Abstract: Method and apparatus are disclosed for mounting a flexible film semiconductor chip carrier on a second level electronic package. The resulting electronic packaging structure includes electrically conductive spacers, such as solder balls or solder coated copper balls, which electrically interconnect outer lead bonding pads on the flexible film semiconductor chip carrier and corresponding bonding pads on the second level electronic package, and which physically support the flexible film of the semiconductor chip carrier substantially in a plane above the surface of the second level electronic package. This electronic packaging structure is made using a special assembly fixture comprising a base plate, a pressure insert with a resilient member, and a top plate. The flexible film semiconductor chip carrier with the spacers attached thereto is placed over the resilient member of the pressure insert which is clamped together with the second level electronic package between the top and base plates.

Abstract: Apparatus for applying solder paste to printed circuit boards ("PCB's") in a continuous operation. A drum containing solder paste is positioned over a work station and has an outlet slot through which the solder paste can be discharged onto the surface of a PCB as it advances through the work station. A stencil formed with a desired pattern for application of the solder paste to the PCB is rotatably mounted on the outer surface of the drum and overlies the outlet slot. Gravity, machine vibration, and, if desired, air pressure are effective to discharge the solder paste onto the PCB with the aid of a resilient squeegee pad adjacent the outlet slot. A drive mechanism directly couples the translational movement of the PCB through the work station with the rotational movement of the stencil at the work station.

Abstract: Stripping and cutting apparatus in which a pair of disc cutters are affixed on a common rotatable shaft that is pivotably mounted to a rotating head. An object having an inner core member and an outer concentric member, which in the preferred embodiment is insulated conductive tubing, is advanced through a central opening in the head. The speed of the head is controlled so that at one speed the shaft is centripetally pivoted to an inner radial position that causes the closest of the cutters to block the leading end of the object, and so that at another faster speed the shaft is centrifugally pivoted to an outer radial position which removes the particular cutter from the blocking relationship with the leading end of the object thereby allowing the object to be advanced past the remote cutter for a predetermined distance, and so that at another speed, which is less than the last mentioned speed, the shaft is centripetally pivoted inward to provide concurrent cutting of the object by the two disc cutters.

Abstract: Multiple pins are affixed in the holes of a ceramic substrate by simultaneously impacting the pins with a piston assembly which temporarily places the pins in a viscoelastic fluid state. Upon return of the pins and the resultant fluid flow to its undisturbed solid state, each pin is left with an extension that is in interlocking engaged relationship with the ceramic particles of the substrate in the region surrounding the particular holes in which the pins have been located.The piston assembly is driven by a pneumatic high pressure system which is adjustable to the number of pins being simultaneously impacted. Release of the piston assembly is delayed until the air pressure becomes stabilized prior to impact. A vacuum pressure system returns the piston to its originating position after impact whereupon the piston assembly is ready for the next impact cycle.