Patents by Inventor Haoyu Li

Haoyu Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240102782
    Abstract: The invention provides a method for evaluating deep-buried tunnel blasting parameters, and belongs to the technical field of mine engineering. The method comprises: setting multiple diverse blasting schemes; selecting a plurality of test sections with the same geological characteristics, the number of the test sections corresponding to the number of the blasting schemes; blasting the test sections using the blasting schemes, and obtaining diversified monitoring data of each test section; and comparing the diversified monitoring data to select the optimal blasting schemes for the test sections. According to the method for evaluating the deep-buried tunnel blasting parameters, by implementing different blasting schemes in test sections with the same geological characteristics, diversified monitoring data of the test sections are obtained and compared to select the optimal blasting schemes for the test sections, so as to ensure the safety and quality of blasting excavation of deep-buried tunnels.
    Type: Application
    Filed: September 5, 2023
    Publication date: March 28, 2024
    Inventors: Nuwen Xu, Biao Li, Quanfu Ding, Haoyu Mao, Peiwei Xiao, Xiang Zhou, Xinchao Ding, Yuepeng Sun, Yong Xia, Jun Liu, Zhiqiang Sun
  • Patent number: 11924681
    Abstract: A mechanism for adaptively performing in-band network telemetry (INT) by a network controller is disclosed. The mechanism includes receiving one or more congestion indicators from a collector. An adjusted sampling rate is generated. The adjusted sampling rate is a specified rate of insertion of instruction headers for INT and is generated based on the congestion indicators. The adjusted sampling rate is transmitted to a head node, which is configured to perform INT via instruction header insertion into user packets.
    Type: Grant
    Filed: September 27, 2022
    Date of Patent: March 5, 2024
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Haoyu Song, Tianran Zhou, Min Liu, Zhenbin Li
  • Publication number: 20240064982
    Abstract: Some embodiments include an integrated assembly having a first structure containing semiconductor material, and having a second structure contacting the first structure. The first structure has a composition along an interface with the second structure. The composition includes additive to a concentration within a range of from about 1018 atoms/cm3 to about 1021 atoms/cm3. The additive includes one or more of carbon, oxygen, nitrogen and sulfur. Some embodiments include methods of forming integrated assemblies.
    Type: Application
    Filed: November 2, 2023
    Publication date: February 22, 2024
    Applicant: Micron Technology, Inc.
    Inventors: Yiping Wang, Andrew Li, Haoyu Li, Matthew J. King, Wei Yeeng Ng, Yongjun Jeff Hu
  • Publication number: 20240046416
    Abstract: Systems and methods for image processing are provided in the present disclosure. The systems may generate a preliminary image by filtering image data generated by an image acquisition device. The system may generate an intermediate image by performing, based on a first objective function, a first iterative operation on the preliminary image. The first objective function may include a first term associated with a first difference between the intermediate image and the preliminary image, a second term associated with continuity of the intermediate image and a third term associated with sparsity of the intermediate image. The systems may also generate a target image by performing, based on a second objective function, a second iterative operation on the intermediate image. The second objective function may be associated with a system matrix of the image acquisition device and a second difference between the intermediate image and the target image.
    Type: Application
    Filed: October 14, 2023
    Publication date: February 8, 2024
    Applicant: GUANGZHOU COMPUTATIONAL SUPER-RESOLUTION BIOTECH CO., LTD.
    Inventors: Liangyi CHEN, Haoyu LI, Weisong ZHAO, Xiaoshuai HUANG
  • Patent number: 11886203
    Abstract: A flight control method includes displaying a user interface configured to receive an operation instruction including coordinates of waypoints, generating route data of a route based on the coordinates of the waypoints, sending the route data to an aircraft to instruct the aircraft to execute the route, recording an interruption point during execution of the route by the aircraft, displaying a plurality of candidate starting points including at least one of the interruption point, a last waypoint of the route before the interruption point, a next waypoint of the route after the interruption point, or a user-designated waypoint, in response to a selection instruction, selecting a target starting point from the plurality of candidate starting points, and controlling the aircraft in an interrupted state to fly to the target starting point and resume the execution of the route from the target starting point.
    Type: Grant
    Filed: September 13, 2021
    Date of Patent: January 30, 2024
    Assignee: SZ DJI TECHNOLOGY CO., LTD.
    Inventors: Zhuo Guo, Zhuo Xie, Haoyu Li, Wenlin Li, Ding Wang, Zebo Yang
  • Publication number: 20240030540
    Abstract: A battery pack includes a housing, a plurality of cells disposed in the housing, and a supporting piece. The plurality of cells are stacked in a first direction, the supporting piece is disposed between two cells, and the supporting piece includes a first supporting portion and a second supporting portion arranged opposite each other. In a second direction, the housing includes a first protrusion and a second protrusion, the supporting piece is disposed between the first protrusion and the second protrusion, the first supporting portion is connected to the first protrusion and the second supporting portion is connected to the second protrusion, and the second direction is a width direction of the housing.
    Type: Application
    Filed: September 29, 2023
    Publication date: January 25, 2024
    Applicant: Dongguan Poweramp Technology Limited
    Inventors: Hao LI, Haoyu LI, Pengfei WANG
  • Patent number: 11844220
    Abstract: Some embodiments include an integrated assembly having a first structure containing semiconductor material, and having a second structure contacting the first structure. The first structure has a composition along an interface with the second structure. The composition includes additive to a concentration within a range of from about 1018 atoms/cm3 to about 1021 atoms/cm3. The additive includes one or more of carbon, oxygen, nitrogen and sulfur. Some embodiments include methods of forming integrated assemblies.
    Type: Grant
    Filed: December 2, 2022
    Date of Patent: December 12, 2023
    Assignee: Micron Technology, Inc.
    Inventors: Yiping Wang, Andrew Li, Haoyu Li, Matthew J. King, Wei Yeeng Ng, Yongjun Jeff Hu
  • Publication number: 20230386575
    Abstract: A memory array comprising strings of memory cells comprises a conductor tier comprising conductor material. Laterally-spaced memory blocks individually comprise a vertical stack comprising alternating insulative tiers and conductive tiers. Channel-material strings of memory cells extend through the insulative tiers and the conductive tiers. Conducting material of a lower of the conductive tiers directly electrically coupling together the channel material of individual of the channel-material strings and the conductor material of the conductor tier. The conducting material in the lower conductive tier comprises upper conductively-doped semiconductive material, lower conductively-doped semiconductive material, and intermediate material vertically there-between.
    Type: Application
    Filed: May 24, 2022
    Publication date: November 30, 2023
    Applicant: Micron Technology, Inc.
    Inventors: Haoyu Li, John D. Hopkins, Collin Howder, Adam W. Saxler
  • Patent number: 11790502
    Abstract: Systems and methods for image processing are provided in the present disclosure. The systems may generate a preliminary image by filtering image data generated by an image acquisition device. The system may generate an intermediate image by performing, based on a first objective function, a first iterative operation on the preliminary image. The first objective function may include a first term associated with a first difference between the intermediate image and the preliminary image, a second term associated with continuity of the intermediate image and a third term associated with sparsity of the intermediate image. The systems may also generate a target image by performing, based on a second objective function, a second iterative operation on the intermediate image. The second objective function may be associated with a system matrix of the image acquisition device and a second difference between the intermediate image and the target image.
    Type: Grant
    Filed: November 16, 2021
    Date of Patent: October 17, 2023
    Assignee: GUANGZHOU COMPUTATIONAL SUPER-RESOLUTIONS BIOTECH CO., LTD.
    Inventors: Liangyi Chen, Haoyu Li, Weisong Zhao, Xiaoshuai Huang
  • Publication number: 20230305205
    Abstract: An ultra wide band (UWB) optical absorber based on multilayer transition metal layers is provided, and a working band thereof includes a visible-near infrared band or a mid-infrared band; a high reflecting metal film layer, a transition metal film layer and a dielectric film layer are sequentially stacked on a substrate; the high reflecting metal film layer, multilayer transition metal film layers and the dielectric film layer form a planar multilayer structure. The high reflecting metal film layer is used to prevent light transmission, and the combination of the multilayer transition metal film layers and the dielectric film layer reduces the reflection, thus achieving the effect of efficient optical absorption in UWB. The optical absorber can achieve an average absorptivity of more than 92% in the visible-near infrared band of 400-2500 nm, and an average absorptivity of more than 80% in the mid-infrared band of 3-16 ?m.
    Type: Application
    Filed: January 9, 2023
    Publication date: September 28, 2023
    Inventors: Cheng Zhang, Xiaofeng Li, Haoyu Li, Binglin Huang, Ti Sun, Qinhua Wang
  • Publication number: 20230274135
    Abstract: A method, system, and computer program product is provided for embedding compression and reconstruction. The method includes receiving embedding vector data comprising a plurality of embedding vectors. A beta-variational autoencoder is trained based on the embedding vector data and a loss equation. The method includes determining a respective entropy of a respective mean and a respective variance of each respective dimension of a plurality of dimensions. A first subset of the plurality of dimensions is determined based on the respective entropy of the respective mean and the respective variance for each respective dimension of the plurality of dimensions. A second subset of the plurality of dimensions is discarded based on the respective entropy of the respective mean and the respective variance for each respective dimension of the plurality of dimensions. The method includes generating a compressed representation of the embedding vector data based on the first subset of dimensions.
    Type: Application
    Filed: October 21, 2022
    Publication date: August 31, 2023
    Inventors: Haoyu Li, Junpeng Wang, Liang Wang, Yan Zheng, Wei Zhang
  • Patent number: 11729964
    Abstract: An apparatus comprises a conductive structure, another conductive structure, and a laminate spacer structure interposed between the conductive structure and the another conductive structure in a first direction. The laminate spacer structure comprises a dielectric spacer structure, another dielectric spacer structure, and an additional dielectric spacer structure interposed between the dielectric spacer structure and the another dielectric spacer structure. The additional dielectric spacer structure comprises at least one dielectric material, and gas pockets dispersed within the at least one dielectric material. Additional apparatuses, memory devices, electronic systems, and a method of forming an apparatus are also described.
    Type: Grant
    Filed: September 29, 2021
    Date of Patent: August 15, 2023
    Assignee: Micron Technology, Inc.
    Inventors: Silvia Borsari, Stian E. Wood, Haoyu Li, Yiping Wang
  • Publication number: 20230215143
    Abstract: A detection method includes obtaining a to-be-migrated model. The to-be-migrated model includes a memory feature set, and the memory feature set represents a feature vector set associated with an application scene corresponding to the to-be-migrated model. The method further includes performing a metric calculation on at least one piece of sample data of a target scene and the memory feature set to obtain at least one metric calculation result, and updating the memory feature set according to the at least one metric calculation result to obtain a target memory feature set. The target memory feature set represents a feature vector set associated with the target scene. The method further includes obtaining a target detection model by replacing the memory feature set of the to-be-migrated model with the target memory feature set.
    Type: Application
    Filed: September 8, 2022
    Publication date: July 6, 2023
    Inventors: Guangyi LV, Xiaoxuan TANG, Haoyu LI
  • Publication number: 20230104297
    Abstract: Some embodiments include an integrated assembly having a first structure containing semiconductor material, and having a second structure contacting the first structure. The first structure has a composition along an interface with the second structure. The composition includes additive to a concentration within a range of from about 1018 atoms/cm3 to about 1021 atoms/cm3. The additive includes one or more of carbon, oxygen, nitrogen and sulfur. Some embodiments include methods of forming integrated assemblies.
    Type: Application
    Filed: December 2, 2022
    Publication date: April 6, 2023
    Applicant: Micron Technology, Inc.
    Inventors: Yiping Wang, Andrew Li, Haoyu Li, Matthew J. King, Wei Yeeng Ng, Yongjun Jeff Hu
  • Patent number: 11621273
    Abstract: Some embodiments include an integrated assembly having a first structure containing semiconductor material, and having a second structure contacting the first structure. The first structure has a composition along an interface with the second structure. The composition includes additive to a concentration within a range of from about 1018 atoms/cm3 to about 1021 atoms/cm3. The additive includes one or more of carbon, oxygen, nitrogen and sulfur. Some embodiments include methods of forming integrated assemblies.
    Type: Grant
    Filed: May 13, 2020
    Date of Patent: April 4, 2023
    Assignee: Micron Technology, Inc.
    Inventors: Yiping Wang, Andrew Li, Haoyu Li, Matthew J. King, Wei Yeeng Ng, Yongjun Jeff Hu
  • Publication number: 20230062084
    Abstract: A memory array comprising strings of memory cells comprises conductor tier comprising conductor material. Laterally-spaced memory blocks individually comprising a vertical stack comprises alternating insulative tiers and conductive tiers. Channel-material strings of memory cells extend through the insulative tiers and the conductive tiers. Conducting material of a lower of the conductive tiers directly electrically couples together the channel material of individual of the channel-material strings and the conductor material of the conductor tier. The conducting material in the lower conductive tier comprises upper conductively-doped semiconductive material, lower conductively-doped semiconductive material, and intermediate material vertically there-between. Other embodiments, including method, are disclosed.
    Type: Application
    Filed: September 14, 2021
    Publication date: March 2, 2023
    Applicant: Micron Technology, Inc.
    Inventors: John D. Hopkins, Haoyu Li
  • Publication number: 20230057852
    Abstract: Integrated circuitry comprising a memory array comprises strings of memory cells comprising laterally-spaced memory blocks individually comprising a first vertical stack comprising alternating insulative tiers and conductive tiers above a conductor tier. Strings of memory cells comprise channel-material strings that extend through the insulative tiers and the conductive tiers. The channel-material strings directly electrically couple with conductor material of the conductor tier. The conductive tiers individually comprise a horizontally-elongated conductive line. A second vertical stack is aside the first vertical stack. The second vertical stack comprises an upper portion and a lower portion. The upper portion comprises vertically-alternating first insulating tiers and second insulating tiers that are of different insulative compositions relative one another.
    Type: Application
    Filed: August 23, 2021
    Publication date: February 23, 2023
    Applicant: Micron Technology, Inc.
    Inventors: Collin Howder, M. Jared Barclay, Bhavesh Bhartia, Chet E. Carter, John D. Hopkins, Andrew Li, Haoyu Li, Alyssa N. Scarbrough, Grady S. Waldo
  • Patent number: 11527548
    Abstract: A semiconductor device comprises a semiconductor material extending through a stack of alternating levels of a conductive material and an insulative material, and a material comprising cerium oxide and at least another oxide adjacent to the semiconductor material. Related electronic systems and methods are also disclosed.
    Type: Grant
    Filed: December 11, 2018
    Date of Patent: December 13, 2022
    Assignee: Micron Technology, Inc.
    Inventors: Haoyu Li, Everett A. McTeer, Christopher W. Petz, Yongjun J. Hu
  • Publication number: 20220343074
    Abstract: Embodiments of this application disclose a headword extraction method performed by a computer device. The method includes: obtaining a sentence feature of a target sentence and word features of a plurality of words in the target sentence; extracting semantics of the sentence feature of the target sentence to obtain a semantic feature of the target sentence, and extracting semantics of the word feature of each word to obtain a semantic feature of the word; obtaining a respective matching degree between the semantic feature of each of the plurality of words and the semantic feature of the target sentence; and determining, among the plurality of words in the target sentence, a word with a largest corresponding matching degree as a headword of the target sentence. The method can improve the accuracy of headwords extracted from the target sentence.
    Type: Application
    Filed: July 5, 2022
    Publication date: October 27, 2022
    Inventors: Bolun CAI, Xiaoyi Jia, Haoyu Li, Yugeng Lin, Dianping Xu, Huajie Huang, Chen Ran, Yike Liu, Lijian Mei, Zhikang Tan, Yanhua Cheng, Jinchang Xu, Minhui Wu, Mei Jiang
  • Publication number: 20220254143
    Abstract: A method includes: obtaining a first image including a target item; selecting a plurality of reference images corresponding to the first image from a database; performing word segmentation on item text information corresponding to the plurality of reference images to obtain a plurality of words; and extracting a key word meeting a reference condition from the plurality of words, and determining the extracted key word as an item name of the target item.
    Type: Application
    Filed: April 25, 2022
    Publication date: August 11, 2022
    Inventors: Yugeng LIN, Dianping XU, Bolun CAI, Yanhua CHENG, Chen RAN, Minhui WU, Mei JIANG, Yike LIU, Lijian MEI, Huajie HUANG, Xiaoyi JIA, Jinchang XU, Zhikang TAN, Haoyu LI