Abstract: A technique for assembling camera modules that includes attaching optical elements, such as an optics stack, directly to the upper surface of an image sensor. A housing may be provided to partially surrounded the optics stack. Alternatively, the housing can be provided by a transfer molding process. This technique can be applied in array processing scenario and solder balls can be attached to the bottom of the image sensor to provide an efficiently-produced and low cost camera module.

Abstract: A disclosed example camera module includes a substrate, an integrated circuit image capture device (ICD) mounted on the substrate, the image capture device having an array of light sensors on its top surface, a first lens unit rigidly fixed to the top surface of the image capture device, a second lens unit, and a lens actuator mounted on the substrate. The lens actuator adjustably supports the second lens unit over the first lens unit. The first lens unit includes a stacked plurality of lenses. Optionally, the second lens unit also includes a stacked plurality of lenses. Movement of the second lens unit with respect to the first lens unit provides a focus and/or zoom function.

Abstract: A method includes forming optical lenses on an ICD at the wafer level, rather than attaching a separate lens assembly. The lenses may be formed as an array of individual lenses or as multiple, e.g., two, arrays of individual lenses. The array of lenses may be coupled to an array of ICDs. The ICDs and individual lenses in the array assembly may be singulated to form individual digital camera modules. Additionally or alternatively, the ICDs and individual lenses may be singulated in separate steps.

Abstract: A digital camera module includes an image capture device mounted on a flexible circuit substrate. In one embodiment of the digital camera module, the image capture device is mounted directly (e.g., by an adhesive) on the flexible circuit substrate. A stiffener (e.g., a piece of circuit board material) is mounted to the back of the flexible circuit substrate to support wire bonding of the image capture device onto the flexible circuit substrate and/or to support the mounting of additional components (e.g., a lens housing).