 29, 2024Inventors: Minhua ZHANG, Hao GONG, He DONG, Feng SHI, Fang MENG, Yingzhe YU, Haoxi JIANG
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Publication number: 20240067782Abstract: An aluminum borate whisker reinforced and toughened non-metallic matrix composite is provided, which specifically includes a non-metallic material reinforced and toughened with aluminum borate whiskers. The composite exhibits a higher bending strength and fracture toughness and a higher wear resistance. A method for preparing the composite is also provided. The method includes mixing the aluminum borate whiskers and the non-metallic material to form a mixture; and sintering the mixture by a vacuum hot press method, or molding the mixture.Type: ApplicationFiled: November 6, 2023Publication date: February 29, 2024Inventors: Yue Shi, Bi Jia, Jinliang Shi, Zhigang Zou, Yong Zhou, Yongjiang Di, Yin Liu, Huichao He, Rong Wang, Xueyi Wang, Hao Tian, Jun Zhu, Rui Tang, Xingyu Chen, Danxia Zhang
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Publication number: 20230265504Abstract: Described herein are methods for rapid, highly multiplexible detection of nucleotides in samples and constructs made to be used in said methods.Type: ApplicationFiled: February 21, 2023Publication date: August 24, 2023Applicant: Kanvas Biosciences, Inc.Inventors: Philip S. Burnham, Gregory T. Booth, Hannah Bronson, Matthew P. Cheng, Iwijn De Vlaminck, Hao Shi, Prateek Sehgal
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Patent number: D1000241Type: GrantFiled: April 25, 2022Date of Patent: October 3, 2023Assignee: MAKITA CORPORATIONInventors: Tianpeng Sun, Hao Shi