Patents by Inventor Harold Miyamura

Harold Miyamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12245405
    Abstract: A system comprising an adapter plate to couple a plurality of different types of cooling manifolds to one or more racks in a datacenter is disclosed. Additionally, a system comprising an adapter plate to adaptively couple a cooling manifold to a plurality of different types of server racks is disclosed.
    Type: Grant
    Filed: May 30, 2023
    Date of Patent: March 4, 2025
    Assignee: Nvidia Corporation
    Inventors: Harold Miyamura, Jeremy Rodriguez, Ali Heydari
  • Patent number: 11882678
    Abstract: A redundancy shut-off system for a datacenter liquid cooling system is disclosed. The redundancy shut-off system has a first ball valve located above a datacenter platform and coupling between a row manifold of a secondary cooling loop and a rack manifold of a rack, where the first ball valve provides redundancy to a second ball valve located below the datacenter platform.
    Type: Grant
    Filed: August 4, 2020
    Date of Patent: January 23, 2024
    Assignee: Nvidia Corporation
    Inventors: Harold Miyamura, Jeremy Rodriguez, Alexander Ishii, Alex Naderi, Ali Heydari
  • Patent number: 11864359
    Abstract: A remediation system for threshold leaks in a datacenter liquid cooling system is disclosed. The system includes a fluid controller and a power controller that are adapted to receive input from a learning subsystem that can determine that a threshold leak has occurred even though a computing component is functioning normally, so that a change in power state to reduce reliance on the coolant and so that a change of flow of the coolant may be effected.
    Type: Grant
    Filed: August 27, 2020
    Date of Patent: January 2, 2024
    Assignee: Nvidia Corporation
    Inventors: Ali Heydari, Mike Sabotta, Harold Miyamura
  • Publication number: 20230301034
    Abstract: A system comprising an adapter plate to couple a plurality of different types of cooling manifolds to one or more racks in a datacenter is disclosed. Additionally, a system comprising an adapter plate to adaptively couple a cooling manifold to a plurality of different types of server racks is disclosed.
    Type: Application
    Filed: May 30, 2023
    Publication date: September 21, 2023
    Inventors: Harold Miyamura, Jeremy Rodriguez, Ali Heydari
  • Patent number: 11700713
    Abstract: An adapter plate and a fastening system for fastening a manifold to a rack in a datacenter is disclosed. The adapter plate is associated with the manifold and has holes to receive buttons in configurable positions. The configurable positions enable the buttons to mate with keyholes of a bracket of the rack in order to fasten the manifold to the bracket.
    Type: Grant
    Filed: July 8, 2020
    Date of Patent: July 11, 2023
    Assignee: NVIDIA Corporation
    Inventors: Harold Miyamura, Jeremy Rodriguez, Ali Heydari
  • Publication number: 20220071049
    Abstract: A remediation system for threshold leaks in a datacenter liquid cooling system is disclosed. The system includes a fluid controller and a power controller that are adapted to receive input from a learning subsystem that can determine that a threshold leak has occurred even though a computing component is functioning normally, so that a change in power state to reduce reliance on the coolant and so that a change of flow of the coolant may be effected.
    Type: Application
    Filed: August 27, 2020
    Publication date: March 3, 2022
    Inventors: Ali Heydari, Mike Sabotta, Harold Miyamura
  • Publication number: 20220046828
    Abstract: A redundancy shut-off system for a datacenter liquid cooling system is disclosed. The redundancy shut-off system has a first ball valve located above a datacenter platform and coupling between a row manifold of a secondary cooling loop and a rack manifold of a rack, where the first ball valve provides redundancy to a second ball valve located below the datacenter platform.
    Type: Application
    Filed: August 4, 2020
    Publication date: February 10, 2022
    Inventors: Harold Miyamura, Jeremy Rodriguez, Alexander Ishii, Alex Naderi, Ali Heydari
  • Publication number: 20220015270
    Abstract: An adapter plate and a fastening system for fastening a manifold to a rack in a datacenter is disclosed. The adapter plate is associated with the manifold and has holes to receive buttons in configurable positions. The configurable positions enable the buttons to mate with keyholes of a bracket of the rack in order to fasten the manifold to the bracket.
    Type: Application
    Filed: July 8, 2020
    Publication date: January 13, 2022
    Inventors: Harold Miyamura, Jeremy Rodriguez, Ali Heydari
  • Patent number: 10820447
    Abstract: A liquid immersion cooling system can include a tank having an upward facing opening at a top portion of the tank. A mounting mechanism fixes one or more electronic components to an interior of the tank. A bus bar assembly is located at the top portion of the tank, the bus bar assembly having a shield that covers one or more bus bars of the bus bar assembly from above. Power terminals of each of the one or more electronic components engage with the one or more bus bars of the bus bar assembly from below.
    Type: Grant
    Filed: September 30, 2019
    Date of Patent: October 27, 2020
    Assignee: BAIDU USA LLC
    Inventors: Harold Miyamura, Tianyi Gao
  • Patent number: 10791647
    Abstract: A liquid immersion cooling systems can include an immersion tank for housing cooling liquid, and a carrier tray. The carrier tray can include a mounting mechanism to attach one or more electronic components to the carrier tray, one or more handles, and one or more extendable sliders, each having a first connection to the carrier tray and a second connection to the immersion tank. The immersion tank can have an opening that faces upward. In a first position of the one or more extendable sliders, the carrier tray is within the immersion tank, and in a second position of the one or more extendable sliders, the carrier tray is vertically lifted out of the opening of the immersion tank.
    Type: Grant
    Filed: June 28, 2019
    Date of Patent: September 29, 2020
    Assignee: BAIDU USA LLC
    Inventors: Harold Miyamura, Tianyi Gao
  • Patent number: 7542296
    Abstract: A system of keying implementation for swapping paired devices is provided. The system includes a controller module having a first keying member, a power supply unit having a second keying member, and a chassis having a plurality of receiving slots for receiving the controller module and the power supply unit. When the controller module and the power supply unit are a matched pair and when the controller module and the power supply unit are fully inserted, next to each other, into the plurality of receiving slots, the first keying member and the second keying member do not interfere with each other so that the power supply unit may supply power to the controller module.
    Type: Grant
    Filed: November 16, 2005
    Date of Patent: June 2, 2009
    Assignee: Network Appliance, Inc.
    Inventors: David J. Baik, George Feltovich, Brad Reger, David Willheim, Harold Miyamura
  • Patent number: 7389599
    Abstract: In one embodiment, there is shown a system and method of allowing a user to gain access to information pertaining to certain equipment by pulling a label out of an opening in a surface of the equipment, viewing information on the label; and pushing the label back into the opening. In a further embodiment, the label is captive to the equipment independent from a bezel surrounding the equipment. In a still further embodiment of the invention, the label has on it pre-established information pertaining to the equipment, as well as user added information.
    Type: Grant
    Filed: February 12, 2003
    Date of Patent: June 24, 2008
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: David S. Hishinuma, Ken G. Robertson, Dustin Rosing, Richard W. Davis, Harold Miyamura, Jorge E. Rocabado
  • Patent number: 7379303
    Abstract: A computing device module for receipt within a computing device chassis includes an enclosure and a handle movably coupled to the enclosure. The handle moves between an extended position and a retracted position. The handle includes at least one opening configured to permit at least one hand digit to extend through the at least one opening when the handle is in the retracted position.
    Type: Grant
    Filed: October 22, 2003
    Date of Patent: May 27, 2008
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Harold Miyamura, Michael Leslie Wortman
  • Patent number: 7312999
    Abstract: The present invention is an apparatus for supporting the dense integration of a plurality of multi-drive modules. A chassis assembly of the present invention may house a plurality of multi-drive modules whereby each multi-drive module may house multiple drives. Each multi-drive module may be easily removed from the chassis for reduced serviceability time. Each drive may be housed within a carrier assembly, the carrier assembly being easily removed from the multi-drive module of the present invention. Advantageously, a dense integration of drives may be achieved while providing proper ventilation and vibration dampening.
    Type: Grant
    Filed: April 29, 2005
    Date of Patent: December 25, 2007
    Assignee: Network Appliance, Inc.
    Inventors: Harold Miyamura, Marc Moisson, Salvatore Bondi, David J. Baik, David Willheim
  • Patent number: 7143819
    Abstract: A heat sink comprises a base having a substantially flat region for interfacing with an electronic component, and at least one heat pipe having a first region substantially parallel to the flat region of the base and a second region substantially perpendicular to the flat region of the base. By providing a heat pipe in a heat sink that is L-shaped or U-shaped, a greater portion of the heat pipe is in contact with the heat-generating electronic component. As a result, thermal efficiency increases because there is more direct contact with the heat pipe.
    Type: Grant
    Filed: September 17, 2002
    Date of Patent: December 5, 2006
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Christopher G. Malone, Harold Miyamura
  • Patent number: 7140422
    Abstract: A heat sink includes a heat pipe and a base adapted to allow the heat pipe to directly contact a component. By directly contacting the component, thermal efficiency is increased. Furthermore, increasing the surface area of the heat pipe that is in direct contact with the component also increases thermal efficiency.
    Type: Grant
    Filed: September 17, 2002
    Date of Patent: November 28, 2006
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Christopher G. Malone, Harold Miyamura
  • Patent number: 6992893
    Abstract: An apparatus in one example comprises one or more adhesives that serve to provide at least primary attachment of a heat sink with one or more electrical components coupled with a circuit board.
    Type: Grant
    Filed: January 10, 2003
    Date of Patent: January 31, 2006
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Harold Miyamura, Rong-Che Chen
  • Publication number: 20050088825
    Abstract: A computing device module for receipt within a computing device chassis includes an enclosure and a handle movably coupled to the enclosure. The handle moves between an extended position and a retracted position. The handle includes at least one opening configured to permit at least one hand digit to extend through the at least one opening when the handle is in the retracted position.
    Type: Application
    Filed: October 22, 2003
    Publication date: April 28, 2005
    Inventors: Harold Miyamura, Michael Wortman
  • Publication number: 20040154197
    Abstract: In one embodiment, there is shown a system and method of allowing a user to gain access to information pertaining to certain equipment by pulling a label out of an opening in a surface of the equipment, viewing information on the label; and pushing the label back into the opening. In a further embodiment, the label is captive to the equipment independent from a bezel surrounding the equipment. In a still further embodiment of the invention, the label has on it pre-established information pertaining to the equipment, as well as user added information.
    Type: Application
    Filed: February 12, 2003
    Publication date: August 12, 2004
    Inventors: David S. Hishinuma, Ken G. Robertson, Dustin Rosing, Richard W. Davis, Harold Miyamura, Jorge E. Rocabado
  • Patent number: D546827
    Type: Grant
    Filed: May 21, 2003
    Date of Patent: July 17, 2007
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Kenneth G. Robertson, Richard W. Davis, Harold Miyamura