Abstract: A self-correcting wave soldering machine for soldering a RGB in an SMT manufacturing system. The wave soldering machine includes at least one thermal infrared camera that generates thermal images of the RGB so as to provide thermal imaging processing to monitor, characterize and predict processing temperatures. The wave soldering machine generates a heat map using the thermal images and compares the heat map to a thermal gradient to provide real time profiling by digitally connecting it to heating and other mechanically controlled systems, such as flux dispensing, conveyor speed and parallelism of the wave soldering machine.

Abstract: A reflow soldering oven for soldering and/or bonding component leads both electrically and mechanically to pads on a PCB in an SMT manufacturing system. The soldering oven includes at least one thermal infrared camera that generates thermal images of the PCB to provide thermal imaging processing to monitor and correct temperature deviations in real time. The oven generates a heat map using the thermal images and compares the heat map to a thermal gradient to provide real time profiling and to initiate changes like temperature control or the oven belt-speed monitoring to offer self-correcting capabilities.

Abstract: An AI enhanced self-correcting and closed loop SMT manufacturing system for fabricating PCBAs. The system includes a screen printer for depositing solder paste on solder pads on a RGB, an SRI sub-system for inspecting the solder paste deposited on the PCB to identify defects, a pick-and-place machine for placing circuit components on the solder paste, an AOI sub-system for inspecting the PCB after the circuit components are placed on the PCB, and a reflow soldering oven for bonding component leads both electrically and mechanically to the pads on the PCB. An AI/ML analysis engine is responsive to process data and variables from each of the screen printer, the SPI sub-system, the pick-and-place machine, the AOI sub-system and the reflow soldering oven and provides downstream feedback signals to each of the screen printer, the SPI sub-system, the pick-and-place machine, the AOI sub-system and the reflow soldering oven for self-correction purposes.

Abstract: A reciprocating conveyor includes a first carrier that is slidably mounted on a first sliding rail mechanism, a sliding seat that is slidably mounted on a second sliding rail mechanism and that is situated below the first carrier, and a second carrier that is connected to the sliding seat, that is movable upwardly and downwardly relative to sliding seat, and that has a slide protrusion slidably engaging with a guiding rail. When the first and second carriers are respectively at a first location and a second location, the second carrier is movable through a dodging location that is lower than the first and second locations, via sliding engagement between the slide protrusion and the guiding rail, to the first location, thereby driving the first carrier to simultaneously move, via a linkage unit, to the second location.

Abstract: A container feeding device includes a casing and first and second latch members. The casing defines a lower retaining space for receiving a plurality of containers that are stacked on one another. The first latch member is operable to enter the lower retaining space for supporting a bottommost container, or leave the lower retaining space to release the bottommost container. The second latch member enters the lower retaining space to support a second bottommost container when the bottommost container is released by the first latch member.

Abstract: A tool set includes a tool holder, a tool and a tool rack. The tool has a groove unit. The tool holder has a latch unit that engages the groove unit. The tool rack includes a rack body and a blocking member. When the tool holder is moved away from the rack body after the tool is moved into the rack body by the tool holder and after the blocking member moves to a blocking position, the tool is blocked by the blocking member so that the latch unit is separated from the groove unit and that the tool holder is separated from the tool.

Abstract: A mounting frame for being mounted with either one of first and second screwdrivers, includes a main frame, a mounting seat, and first and second mounting plates. The mounting seat has a plate attachment hole set. The first mounting plate has a first seat attachment hole set operable to be connected to the plate attachment hole set, and a first driver attachment hole set for the first screwdriver to be attached thereto. The second mounting plate has a second seat attachment hole set operable to be connected to the plate attachment hole set, and a second driver attachment hole set for the second screwdriver to be attached thereto.

Abstract: Support blocks for printed circuit boards (PCB's) and printed circuit board assemblies (PCBA's), wherein the support blocks are produced from a 3D printing process. The support block including a bottom surface having a vacuum connection; a top surface having at least one vacuum hole; at least one recessed surface that is offset from the top surface; and at least one vacuum channel extending from the vacuum connection to the at least one vacuum hole.

Abstract: Support blocks for printed circuit boards (PCB's) and printed circuit board assemblies (PCBA's), wherein the support blocks are produced from a 3D printing process. The support block including a bottom surface having a vacuum connection; a top surface having at least one vacuum hole; at least one recessed surface that is offset from the top surface; and at least one vacuum channel extending from the vacuum connection to the at least one vacuum hole.

Abstract: Support blocks for printed circuit boards (PCB's) and printed circuit board assemblies (PCBA's), wherein the support blocks are produced from a 3D printing process. The support block including a bottom surface having a vacuum connection; a top surface having at least one vacuum hole; at least one recessed surface that is offset from the top surface; and at least one vacuum channel extending from the vacuum connection to the at least one vacuum hole.

Abstract: Support blocks for printed circuit boards (PCB's) and printed circuit board assemblies (PCBA's), wherein the support blocks are produced from a 3D printing process. The support block including a bottom surface having a vacuum connection; a top surface having at least one vacuum hole; at least one recessed surface that is offset from the top surface; and at least one vacuum channel extending from the vacuum connection to the at least one vacuum hole.

Abstract: Support blocks for printed circuit boards (PCB's) and printed circuit board assemblies (PCBA's), wherein the support blocks are produced from a 3D printing process. The support block including a bottom surface having a vacuum connection; a top surface having at least one vacuum hole; at least one recessed surface that is offset from the top surface; and at least one vacuum channel extending from the vacuum connection to the at least one vacuum hole.

Abstract: Support blocks for printed circuit boards (PCB's) and printed circuit board assemblies (PCBA's), wherein the support blocks are produced from a 3D printing process. The support block including a bottom surface having a vacuum connection; a top surface having at least one vacuum hole; at least one recessed surface that is offset from the top surface; and at least one vacuum channel extending from the vacuum connection to the at least one vacuum hole.

Abstract: A ball grid array (BGA) including at least one BGA chip and a plurality of solder balls directly connected to a substrate, such as a printed circuit board (PCB), where the solder balls include an epoxy. A method for producing a BGA package including providing a BGA having a plurality of epoxy-containing solder balls, positioning the BGA on a substrate, such as a PCB, and applying heat to reflow the epoxy-containing solder balls and to create a connection between the BGA and the PCB.

Abstract: Support blocks for printed circuit boards (PCB's) and printed circuit board assemblies (PCBA's), wherein the support blocks are produced from a 3D printing process. The support block including a bottom surface having a vacuum connection; a top surface having at least one vacuum hole; at least one recessed surface that is offset from the top surface; and at least one vacuum channel extending from the vacuum connection to the at least one vacuum hole.

Abstract: Methods and apparatus for implementing optical chains, e.g., camera modules, which can be used in a camera device are described as well as camera devices including multiple camera modules. In various embodiments one or more camera modules include mirror assemblies which support a movable mirror. The mirror is driven in some embodiments by a linear actuator, e.g., piezo electric actuator with the linear motion of the actuator's push rod being converted into angular mirror rotation by use of hinge, e.g., pivot on which the mirror is mounted. A return spring provide a force contrary to that provided by the actuator. A recess is included in a mounting board to allow the bottom of the mirror or a portion of the mirror mounting hinge to be placed below the surface of the mounting board to which the camera module is secured.

Abstract: An exemplary camera calibration apparatus includes a movable, e.g., rotatable, support structure which is controllably positioned to allow for image capture of different test patterns and image capture of the same pattern at different distances by a mounted camera. A first test pattern is mounted on a wall, e.g., a pyramid shaped 4 sided wall formed by panels surrounding the camera under calibration. The movable support structure has a first mirror attached to a first side and has a second test pattern attached to a second side. A second mirror mounted on an internal sidewall of the calibration apparatus housing facilities a different image path distance between the camera capturing the image of the first test pattern and the first test pattern. The exemplary camera calibration apparatus is well suited for efficiently calibrating camera devices including a plurality of camera modules, e.g., optical chains, in a relatively small area.

Abstract: Methods and apparatus for implementing optical chains, e.g., camera modules, which can be used in a camera device are described as well as camera devices including multiple camera modules. In various embodiments one or more camera modules include mirror assemblies which support a movable mirror. The mirror is driven in some embodiments by a linear actuator, e.g., piezo electric actuator with the linear motion of the actuator's push rod being converted into angular mirror rotation by use of hinge, e.g., pivot on which the mirror is mounted. A return spring provide a force contrary to that provided by the actuator. A recess is included in a mounting board to allow the bottom of the mirror or a portion of the mirror mounting hinge to be placed below the surface of the mounting board to which the camera module is secured.

Abstract: Methods and apparatus, for mounting and using a filter over an image sensor are described as well as camera modules and apparatus incorporating the filter mount. Also described is a sensor and filter assembly which can be formed by combining the sensor, filter, filter mount, and a mounting board which can be shipped and integrated into a camera module and/or camera. A filter is placed in a filter well of a filter mount. By using a well to support the filter over a sensor, the top of the filter can be level or below the top of sidewalls of the filter mount. Use of a well to mount the filter reduces the risk of stray or unintentionally reflected light reaching the sensor and degrading captured images while protecting the filter from downward pressure or sideways contact.

Abstract: Methods and apparatus for implementing optical chains, e.g., camera modules, which can be used in a camera device are described as well as camera devices including multiple camera modules. In various embodiments one or more camera modules include mirror assemblies which support a movable mirror. The mirror is driven in some embodiments by a linear actuator, e.g., piezo electric actuator with the linear motion of the actuator's push rod being converted into angular mirror rotation by use of hinge, e.g., pivot on which the mirror is mounted. A return spring provide a force contrary to that provided by the actuator. A recess is included in a mounting board to allow the bottom of the mirror or a portion of the mirror mounting hinge to be placed below the surface of the mounting board to which the camera module is secured.