Abstract: Antimycorbacterial compositions are disclosed comprising at least one hydroxamate or at least one hydroxamate and at least one hydroxylamine. The preferred ratio of hydroxamate to hydroxylamines is about 100:1 to about 1:1. A method for inhibiting mycobacterial growth is also disclosed comprising the step of administering the compositions of this invention to an animal including a human.

Abstract: Antimycorbacterial compositions are disclosed comprising at least one hydroxamate or at least one hydroxamate and at least one hydroxylamine. The preferred ratio of hydroxamate to hydroxylamines is about 100:1 to about 1:1. A method for inhibiting mycobacterial growth is also disclosed comprising the step of administering the compositions of this invention to an animal including a human.

Abstract: Rho is an enzyme essential for the growth and survival of Escherichia coli, and bicyclomycin is its only known selective inhibitor. The site and pathway of rho inhibition by the putative metal thiol chelates are disclosed. Additionally compositions and methods of divalent metals and compounds containing a thiol group are disclosed.

Abstract: The present invention discloses novel cholinergic receptor ligands. The present invention also relates to the synthesis of substituted derivatives of aza-bridged bicyclic amines for use as muscarinic receptor ligands as well as methods of regulating function of certain cholinergic receptors, and hence acting as antagonists, agonists and partial agonists at certain specific cholinergic receptor subtypes. The present invention also relates to methods for treating disorders associated with cholinergic receptors.

Abstract: The present invention discloses novel cholinergic receptor ligands. The present invention also relates to the synthesis of substituted derivatives of aza-bridged bicyclic amines for use as muscarinic receptor ligands as well as methods of regulating function of certain cholinergic receptors, and hence acting as antagonists, agonists and partial agonists at certain specific cholinergic receptor subtypes. The present invention also relates to methods for treating disorders associated with cholinergic receptors.

Abstract: The present invention discloses novel cholinergic receptor ligands. The present invention also relates to the synthesis of substituted derivatives of aza-bridged bicyclic amines for use as muscarinic receptor ligands as well as methods of regulating function of certain cholinergic receptors, and hence acting as antagonists, agonists and partial agonists at certain specific cholinergic receptor subtypes. The present invention also relates to methods for treating disorders associated with cholinergic receptors.

Abstract: The present invention is directed to N-benzyl-2-amino-3-methoxypropionamide and stereoisomers the use thereof anti-convulsant and an intermediate in the preparation of other anti-convulsants.

Abstract: The present invention is directed to a compound of the following formula: ##STR1## pharmaceutical compositions containing the same and the use thereof as an anticonvulsant.

Abstract: A modular structure for providing electrical interconnections achieves greatly increased wiring density by forming vias and wiring patterns by chemical (e.g. lithographic) processes rather than by mechanical processes such as punching of vias and screening patterns of conductive paste. A basic module is a power core comprising an apertured metallic foil with an insulator applied to surfaces thereof, extending through at least one aperture and exposing the metallic foil in at least one aperture. The foil in the power core provides stiffness to facilitate subsequent handling and electrical shielding between conductive layers as well as a potential power connection. Via connections of increased conductivity and robustness are formed by plating the interior of vias after lamination of a desired combination of power cores and signal cores.

Abstract: The present invention is directed to a compound in the R configuration about the asymmetric carbon in the following formula: ##STR1## pharmaceutical compositions containing same and the use thereof in treating CNS disorders in animals.

Abstract: Rectangular preforms are vacuum picked and placed in each cavity of a first holder, and a measured amount of no-clean flux liquid is dispensed onto each preform, then a second holder is placed in an inverted position on top of the first holder and the holders are flipped so that the dry side of the preform is exposed and then a measured amount of no-clean solder is dispensed on the dry side of the preform. A robot arm with a rubber tipped vacuum probe picks up the preforms without damage or contamination and places them on a circuit board, grippers of the robot arm pick up and position a component on an induction coil to heat it up sufficient for reflow soldering, and then move the component onto the preform on the circuit board for reflow soldering. The circuit board can be used without cleaning with solvents or CFC's, thus reducing process steps and reducing environmental hazards.

Abstract: Rectangular preforms are vacuum picked and placed in each cavity of a first holder, and a measured amount of no-clean flux liquid is dispensed onto each preform, then a second holder is placed in an inverted position (upside-down) on top of the first holder and the holders are flipped so that the dry side of the preform is exposed and then a measured amount of no-clean solder is dispensed on the dry side of the preform. The holders are unstacked and positioned on different sized posts extending upward from a pick-and-place machine. A robot arm with a rubber tipped vacuum probe picks up the preforms without damage or contamination and places them on a circuit board, grippers of the robot arm pick up and position a component on an induction coil to heat it up sufficient for reflow soldering, and then move the component onto the preform on the circuit board for reflow soldering.

Abstract: Ten holders containing preforms are stacked on a rectangular bottom frame with different sized threaded posts of the bottom frame extending up through the hole and slot in opposite corners of each holder. An empty holder and then a dust cover with apertures at opposite corners are similarly stacked on the bottom frame to hold and protect the preforms. A top frame with apertures at opposite corners is positioned on the posts. The stack is compressed between the top frame and the bottom frame by screwing nuts onto the threaded posts to form a carrier in which the cavities are sized relative to the preforms to hold the preforms in position during transport to a pick-and-place machine without contaminating or damaging the delicate coating of dry flux. The holders are unstacked and positioned on different sized posts extending upward from a pick-and-place machine.

Abstract: A multi-layer printed circuit board or card including a plurality of circuitized power cores, the circuitized power cores include a layer of an electrically conductive material having a layer of electrically insulating material attached on both sides thereof. The circuitized power cores also include a plurality of plated through holes formed therethrough in substantially the same pattern on each circuitized power core. The circuitized power cores are parallel to each other such that corresponding plated through holes in the two circuitized power cores are co-linear. A plurality of substantially spherical balls are located between the circuitized power cores and are in contact with the corresponding plated through holes on facing cards. The balls have a diameter slightly larger than the opening of the plated through holes and are made of an electrically conductive material.

Abstract: Disclosed is a method for manufacturing a stacked circuitized flex structure. The structure is a laminate for Z-axis communication within a parallel processor. This laminate portion provides XY plane and Z-axis interconnection for inter-processor, inter-memory, inter-processor/memory element, and processor to memory bussing interconnection, and communication. Z-axis circuitization is carried out by providing vias and through holes in individual circuitized flex strips. These vias and through holes are circuited and plated. This is followed by filling the vias and through holes with solder and forming solder bumps at the tops and bottoms of the vias and through holes. A sticker sheet with clearance holes for the solder bumps is provided, and a plurality of the circuitized flex strips are laid up for lamination to form a stack of circuitized flexible strips.

Abstract: Clear thermoplastic is vacuum molded to produce rectangular, frustro-pyramidal shaped cavities in a horizontal matrix for holding rectangular solder preforms. No-clean flux liquid is dispensed onto a preform placed in each cavity, then another holder is placed upside-down on the first holder, the holders are flipped and then no-clean flux liquid is dispensed on the dry side of the preform. Holes in the cavity bottoms drain and circulate drying air to the preform bottoms. A hole in one corner and a different width slot in an opposite corner of each holder, allow multiple holders to be stacked on a bottom frame with different sized threaded posts. An empty holder and then a dust cover are stacked on the posts to hold and protect the preforms. A top frame is stacked on the posts and nuts are screwed onto the posts to form a carrier. The cavities are sized relative to the preforms to hold the preforms in position during carrier transport.

Abstract: Method and apparatus are disclosed for mounting a flexible film semiconductor chip carrier on a second level electronic package. The resulting electronic packaging structure includes electrically conductive spacers, such as solder balls or solder coated copper balls, which electrically interconnect outer lead bonding pads on the flexible film semiconductor chip carrier and corresponding bonding pads on the second level electronic package, and which physically support the flexible film of the semiconductor chip carrier substantially in a plane above the surface of the second level electronic package. This electronic packaging structure is made using a special assembly fixture comprising a base plate, a pressure insert with a resilient member, and a top plate. The flexible film semiconductor chip carrier with the spacers attached thereto is placed over the resilient member of the pressure insert which is clamped together with the second level electronic package between the top and base plates.

Abstract: An electrical assembly which includes a first circuit member (e.g., TCM) with at least one conductive pin projecting therefrom for being frictionally and electrically engaged by a flexible portion of circuit means of a second circuit member (e.g., PCB). An opening is provided within the PCB relative to the flexible portions such that these portions project at least partly across the opening and frictionally engage respective conductive portions of the pin when inserted within the opening. Each of these flexible portions in turn is part of a circuit layer which may be coupled to respective conductive planes or the like within the PCB, while the respective conductive portions of the pin may in turn be electrically coupled to various conductive layers within/upon the TCM.

Abstract: Method and apparatus are disclosed for mounting a flexible film semiconductor chip carrier on a second level electronic package. The resulting electronic packaging structure includes electrically conductive spacers, such as solder balls or solder coated copper balls, which electrically interconnect outer lead bonding pads on the flexible film semiconductor chip carrier and corresponding bonding pads on the second level electronic package, and which physically support the flexible film of the semiconductor chip carrier substantially in a plane above the surface of the second level electronic package. This electronic packaging structure is made using a special assembly fixture comprising a base plate, a pressure insert with a resilient member, and a top plate. The flexible film semiconductor chip carrier with the spacers attached thereto is placed over the resilient member of the pressure insert which is clamped together with the second level electronic package between the top and base plates.

Abstract: The present invention is directed to a compound in the R configuration about the asymmetric carbon in the following formula: pharmaceutical compositions containing same and the use thereof in treating CNS disorders in animals.