Abstract: An integrated circuit (chip) with attachment elements for attaching of the chip on a carrier, the attachment elements being designed in a way such that they can enter into a releasable connection with corresponding attachment elements formed on the carrier. To keep the package size of the chips as small as possible, the attachment elements are arranged directly on the unpackaged chip.

Abstract: The invention relates to the laser adjustment or laser programming of laser fuses of an integrated circuit (2) on a chip (1), with laser light (7), the integrated circuit (2) having a plurality of laser fuses (3) and being connected to a plurality of contact pads (4) on the chip (1), and the chip (1) being covered with a polymer layer (5) which has at least windows (16) on the plurality of contact pads, and comprising at least one wiring interconnect (9) on the polymer layer (5) which is electrically connected to at least one of the plurality of contact pads (4) and ends at a predetermined location on a surface of the chip (1).

Abstract: A lowermost layer of control chips carries on it layers of memory chips. The memory chips are contacted via looped-through contacts that reach from one side of the other side of the memory chips and they are driven by the control chips that contain the test circuit for the memory chips.

Abstract: An electronic structure includes an electronic component, which is configured to be in electric contact with a base and has a mounting side configured for mounting onto the base. The structure also includes a raised elastic support positioned on the component and multiple contacts positioned on the component, with at least one contact also being positioned on the support.

Abstract: An electronic component includes a semiconductor chip with an active front face and a passive rear face, with contact connections and contact surfaces respectively being provided on the active front face and/or on the passive rear face, and with conductive connections being provided in the form of structured conductive tracks for providing an electrical connection from the active front face to the passive rear face. An electronic assembly formed of stacked semiconductor chips, and a method for producing the electronic component and the electronic assembly are also provided.

Abstract: A configuration and also a method for the configuration in which, the configuration has at least one electronic device with associated contact connections and at least one printed circuit board with external contacts. The printed circuit board is electrically coupled to the electronic device. At least the metallic surfaces of the configuration are covered by a plasma-polymerized polymer layer.

Abstract: An electronic component includes a semiconductor chip that has an active upper side with integrated circuits and a passive rear side. The rear side and the side border regions of the semiconductor chip also form the outer package sides of the electronic component. At least the corner regions and the edge regions of the rear side and the side border regions of the semiconductor chip have a plastic coating with a thickness in the micrometer range. Furthermore, the invention relates to a method of producing such an electronic component.

Abstract: An electronic configuration has a first surface with electrical contacts for electrical bonding. The configuration includes at least one flexible elevation made of an insulating material that is arranged on the first surface. The flexible elevation has at least one recess and the surface of the flexible recess is at least partially covered with an electrically conductive material to form one of the electrical contacts.

Abstract: An electronic component with an electronic circuit and electrical contacts, disposed at least on a first surface of the electronic component, for the electrical bonding of the electronic circuit includes at least one flexible elevation of an insulating material disposed on the first surface, at least one electrical contact disposed on the flexible elevation, and a conduction path disposed on the surface or in the interior of the flexible elevation between the electrical contact and the electronic circuit. A method for producing the electronic component is also provided.

Abstract: A method for producing an electrical connection between front and rear sides of semiconductor chips in the wafer process.