Abstract: A mechanism programming a direct memory access engine operating as a multithreaded processor is provided. A plurality of programs is received from a host processor in a local memory associated with the direct memory access engine. A request is received in the direct memory access engine from the host processor indicating that the plurality of programs located in the local memory is to be executed. The direct memory access engine executes two or more of the plurality of programs without intervention by a host processor. As each of the two or more of the plurality of programs completes execution, the direct memory access engine sends a completion notification to the host processor that indicates that the program has completed execution.

Abstract: A mechanism for accelerating test, debug and failure analysis of a multiprocessor device is provided. With the mechanism, on-chip trace logic is utilized to receive internal signals from logic provided in modules of the multiprocessor device. The modules are preferably copies of one another such that, given the same inputs, each module should operate in the same manner and generate the same output as long as the modules are operating properly. The modules are provided with the same inputs and the internal signals of the modules are traced using an on-chip trace bus and on-chip trace logic analyzer to perform the trace. The internal signals from one module are compared against another module so as to determine if there is any discrepancy which would indicate a fault. Additional pairs of modules may be compared to pinpoint a faulty module that is the source of the fault.

Abstract: A mechanism programming a direct memory access engine operating as a multithreaded processor is provided. A plurality of programs is received from a host processor in a local memory associated with the direct memory access engine. A request is received in the direct memory access engine from the host processor indicating that the plurality of programs located in the local memory is to be executed. The direct memory access engine executes two or more of the plurality of programs without intervention by a host processor. As each of the two or more of the plurality of programs completes execution, the direct memory access engine sends a completion notification to the host processor that indicates that the program has completed execution.

Abstract: A mechanism programming a direct memory access engine operating as a multithreaded processor is provided. A plurality of programs is received from a host processor in a local memory associated with the direct memory access engine. A request is received in the direct memory access engine from the host processor indicating that the plurality of programs located in the local memory is to be executed. The direct memory access engine executes two or more of the plurality of programs without intervention by a host processor. As each of the two or more of the plurality of programs completes execution, the direct memory access engine sends a completion notification to the host processor that indicates that the program has completed execution.

Abstract: Among other things, the disclosure is applied to a generic microprocessor architecture with a set (e.g., one or more) of controlling/main processing elements (e.g., MPEs) and a set of groups of sub-processing elements (e.g., SPEs). Under this arrangement, MPEs and SPEs are organized in a way that a smaller number MPEs control the behavior of a group of SPEs using program code embodied as a set of virtualized control threads. The apparatus includes a MCP coupled to a power supply coupled with cores to provide a supply voltage to each core (or core group) and controlling-digital elements and multiple instances of sub-processing elements. In accordance with these features, virtualized control threads can traverse the physical boundaries of the MCP to control SPE(s) (e.g., logical partitions having one or more SPEs) in a different physical partition (e.g., different from the physical partition from which the virtualized control threads originated.

Abstract: This disclosure describes an apparatus, computer architecture, method, operating system, compiler, and application program products for MPEs as well as virtualization across physical boundaries that define physical partitions in a symmetric MCP. Among other things, the disclosure is applied to a generic microprocessor architecture with a set (e.g., one or more) of controlling/main processing elements (e.g., MPEs) and a set of groups of sub-processing elements (e.g., SPEs). The arrangement also enables MPEs to delegate functionality to one or more groups of SPEs such that those group(s) of SPEs may act as pseudo MPEs. Such delegation may occur across the physical boundaries. Regardless, the pseudo MPEs may utilize pseudo virtualized control threads to control the behavior of other groups of SPEs also across physical boundaries.

Abstract: The disclosure is applied to a generic microprocessor architecture with a set (e.g., one or more) of controlling elements (e.g., MPEs) and a set of groups of sub-processing elements (e.g., SPEs). Under this arrangement, MPEs and SPEs are organized in a way that a smaller number MPEs control the behavior of a group of SPEs using program code embodied as a set of virtualized control threads. The arrangement also enables MPEs delegate functionality to one or more groups of SPEs such that those group(s) of SPEs will act as pseudo MPEs. The pseudo MPEs will utilize pseudo virtualized control threads to control the behavior of other groups of SPEs. In a typical embodiment, the apparatus includes a MCP coupled to a power supply coupled with cores to provide a supply voltage to each core (or core group) and controlling-digital elements and multiple instances of sub-processing elements.

Abstract: This invention describes an apparatus, computer architecture, method, operating system, compiler, and application program products for MPEs as well as virtualization in a symmetric MCP. The disclosure is applied to a generic microprocessor architecture with a set (e.g., one or more) of controlling elements (e.g., MPEs) and a set of groups of sub-processing elements (e.g., SPEs). Under this arrangement, MPEs and SPEs are organized in a way that a smaller number MPEs control the behavior of a group of SPEs. The apparatus enables virtualized control threads within MPEs to be assigned to different groups of SPEs for controlling the same. The apparatus further includes a MCP coupled to a power supply coupled with cores to provide a supply voltage to each core (or core group) and controlling-digital elements and multiple instances of sub-processing elements.

Abstract: A mechanism for accelerating test, debug and failure analysis of a multiprocessor device is provided. With the mechanism, on-chip trace logic is utilized to receive internal signals from logic provided in modules of the multiprocessor device. The modules are preferably copies of one another such that, given the same inputs, each module should operate in the same manner and generate the same output as long as the modules are operating properly. The modules are provided with the same inputs and the internal signals of the modules are traced using an on-chip trace bus and on-chip trace logic analyzer to perform the trace. The internal signals from one module are compared against another module so as to determine if there is any discrepancy which would indicate a fault. Additional pairs of modules may be compared to pinpoint a faulty module that is the source of the fault.

Abstract: An apparatus and method for accelerating test, debug and failure analysis of a multiprocessor device are provided. With the apparatus and method, on-chip trace logic is utilized to receive internal signals from logic provided in modules of the multiprocessor device. The modules are preferably copies of one another such that, given the same inputs, each module should operate in the same manner and generate the same output as long as the modules are operating properly. The modules are provided with the same inputs and the internal signals of the modules are traced using an on-chip trace bus and on-chip trace logic analyzer to perform the trace. The internal signals from one module are compared against another module so as to determine if there is any discrepancy which would indicate a fault. Additional pairs of modules may be compared to pinpoint a faulty module that is the source of the fault.

Abstract: An electrical structure or package, and associated method of formation. A plurality of logic chips is coupled electrically to a memory chip either through conductive members (e.g., solder balls) that interface with the memory chip and each logic chip, or through a sequential logic-to-memory electrically conductive path that includes: a first conductive member electrically coupled to a logic chip; an electrically conductive via path through a circuitized substrate; and a second conductive member electrically coupled to the memory chip. The logic chips are electrically coupled to the substrate either directly through an interfacing solder interconnection from the logic chip to the substrate, or indirectly through the memory chip such that the memory chip is electrically coupled to the substrate by an interfacing solder interconnect. The electrical structure may be plugged into a socket of a backplane of a circuit card.

Abstract: An electrical structure or package, and associated method of formation. A plurality of logic chips is coupled electrically to a memory chip either through conductive members (e.g., solder balls) that interface with the memory chip and each logic chip, or through a sequential logic-to-memory electrically conductive path that includes: a first conductive member electrically coupled to a logic chip; an electrically conductive via path through a circuitized substrate; and a second conductive member electrically coupled to the memory chip. The logic chips are electrically coupled to the substrate either directly through an interfacing solder interconnection from the logic chip to the substrate, or indirectly through the memory chip such that the memory chip is electrically coupled to the substrate by an interfacing solder interconnect. The electrical structure may be plugged into a socket of a backplane of a circuit card.

Abstract: An electrical structure or package, and associated method of formation. A plurality of logic chips is coupled electrically to a memory chip either through conductive members (e.g., solder balls) that interface with the memory chip and each logic chip, or through a sequential logic-to-memory electrically conductive path that includes: a first conductive member electrically coupled to a logic chip; an electrically conductive via path through a circuitized substrate; and a second conductive member electrically coupled to the memory chip. The logic chips are electrically coupled to the substrate either directly through an interfacing solder interconnection from the logic chip to the substrate, or indirectly through the memory chip such that the memory chip is electrically coupled to the substrate by an interfacing solder interconnect. The electrical structure may be plugged into a socket of a backplane of a circuit card.