Abstract: The invention discloses a complex network-based high speed train system safety evaluation method. The method includes steps as follows: (1) constructing a network model of a physical structure of a high speed train system, and constructing a functional attribute degree of a node based on the network model; (2) extracting a functional attribute degree, a failure rate and mean time between failures of a component as an input quantity, conducting an SVM training using LIBSVM software; (3) conducting a weighted kNN-SVM judgment: an unclassifiable sample point is judged so as to obtain a safety level of the high speed train system. For a high speed train system having a complicated physical structure and operation conditions, the method can evaluate the degree of influences on system safety when a state of a component in the system changes. The experimental result shows that the algorithm has high accuracy and good practicality.

Abstract: The invention discloses a complex network-based high speed train system safety evaluation method. The method includes steps as follows: (1) constructing a network model of a physical structure of a high speed train system, and constructing a functional attribute degree of a node based on the network model; (2) extracting a functional attribute degree, a failure rate and mean time between failures of a component as an input quantity, conducting an SVM training using LIBSVM software; (3) conducting a weighted kNN-SVM judgment: an unclassifiable sample point is judged so as to obtain a safety level of the high speed train system. For a high speed train system having a complicated physical structure and operation conditions, the method can evaluate the degree of influences on system safety when a state of a component in the system changes. The experimental result shows that the algorithm has high accuracy and good practicality.

Abstract: A multifunctional cat condo has a three-layered structure, wherein both the bottom layer and the second layer comprise resting houses, and the top layer comprises a resting ledge, wherein the two resting houses and the resting ledge are connected through a plurality of vertical posts and are suspended on a bottom board, wherein climbing boards are connected between the resting house in the bottom layer and the ground as well as between the two resting houses; and an inside of the resting house is provided with a wireless camera that can communicate with an external control terminal and is configured to send activity situations of the cat in the resting house to the control terminal; an inside of the vertical post is provided with a music sounder; and a bottom end of one of the plurality of vertical posts is provided with a pressure sensor.

Abstract: A configuration-variable remote-controlled pet toy includes a movable base, an animal model detachably installed on the base, and an external control terminal, wherein the bottom of the base is provided with a roller wheel, the inside of the base is provided with a motor, a control circuit, a micro control unit, a wireless communication module and a phonation device; the motor is configured to drive the roller wheel to roll, the control circuit controls the rotation of the motor according to a control signal sent by the micro control unit, the wireless communication module is communicated with the external control terminal, and the phonation device is configured to play the sound or sound record of a master received by the wireless communication module in real time.

Abstract: A configuration-variable remote-controlled pet toy includes a movable base, an animal model detachably installed on the base, and an external control terminal, wherein the bottom of the base is provided with a roller wheel, the inside of the base is provided with a motor, a control circuit, a micro control unit, a wireless communication module and a phonation device; the motor is configured to drive the roller wheel to roll, the control circuit controls the rotation of the motor according to a control signal sent by the micro control unit, the wireless communication module is communicated with the external control terminal, and the phonation device is configured to play the sound or sound record of a master received by the wireless communication module in real time.

Abstract: The present invention provides a pulse modulating power source, which comprises: a plurality of discharging modules connected in series during discharging; a plurality of triggers corresponding to said plurality of discharging modules, wherein each trigger provides a trigger signal to the corresponding discharging module to turn it on; a control logic module for controlling the trigger signals so as to turn on said plurality of discharging modules successively with a time delay; an output terminal for outputting a voltage.

Abstract: The present invention provides a high voltage pulse modulating power source based on alternate group triggering, which comprises: a DC stabilized voltage source for supplying power to the high voltage pulse modulating power source; a plurality of solid-state switches; a plurality of triggers corresponding to said plurality of solid-state switches, wherein each trigger provides a trigger signal to its corresponding solid-state switch to turn on said corresponding solid-state switch, wherein said plurality of triggers are divided into at least two groups of triggers; a time sequence control module, which, at time t1, controls said plurality of triggers to generate trigger signals so as to turn on said plurality of solid-state switches simultaneously, and at time t2, controls one group of said at least two groups of triggers to generate trigger signals to turn on solid-state switches corresponding to this group of triggers, wherein time t1 and time t2 appear alternately.

Abstract: An electronic device includes a storage unit, a positioning unit, and a processing unit. The storage unit stores geographic information for defining various restricted areas and a disabling table recording one or more to-be-disabled applications and/or hardware of the electronic device in each restricted areas. The positioning unit positions the electronic device. The processing unit determines whether the electronic device enters one restricted area according to the position of the electronic device and the geographic information for defining the various restricted areas, determines one or more to-be-disabled applications and/or hardware according to the disabling table when the electronic device enters one restricted area, and disable the determined one or more to-be-disabled applications and/or hardware when the electronic device enters the one restricted area. A related method is also provided.

Abstract: In some embodiments, the semiconductor package includes a substrate having multiple layers, from a first layer to a final layer, a die coupled to the first layer, an electrical connector such as a solder ball coupled to the final layer, and a spiral trace disposed and electrically coupled between the die and the electrical connector. Inductance of the spiral trace is selected such that the package has a predetermined impedance. Material, cross-sectional area, number and density of windings, and total overall length of the spiral trace are selected accordingly. In other embodiments, the semiconductor package includes a substrate with multiple layers; a die coupled to the first of the layers; an electrical connector coupled to the final layer; and a spiral trace, in or on the substrate. The spiral trace is near the die, and electrically coupled between the die and the electrical connector.

Abstract: One example embodiment includes a system for attaching an external object to a cloth. The system includes a base layer. The system also includes a first adhesive layer, where the first adhesive layer is applied to a first side of the base layer. The system further includes a second adhesive layer, where the second adhesive layer is applied to a second side of the base layer, where the second side of the base layer is opposite the first side.

Abstract: One example embodiment includes a system for attaching an external object to a cloth. The system includes a badge. The system also includes a first attachment, where the attachment is configured to releasably attach a cloth to the badge. The system further includes a second attachment, where the second attachment is configured to releasably attach a decoration to the badge.

Abstract: One example embodiment includes a system for attaching an external object to a cloth. The system includes a first layer and a second layer, where at least a portion of the second layer is attached to the first layer. The system also includes an attachment, where the attachment is configured to attach the first layer to a cloth.

Abstract: In some embodiments, the semiconductor package includes a substrate having multiple layers, from a first layer to a final layer, a die coupled to the first layer, an electrical connector such as a solder ball coupled to the final layer, and a spiral trace disposed and electrically coupled between the die and the electrical connector. Inductance of the spiral trace is selected such that the package has a predetermined impedance. Material, cross-sectional area, number and density of windings, and total overall length of the spiral trace are selected accordingly. In other embodiments, the semiconductor package includes a substrate with multiple layers; a die coupled to the first of the layers; an electrical connector coupled to the final layer; and a spiral trace, in or on the substrate. The spiral trace is near the die, and electrically coupled between the die and the electrical connector.

Abstract: In some embodiments, the semiconductor package includes a substrate having multiple layers, from a first layer to a final layer, a die coupled to the first layer, an electrical connector such as a solder ball coupled to the final layer, and a spiral trace disposed and electrically coupled between the die and the electrical connector. Inductance of the spiral trace is selected such that the package has a predetermined impedance. Material, cross-sectional area, number and density of windings, and total overall length of the spiral trace are selected accordingly. In other embodiments, the semiconductor package includes a substrate with multiple layers; a die coupled to the first of the layers; an electrical connector coupled to the final layer; and a spiral trace, in or on the substrate. The spiral trace is near the die, and electrically coupled between the die and the electrical connector.

Abstract: In some embodiments, the semiconductor package includes a substrate having multiple layers, from a first layer to a final layer, a die coupled to the first layer, an electrical connector such as a solder ball coupled to the final layer, and a spiral trace disposed and electrically coupled between the die and the electrical connector. Inductance of the spiral trace is selected such that the package has a predetermined impedance. Material, cross-sectional area, number and density of windings, and total overall length of the spiral trace are selected accordingly. In other embodiments, the semiconductor package includes a substrate with multiple layers; a die coupled to the first of the layers; an electrical connector coupled to the final layer; and a spiral trace, in or on the substrate. The spiral trace is near the die, and electrically coupled between the die and the electrical connector.

Abstract: A hospital bed apparatus includes a supporting frame, a lifting mechanism, and a horizontally moving mechanism; the lifting mechanism includes two horizontal rods on two sides of a hospital bed, and a sheet is disposed between and connected to the horizontal rods; either one of the horizontal rods can be lifted so as to turn and reposition the patient on the sheet; the horizontally moving mechanism includes linearly displaceable transverse rods, and connecting rods pivoted to the transverse rods and the lifting mechanism; the sheet and the horizontal rods of the lifting mechanism will be moved outside of the hospital bed when the horizontally moving mechanism is actuated after the sheet have been lifted off the hospital bed together with the horizontal rods; thus, the patient can be shifted to another hospital bed.

Abstract: The multilayer substrate includes a plurality of layers. Located within the plurality of layers are a number of vias. Conductive traces connect the vias to form trace/via paths having various topologies, geometries, and/or properties.

Abstract: A hospital bed apparatus includes a supporting frame, a lifting mechanism, and a horizontally moving mechanism; the lifting mechanism includes two horizontal rods on two sides of a hospital bed, and a sheet is disposed between and connected to the horizontal rods; either one of the horizontal rods can be lifted so as to turn and reposition the patient on the sheet; the horizontally moving mechanism includes linearly displaceable transverse rods, and connecting rods pivoted to the transverse rods and the lifting mechanism; the sheet and the horizontal rods of the lifting mechanism will be moved outside of the hospital bed when the horizontally moving mechanism is actuated after the sheet have been lifted off the hospital bed together with the horizontal rods; thus, the patient can be shifted to another hospital bed.

Abstract: An apparatus to identify the manufacturer of a battery is provided, the battery typically includes a DC signal pin and a grounding resistor. The apparatus includes a keyboard controller. The keyboard controller includes an analog to digital converter (ADC) with an ADC signal pin. The ADC signal pin is connected to an end of the grounding resistor through the DC signal pin, and the other end of the grounding resistor is grounded. It is of advantage that the DC signal pin of the battery is coupled to the ADC signal pin of the keyboard controller. The voltage of the DC signal pin is converted into a multi-bit digital signal to compare with a list programmed in the keyboard controller, to identify any of a large number of various different battery manufacturers.

Abstract: A central office modem (50) that includes the capability of single-ended loop testing (SELT) is disclosed. The modem (50) includes a digital signal processor (54), a codec (56), line driver and receiver circuitry (58), and a hybrid circuit (60), by way of which a subscriber loop (LOOP) can be driven and sensed. The line driver and receiver circuitry (58) may include a transformer (74a, 74b) for driving the loop (LOOP), or the output may be capacitively coupled. The line driver and receiver circuitry (58) includes active termination, by way of operational amplifiers (80a, 80b). Switches (82a, 82b; 84a, 84b) are provided to selectively enable and disable the active termination function, and to selectively bypass or include the hybrid circuit (60). This control of the line driver and receiver circuitry (58) provides the ability to calibrate out its own characteristics, providing high precision SELT measurements of the load impedance type, and of frequency domain reflectometry, and time domain reflectometry.